From $MU to $ASML: The Stocks Driving the HBM Boom
As AI workloads continue to drive unprecedented demand for high-bandwidth memory (HBM), the investment opportunity extends far beyond memory manufacturers.
From HBM producers and foundries to lithography, deposition, etching, testing, and TSV packaging, every stage of the semiconductor value chain is benefiting from the next wave of AI infrastructure spending.
Here's a complete look at the companies powering the HBM-DRAM ecosystem.
HBM Makers: $Micron Technology(MU)$, Sk Hynix, Samsung
Foundry: $Taiwan Semiconductor Manufacturing(TSM)$ $Intel(INTC)$
Photolithography: $ASML Holding NV(ASML)$
Etch: $Applied Materials(AMAT)$ $Lam Research(LRCX)$
Deposition: $Acm Research Inc.(ACMR)$ $Applied Materials(AMAT)$ $Lam Research(LRCX)$
Implantation: $Applied Materials(AMAT)$ $Axcelis(ACLS)$
CMP (Chemical Mechanical Planarization): $Acm Research Inc.(ACMR)$ $Applied Materials(AMAT)$ $Lam Research(LRCX)$ $Entegris(ENTG)$
Bonding: $Kulicke & Soffa(KLIC)$ $Applied Materials(AMAT)$
Inspection & Testing: $Onto Innovation Inc.(ONTO)$ $Teradyne(TER)$ $Camtek(CAMT)$ $KLA-Tencor(KLAC)$ $Cohu(COHU)$
TSV (Through-Silicon Via): $Lam Research(LRCX)$ $KLA-Tencor(KLAC)$ $Applied Materials(AMAT)$
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