Very recent development shows that SK Hynix pulled ahead their HBM4 schedule and is ready for Nvidia’s Rubin GPU, continues its leadership in the market with more than 50%. Samsung is following up very quickly on HBM4 as well leveraging their memory/logic foundry integration (HBM4 bottom die uses logic processing), expected to increase its market share to over 30%. This squeeze MU to 3rd place with market share expected to shrink to less than 10%. CEO tried to clarify their HBM4 delay rumors and use of their internal fab as a temporary solution to the base logic die. Reading between the lines, it confirms their lag behind the competition. More importantly, they dont have enough volume. Given AVGO got crashed by the Wall Street even as an absolute leader in AI ASIC, interconnect switches, and fantastic financial forecasts, MU probably has more odds going down.Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.
