TSMC announced plans to invest an additional $100 billion in Arizona, expanding their total U.S. investment to $165 billion. This includes three new wafer fabs, two advanced packaging facilities, and an R&D center. The expansion aims to create a "gigafab cluster" supporting leading-edge customers in AI, HPC, and smartphone applications. TSMC's first Arizona fab is already in high-volume production using 4nm technology, while the second fab will use 3nm technology. The third and fourth fabs will utilize 2nm and A16 processes. Upon completion, about 30% of TSMC's 2nm and more advanced capacity will be in Arizona.Disclaimer: This earnings call summary is generated by AI and is for informational purposes only. Due to technical limitations, inaccuracies may exist. It does not constitute investment advice or commitments.
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