Broadcom Earnings: Will 3D Stacked Chips Expand Revenue?
Broadcom plans to ship 1 million 3D-stacked chips by 2027, leveraging advanced silicon stacking to boost data transfer speeds. For FY2026 Q1, management guided total revenue at $19.1B (vs. $18.27B consensus), with AI semiconductor revenue projected at $8.2B, marking another triple-digit YoY surge.
Analysts expect upside as hyperscaler capex approaches $670B globally, fueling AI infrastructure demand.
Is Broadcom emerging as the quiet winner in custom AI silicon?
Or will execution risks and capex cyclicality temper the stacked-chip narrative?