To The Moon

Recently, Intel's current CEO, Lip-Bu Tan, gave an exclusive interview to the tech podcast No Priors.

$INTC designs and manufactures processors, chips, memory, and related hardware. In addition, the company provides software, optimization solutions, and artificial intelligence platforms.

Tan revealed numerous investment directions, including CPUs, advanced packaging, glass substrates, gallium nitride, silicon carbide, indium phosphide, and diamond…

Regarding future goals, Tan set a target of generating a 10-fold return for shareholders within 5 to 10 years.

He predicts that Intel's business potential will be fully realized between 2030 and 2032, at which point the market will truly recognize its value.

As of the closing bell on June 18th, Intel's stock rose 10.64%, hitting a new all-time high, with a total market capitalization of $673.434 billion.

Year-to-date, Intel's stock price has risen over 263%.

Jim Cramer Highlights How CEO Lip-Bu Tan Solved Intel (INTC) Foundry Issues

Intel Corporation (NASDAQ: INTC) was one of the stocks Jim Cramer highlighted on his show "Crazy Money."

Cremer advised investors to focus on a stock's future trajectory, not its past performance. He called Intel his "most bullish new stock in this market," commenting:

Many Fed officials want to raise interest rates because, in their view, the economy is overheating… This news, released at 2 PM, immediately triggered a market drop, which was the perfect time to enter. So, which stocks should you buy? I told club members that the answer is my current top pick—Intel. We all know the Intel story. We invited Intel CEO Lip-Bu Tan to our show, and he talked about how we'll need a lot of CPUs in the future… CPUs are the lifeblood of Intel. With the explosive growth in demand for artificial intelligence, everything depends on the CPU-to-CPU ratio…

In fact, Lip-Bu Tan told us that a GPU can carry up to four CPUs, four CPUs. That's incredible. CPUs are Intel's strength. This will bring explosive growth to Intel's business. Despite today's poor market conditions, Intel's stock price ultimately rose 3.5%, though it has retreated somewhat from its pre-Federal Reserve statement. Another key business for Intel is chip manufacturing, similar to TSMC's… customers increasingly rely on TSMC's advanced chip manufacturing services. This is good news for Intel's foundry business.

To mitigate geopolitical risks, companies are increasingly opting for US-based supply chains, which is another reason I like Intel. Under the previous CEO, Intel invested billions of dollars in building foundries, only to create a mess. But under Lip-Bu Tan, who truly focuses on engineering, these problems have been solved. New foundries will gradually come online in the coming years, and I believe they will eventually become profitable. Today, we learned that Intel has started production on its 18A-P chip node, and if successful, it may secure orders from Apple. Elon Musk's massive Terafab project is also a partner of Intel. There could be many developments in the future. All of this is thanks to Lip-Bu Tan.

This interview with Intel CEO Chen Liwu revealed five new directions and key conclusions:

abandoning simple process technology competition and focusing on Agent AI computing power as the foundation for demand—five main growth drivers in the post-Moore's Law era.

I. Agentic AI Reconstructs Computing Architecture (First Major Strategy) Industry-wide Disruption: AI shifts from training-centric to agent inference; CPU is no longer secondary to GPU. Server Ratio Changes: Previously, CPU:GPU = 1:8; now rapidly converging to 1:4, with inference scenarios approaching 1:1. Product Focus: Xeon 6 Plus 18A Data Center CPU, Full-Stack Heterogeneous XPU (CPU/GPU/ASIC/DPU). Goal: Reclaim the core position of general-purpose computing in data centers, meeting the essential needs of each generation of AI computing clusters.

II. EMIB Next-Generation Advanced Packaging (Second Major Core Barrier) Benchmarking against TSMC's CoWoS, it is Intel's core differentiating competitive advantage in the foundry business. Technology Path: High-density chip interconnect without TSV silicon bridges, significantly reducing multi-chip integration costs and increasing bandwidth. Application Scenarios: High-performance AI computing modules, high-end AI PCs, automotive multi-chip domain controllers. Positioning: Not relying on a single advanced process, but on packaging to achieve computing power stacking, bypassing Moore's Law cost bottlenecks. III. Next-Generation Glass Substrate Packaging Carrier (Third Major Material Track) Pain Points: Traditional organic resin substrates have reached their limits in terms of size, heat dissipation, and bandwidth. Deployment Progress: Invested in upstream manufacturer 3DGS; full commercialization expected between 2027 and 2030. Advantages: Larger panel size, lower loss, better heat dissipation, and compatibility with ultra-high power AI chips. Value: Supports large-scale mass production of EMIB packaging, significantly reducing the overall cost of high-end packaging.

IV. Third-Generation Wide Bandgap Semiconductors (Fourth Major Long-Term Growth Curve) Covering all three material categories: SiC (Silicon Carbide): New energy vehicles, industrial high-voltage power supplies; GaN (Gallium Nitride): Consumer fast charging, server power supplies, 5G RF; InP (Indium Phosphide): Optical communication, optical interconnects, high-speed optical modules. Positioning: Driven by the trillion-dollar incremental markets of new energy and communications, and AI computing power.

V. CVD Artificial Diamond Chip Backside Heat Dissipation (Fifth Exclusive Breakthrough Route) Industry Needs: Next-generation AI chip power consumption exceeds 1000W; copper-aluminum heat dissipation has reached its limit. Material Advantages: Diamond has a lower thermal conductivity than copper. 4-5 times faster, capable of being an integrated heat dissipation layer on the back of the chip.

Industry Layout: The CEO made early investments in upstream diamond manufacturers; Intel internally validated thin-layer mounting solutions.

Industry Consensus: Nvidia's next-generation high-end GPUs will simultaneously adopt diamond composite heat dissipation, a standard solution for computing chips.

Interview Top-Level Overall Logic (Unified Goals Across 5 Main Lines)

Underlying Judgment: Silicon process miniaturization has reached its physical limits; relying on transistor shrinking cannot sustain revenue growth.

Unified Application Scenarios: All five major technologies serve the explosive growth of AI intelligent agent computing power.

Medium- to Long-Term Goals: Achieve a 10-fold increase in market capitalization within 5-10 years; realized 6 times shareholder returns in 14 months since taking office.

Business Focus Shift: Transforming from a single PC/server CPU manufacturer to a comprehensive semiconductor platform company encompassing materials + packaging + foundry + full-stack AI computing.

$Intel(INTC)$ $GraniteShares 2X Long INTC Daily ETF(INTW)$ $Direxion Daily INTC Bull 2X ETF(LINT)$ $INTC