DayOne Data Centers is exploring a potential $500 million bond sale to fund its projects, having held preliminary discussions with banks over the past several weeks, Bloomberg reported Friday, citing people familiar with the matter.
Citigroup is coordinating the proposed transaction, which could come to market as early as 2027. The Singapore-based operator is seeking additional capital as investment in artificial intelligence infrastructure accelerates. It also filed for a U.S. initial public offering earlier this week and has considered raising about $5 billion, the report said.
DayOne has secured about half of a loan package equivalent to $7 billion, with more than 30 lenders participating, and is pursuing a separate HK$1.86 billion loan for a data center in Hong Kong.
DayOne and Citigroup declined Bloomberg's request for a comment on the proposed bond sale. It has data center operations or development projects across several markets, including Malaysia, Indonesia, Singapore, Japan, Hong Kong, Thailand and Finland.
DayOne Data Centers did not immediately respond to a query from MT Newswires.
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