【摩根大通：2027年全球晶圆制造设备市场规模或增38%】摩根大通10月12日发布研报预计，2027年全球晶圆制造设备市场规模将达到2250亿美元，同比增长38%，高于2026年31%的预计增幅；2028年进一步扩大至2630亿美元。先进制程晶圆代工和DRAM将成为主要增长动力。该行还预计，台积电2028年资本开支将达到1000亿美元。
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摩根大通：2027年全球晶圆制造设备市场规模或增38%
智通财经10-14
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