Hikaruno personal page - To The Moon

Hikaruno

Hikaruno

No personal profile

24Follow

3Followers

2Topic

0Badge

05-26 07:41

This shows china's prowess

Huawei's 'Tau Law' Aims for 1.4nm Equivalent by 2031: A New Paradigm for Chip Performance

2025-07-06

Let’s hope our nation continue to progress and be inclusive to all

2023-04-09

More such games pls!!!! More fun

2023-04-08

Way to goooooooo. Awesome

2023-04-05

I believe that given the world is shortage of food. #beyondmeat is one area that we can lookat for alternatives. Just a thought

2023-04-05

More such games. Time filler and easy to play

2023-03-03

Nice

C3.ai Stock Rallies 15% in Morning Trading As Results Top Guidance

2023-02-15

Hmmmm

Here Are the Winners and Losers From Singapore’s Budget

2023-02-06

$ChatGPT(BK4587)$ Following on this, seems like a potential

2022-04-13

#investHonestly I think invest in tech companies is the way to go

Go to Tiger App to see more news

{"i18n":{"language":"en_US"},"userPageInfo":{"id":"4097888403268910","uuid":"4097888403268910","gmtCreate":1634785337021,"gmtModify":1653714397771,"name":"Hikaruno","pinyin":"hikaruno","introduction":"","introductionEn":"","signature":"","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","hat":null,"hatId":null,"hatName":null,"vip":1,"status":2,"fanSize":3,"headSize":24,"tweetSize":10,"questionSize":0,"limitLevel":999,"accountStatus":4,"level":{"id":2,"name":"无畏虎","nameTw":"無畏虎","represent":"初生牛犊","factor":"发布3条非转发主帖,1条获得他人回复或点赞","iconColor":"3C9E83","bgColor":"A2F1D9"},"themeCounts":2,"badgeCounts":0,"badges":[],"moderator":false,"superModerator":false,"manageSymbols":null,"badgeLevel":null,"boolIsFan":false,"boolIsHead":false,"favoriteSize":0,"symbols":null,"coverImage":null,"realNameVerified":"success","userBadges":[{"badgeId":"1026c425416b44e0aac28c11a0848493-3","templateUuid":"1026c425416b44e0aac28c11a0848493","name":" Tiger Idol","description":"Join the tiger community for 1500 days","bigImgUrl":"https://static.tigerbbs.com/8b40ae7da5bf081a1c84df14bf9e6367","smallImgUrl":"https://static.tigerbbs.com/f160eceddd7c284a8e1136557615cfad","grayImgUrl":"https://static.tigerbbs.com/11792805c468334a9b31c39f95a41c6a","redirectLinkEnabled":0,"redirectLinkType":null,"redirectLink":null,"redirectLinkValidityFrom":null,"redirectLinkValidityTo":null,"hasAllocated":1,"isWearing":0,"stamp":null,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2025.11.30","exceedPercentage":null,"individualDisplayEnabled":0,"backgroundColor":null,"fontColor":null,"individualDisplaySort":0,"categoryType":1001,"isScarce":0,"effectConfig":null,"effectEnabled":0,"plateImgUrl":null,"plateColors":null,"validityTo":null,"validityToTimestamp":null,"wearingSort":0},{"badgeId":"44212b71d0be4ec88898348dbe882e03-1","templateUuid":"44212b71d0be4ec88898348dbe882e03","name":"Boss Tiger","description":"The transaction amount of the securities account reaches $100,000","bigImgUrl":"https://static.tigerbbs.com/c8dfc27c1ee0e25db1c93e9d0b641101","smallImgUrl":"https://static.tigerbbs.com/f43908c142f8a33c78f5bdf0e2897488","grayImgUrl":"https://static.tigerbbs.com/82165ff19cb8a786e8919f92acee5213","redirectLinkEnabled":0,"redirectLinkType":null,"redirectLink":null,"redirectLinkValidityFrom":null,"redirectLinkValidityTo":null,"hasAllocated":1,"isWearing":1,"stamp":null,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2025.02.26","exceedPercentage":"60.59%","individualDisplayEnabled":0,"backgroundColor":null,"fontColor":null,"individualDisplaySort":0,"categoryType":1101,"isScarce":0,"effectConfig":null,"effectEnabled":0,"plateImgUrl":null,"plateColors":null,"validityTo":null,"validityToTimestamp":null,"wearingSort":0},{"badgeId":"972123088c9646f7b6091ae0662215be-3","templateUuid":"972123088c9646f7b6091ae0662215be","name":"Legendary Trader","description":"Total number of securities or futures transactions reached 300","bigImgUrl":"https://static.tigerbbs.com/656db16598a0b8f21429e10d6c1cb033","smallImgUrl":"https://static.tigerbbs.com/03f10910d4dd9234f9b5702a3342193a","grayImgUrl":"https://static.tigerbbs.com/0c767e35268feb729d50d3fa9a386c5a","redirectLinkEnabled":0,"redirectLinkType":null,"redirectLink":null,"redirectLinkValidityFrom":null,"redirectLinkValidityTo":null,"hasAllocated":1,"isWearing":0,"stamp":null,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2025.02.01","exceedPercentage":"93.12%","individualDisplayEnabled":0,"backgroundColor":null,"fontColor":null,"individualDisplaySort":0,"categoryType":1100,"isScarce":0,"effectConfig":null,"effectEnabled":0,"plateImgUrl":null,"plateColors":null,"validityTo":null,"validityToTimestamp":null,"wearingSort":0},{"badgeId":"7a9f168ff73447fe856ed6c938b61789-1","templateUuid":"7a9f168ff73447fe856ed6c938b61789","name":"Knowledgeable Investor","description":"Traded more than 10 stocks","bigImgUrl":"https://static.tigerbbs.com/e74cc24115c4fbae6154ec1b1041bf47","smallImgUrl":"https://static.tigerbbs.com/d48265cbfd97c57f9048db29f22227b0","grayImgUrl":"https://static.tigerbbs.com/76c6d6898b073c77e1c537ebe9ac1c57","redirectLinkEnabled":0,"redirectLinkType":null,"redirectLink":null,"redirectLinkValidityFrom":null,"redirectLinkValidityTo":null,"hasAllocated":1,"isWearing":0,"stamp":null,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2023.03.01","exceedPercentage":null,"individualDisplayEnabled":0,"backgroundColor":null,"fontColor":null,"individualDisplaySort":0,"categoryType":1102,"isScarce":0,"effectConfig":null,"effectEnabled":0,"plateImgUrl":null,"plateColors":null,"validityTo":null,"validityToTimestamp":null,"wearingSort":0},{"badgeId":"a83d7582f45846ffbccbce770ce65d84-1","templateUuid":"a83d7582f45846ffbccbce770ce65d84","name":"Real Trader","description":"Completed a transaction","bigImgUrl":"https://static.tigerbbs.com/2e08a1cc2087a1de93402c2c290fa65b","smallImgUrl":"https://static.tigerbbs.com/4504a6397ce1137932d56e5f4ce27166","grayImgUrl":"https://static.tigerbbs.com/4b22c79415b4cd6e3d8ebc4a0fa32604","redirectLinkEnabled":0,"redirectLinkType":null,"redirectLink":null,"redirectLinkValidityFrom":null,"redirectLinkValidityTo":null,"hasAllocated":1,"isWearing":0,"stamp":null,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2022.04.15","exceedPercentage":null,"individualDisplayEnabled":0,"backgroundColor":null,"fontColor":null,"individualDisplaySort":0,"categoryType":1100,"isScarce":0,"effectConfig":null,"effectEnabled":0,"plateImgUrl":null,"plateColors":null,"validityTo":null,"validityToTimestamp":null,"wearingSort":0}],"userBadgeCount":5,"currentWearingBadge":{"badgeId":"44212b71d0be4ec88898348dbe882e03-1","templateUuid":"44212b71d0be4ec88898348dbe882e03","name":"Boss Tiger","description":"The transaction amount of the securities account reaches $100,000","bigImgUrl":"https://static.tigerbbs.com/c8dfc27c1ee0e25db1c93e9d0b641101","smallImgUrl":"https://static.tigerbbs.com/f43908c142f8a33c78f5bdf0e2897488","grayImgUrl":"https://static.tigerbbs.com/82165ff19cb8a786e8919f92acee5213","redirectLinkEnabled":0,"redirectLinkType":null,"redirectLink":null,"redirectLinkValidityFrom":null,"redirectLinkValidityTo":null,"hasAllocated":1,"isWearing":1,"stamp":null,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2025.02.26","exceedPercentage":"60.58%","individualDisplayEnabled":0,"backgroundColor":null,"fontColor":null,"individualDisplaySort":0,"categoryType":1101,"isScarce":0,"effectConfig":null,"effectEnabled":0,"plateImgUrl":null,"plateColors":null,"validityTo":null,"validityToTimestamp":null,"wearingSort":0},"individualDisplayBadges":null,"crmLevel":12,"crmLevelSwitch":0,"location":null,"starInvestorFollowerNum":0,"starInvestorFlag":false,"starInvestorOrderShareNum":0,"subscribeStarInvestorNum":2,"ror":null,"winRationPercentage":null,"showRor":false,"investmentPhilosophy":null,"starInvestorSubscribeFlag":false},"baikeInfo":{},"tab":"post","tweets":[{"id":568210194704112,"gmtCreate":1779752466036,"gmtModify":1779752469672,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"idStr":"4097888403268910","authorIdStr":"4097888403268910"},"themes":[],"title":"","htmlText":"This shows china's prowess","listText":"This shows china's prowess","text":"This shows china's prowess","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/568210194704112","repostId":"1103704030","repostType":2,"repost":{"id":"1103704030","kind":"news","weMediaInfo":{"introduction":"Global Stock Market Deep Analysis","home_visible":1,"media_name":"Deep News","id":"1039043262","head_image":"https://community-static.tradeup.com/news/8296859682db4b478146245e72de1922"},"pubTimestamp":1779687219,"share":"https://ttm.financial/m/news/1103704030?lang=en_US&edition=fundamental","pubTime":"2026-05-25 13:33","market":"sg","language":"en","title":"Huawei's 'Tau Law' Aims for 1.4nm Equivalent by 2031: A New Paradigm for Chip Performance","url":"https://stock-news.laohu8.com/highlight/detail?id=1103704030","media":"Deep News","summary":"At the International Symposium on Circuits and Systems (ISCAS 2026) held in Shanghai, a premier academic event for global semiconductor scholars, He Tingbo, a Huawei director and President of its...","content":"<p>At the International Symposium on Circuits and Systems (ISCAS 2026) held in Shanghai, a premier academic event for global semiconductor scholars, He Tingbo, a Huawei director and President of its Semiconductor Business Unit, delivered a keynote speech titled \"Exploring and Practicing New Semiconductor Paths.\" During this speech, she officially introduced the \"Tau (τ) Law.\"</p>\n<p>This marks the first time China has proposed new principles guiding industrial development in the global semiconductor field, presenting a comprehensive new theoretical framework for the continuous improvement of chip performance.</p>\n<p>However, before discussing what the \"Tau Law\" entails, a fundamental question must be answered: why is a \"new\" law needed at all?</p>\n<p>This brings us back to a dilemma known to all but understood by few: has Moore's Law truly reached its end?</p>\n<p>What conceptual shift does the \"Tau Law\" represent?\nThe issue isn't that Moore's Law itself is \"dead,\" but that its underlying logic of \"geometric scaling\" is hitting physical limits.</p>\n<p>For over half a century, the semiconductor industry's rule was simple: make transistors smaller, pack more components into the same area, and performance automatically improves, power consumption decreases, and costs are reduced. This logic held for nodes down to several tens of nanometers. However, progressing from tens of nanometers to single-digit nanometers has seen physical challenges and engineering costs increase exponentially.</p>\n<p>Specifically, as process nodes approach 2nm and 1nm, individual atoms become significant hurdles. Quantum tunneling effects cause disruptive \"leakage,\" where electrons pass through barriers they shouldn't. Controlling current becomes increasingly difficult, making power consumption and heat dissipation major challenges. Factory construction costs soar, with a single 3nm fab now costing at least $20 billion, reducing the number of global players capable of such investment from dozens to just a handful.</p>\n<p>While the marginal returns of scaling are diminishing sharply, the demand for computing power from AI, large models, and autonomous driving is growing exponentially. This widening gap is the fundamental problem Huawei's \"Tau Law\" seeks to address.</p>\n<p>He Tingbo's answer is: stop focusing solely on \"size\" and start focusing on \"time.\"</p>\n<p>This is the core shift of the \"Tau Law\": replacing \"geometric scaling\" with \"temporal scaling.\"</p>\n<p>The Four-Level Optimization of the \"Tau Law\"\n\"Temporal scaling\" may sound abstract, but its breakdown is straightforward. In the semiconductor world, a chip's performance and transistor density are ultimately determined by a factor called the \"time constant τ\" (the Greek letter tau, pronounced \"Tao\" in Chinese). It represents the time required for a signal to travel from one point to another within a chip. The faster the signal travels, the shorter its path, and the lower its latency, the more data can be processed per unit time, naturally leading to higher transistor density and performance.</p>\n<p>Historically, the industry's approach to improving performance was to \"make transistors smaller,\" allowing for denser wiring and shorter signal travel distances. Huawei's approach is different: achieve the same effect by systematically compressing signal propagation delay without significantly shrinking transistor size.</p>\n<p>This concept is akin to optimizing traffic flow during rush hour. Instead of widening roads (increasing size), the focus is on optimizing traffic lights, implementing tidal flow lanes, and building overpasses or tunnels to streamline traffic, thereby naturally increasing vehicle speed.</p>\n<p>The core technology enabling this approach for Huawei is \"logic folding.\"</p>\n<p>Traditional chip circuit layouts are two-dimensional, with signals traversing laterally across the plane, spending significant time on interconnects. The essence of logic folding is expanding the circuit layout from a \"single floor\" to \"multiple floors.\" By \"folding\" critical paths that require long horizontal connections and stacking them vertically, the physical distance for signal propagation is dramatically shortened.</p>\n<p>Logic folding is just one key lever within Huawei's multi-level collaborative system. Based on Huawei's previously disclosed technology roadmap, the \"Tau Law\" constructs a four-level optimization system spanning devices, circuits, chips, and systems.</p>\n<p>At the foundational device level, Huawei optimizes transistor resistance and parasitic capacitance, minimizing the time constant τ from the physical layer to build a solid base.</p>\n<p>At the circuit level, logic folding technology breaks through the physical boundaries of traditional planar layouts, transforming circuits from single-layer to dual-layer or even multi-layer structures.</p>\n<p>At the chip level, Huawei introduces full-stack co-design encompassing \"software, architecture, and chip.\" This approach allocates instruction and data flows based on actual workloads, ensuring the chip only computes what is necessary, reducing wasteful overhead, and minimizing end-to-end execution time.</p>\n<p>At the top system level, Huawei has defined the \"Lingqu Bus,\" re-architecting computing system interconnect protocols to achieve \"super-node unified memory addressing and native memory semantics.\" This allows data exchange between different computing units to proceed with minimal \"congestion.\"</p>\n<p>These four levels are not optimized in a linear, sequential manner but are interlocked like gears. To use an analogy, the traditional chip optimization path is like desperately piling sports cars onto an increasingly narrow road. The \"Tau Law,\" however, expands the roadmap to a broader dimension: devices, circuits, chips, and systems co-evolve, enabling signals to travel faster and computation to become smarter.</p>\n<p>The High-End Chip Goals of the \"Tau Law\"\nThe ultimate validation of the \"Tau Law\" lies in its products.</p>\n<p>In her speech, He Tingbo provided a key figure: over the past six years, Huawei has successfully designed and mass-produced 381 different chips based on this path, covering various fields including communications, computing, terminals, and automotive. This track record forms a significant foundation for the credibility of Huawei's \"Tau Law\" theory.</p>\n<p>What truly excites the market is the next-generation Kirin mobile chipset scheduled for release this autumn. According to He Tingbo, this chip will fully adopt logic folding technology, based on a new free logic design concept, expanding from a single layer to a dual layer, achieving a substantial leap in transistor density and system performance.</p>\n<p>He Tingbo stated: \"We have achieved a series of advancements that would be difficult to attain solely through advanced process technology.\" This suggests Huawei may have successfully navigated a path independent of those taken by Taiwan Semiconductor Manufacturing, Samsung, and Intel.</p>\n<p>She also revealed a longer-term goal: by 2031, high-end chips based on the \"Tau Law\" will achieve transistor density equivalent to that of a 1.4nm process node. This means Huawei aims to achieve integration density and computing capability on par with 1.4nm process technology through system-level temporal optimization.</p>\n<p>Is this a viable path? He Tingbo's words were: \"Our solution is viable and sustainable. The performance of our new chips can continuously compete with the other path.\"</p>\n<p>New Technology Waves in the Global Semiconductor Industry\nIf the \"Tau Law\" can be understood as a paradigm shift from \"space\" to \"time,\" then another major trend in the global semiconductor industry is the shift from \"planar\" to \"three-dimensional.\"</p>\n<p>Interestingly, these two trends are converging at the same point in time.</p>\n<p>A wave of technologies represented by advanced packaging, Chiplet heterogeneous integration, and hybrid bonding is reshaping chip performance boundaries at an unprecedented pace and scale. Their core rationale aligns with that of the \"Tau Law\": rather than relying on the infinite scaling of transistors themselves, they drive continuous leaps in system-level performance through smarter integration and interconnection methods.</p>\n<p>First, consider advanced packaging. If discussions about \"how many nanometers\" defined the industry for decades, the focus from 2024 to 2026 is rapidly shifting toward advanced packaging. According to Yole Group, the global advanced packaging market is projected to reach approximately $53.1 billion in 2025, with expectations to grow to $79.4 billion by 2030, representing a compound annual growth rate (CAGR) of about 8.4%. More striking is the growth rate of 2.5D/3D packaging, with a CAGR of 37% projected between 2023 and 2029.</p>\n<p>Why such rapid growth? The reason is straightforward: explosive demand for AI chips. Advanced packaging, exemplified by Taiwan Semiconductor Manufacturing's CoWoS, places GPU cores and high-bandwidth memory (HBM) in close proximity, compressing signal transmission distances from the millimeter to the micrometer scale. This serves as the \"invisible foundation\" for the computing power explosion in the era of large AI models. Data indicates that global capacity for 2.5D and 3D advanced packaging remains insufficient to meet demand, with lead times for some orders exceeding one year and a supply gap estimated at around 23%. Leading global manufacturers are embarking on massive expansion efforts: Taiwan Semiconductor Manufacturing plans to establish seven advanced packaging fabs, aiming to increase annual capacity from 1.3 million wafers to 2 million wafers by 2027, a roughly 53.85% increase.</p>\n<p>Next, consider Chiplets. The logic behind this technology is to break down a large monolithic chip into multiple smaller chiplets, each manufactured using the optimal process node, and then \"bond\" them together via advanced packaging—similar to \"cutting a large chessboard into smaller puzzle pieces and reassembling them.\" Chiplet architecture is already widely deployed in AI chips. For domestic chip manufacturers, this technology holds particular strategic significance: it allows critical core modules to use advanced process nodes while employing mature nodes for non-critical I/O and memory modules. This effectively mitigates limitations in accessing advanced processes, achieving \"system-level performance with finite resources.\"</p>\n<p>If Chiplets are about \"building blocks,\" then hybrid bonding is the \"glue\" that determines whether these blocks can be stacked stably and densely. The breakthrough of hybrid bonding lies in its elimination of solder bumps, enabling direct copper-to-copper contact at the atomic level for direct bonding between chips. Compared to traditional thermal compression bonding, hybrid bonding can increase interconnect density by one to two orders of magnitude, with extremely low parasitic capacitance, significantly reducing signal delay and power consumption.</p>\n<p>This technology is viewed by the industry as \"an essential technology roadmap for the next decade in the post-Moore era.\" In terms of practical implementation, memory giants are fully engaged. SK hynix and Samsung are paving the way for next-generation HBM, with hybrid bonding expected to be introduced starting with HBM4. Validation of 16-layer HBM stacked structures is underway. The hybrid bonding equipment market is projected to grow at a CAGR of 69%, far exceeding the overall semiconductor industry growth rate.</p>\n<p>There is an even more cutting-edge direction: silicon photonics interconnection and co-packaged optics (CPO).</p>\n<p>The fundamental bottleneck in signal transmission is shifting from within chips to interconnections between chips and even between server racks. Traditional copper interconnects suffer from high loss at high frequencies and limited distance, increasingly struggling to meet the bandwidth demands of large-scale AI clusters. The core idea of silicon photonics is to use light instead of electrical signals for transmission, offering higher speed, lower latency, and significantly reduced power consumption.</p>\n<p>At a technology forum in May 2026, Taiwan Semiconductor Manufacturing prominently disclosed its \"three-layer cake\" AI platform architecture: the bottom layer is the compute layer, the middle is the packaging integration layer (CoWoS/SoIC), and the top layer is the \"most important for the future\" photonic interconnect layer (COUPE). COUPE technology employs 3D heterogeneous integration to vertically stack electronic and photonic chips, bringing components extremely close together and drastically reducing electrical coupling loss. According to Taiwan Semiconductor Manufacturing, mass production of the world's first 200Gbps micro-ring modulator using COUPE technology has commenced this year, with a bit error rate below one in 100 million. Compared to traditional copper wires, COUPE can improve system energy efficiency by 4 times and reduce latency by 10 times; when deeply integrated with the packaging platform, energy efficiency can improve by up to 10 times, with latency reduced by 20 times.</p>\n<p>Guojin Securities explicitly stated in its latest research report: 2026 marks the first year of CPO industrialization. Core players in the supply chain like Taiwan Semiconductor Manufacturing, NVIDIA, and Broadcom are actively entering the field, signaling the formal commencement of large-scale deployment of \"optics replacing copper\" in AI data centers.</p>\n<p>Conclusion\nIn the long term, Huawei's \"Tau Law\" is highly aligned with the direction of the entire industry's technological evolution. Whether termed \"temporal scaling\" or \"advanced packaging,\" the underlying essence reflects a fundamental consensus: improving chip performance can no longer rely solely on \"making transistors smaller.\"</p>\n<p>The real competition is shifting to a new set of dimensions: interconnect density, signal latency, system synergy, vertical stacking, and optical interconnection. The combinatorial effects of these dimensions are far more complex and expansive than simply shrinking a node. In Huawei's own words, from 2026 to 2035, as numerous exploratory technologies gradually become productized, transistor density will continue to increase, operating frequencies will continue to grow, and a steady stream of high-performance chips will emerge.</p>\n<p>At the conclusion of her speech, He Tingbo made a meaningful statement: \"The future certainly belongs to open cooperation. On the path of semiconductor evolution, no single enterprise can provide all the answers alone. Under the path of the 'Tau Law,' we look forward to close collaboration with global scientists, engineers, and industry partners to jointly promote the sustainable development of the semiconductor and electronics industries.\"</p>\n<p>The semiconductor supply chain is too long and complex for any single country or company to dominate all segments. Every link—from semiconductor equipment including lithography machines, to packaging substrate materials, EDA tools, CPO standard systems—requires global collaboration. By proposing the \"Tau Law,\" Huawei is offering the world a compatible, open, and alternative Chinese solution at a critical juncture when the semiconductor industry is searching for new growth curves.</p>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Huawei's 'Tau Law' Aims for 1.4nm Equivalent by 2031: A New Paradigm for Chip Performance</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nHuawei's 'Tau Law' Aims for 1.4nm Equivalent by 2031: A New Paradigm for Chip Performance\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1039043262\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/8296859682db4b478146245e72de1922);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Deep News </p>\n<p class=\"h-time\">2026-05-25 13:33</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<p>At the International Symposium on Circuits and Systems (ISCAS 2026) held in Shanghai, a premier academic event for global semiconductor scholars, He Tingbo, a Huawei director and President of its Semiconductor Business Unit, delivered a keynote speech titled \"Exploring and Practicing New Semiconductor Paths.\" During this speech, she officially introduced the \"Tau (τ) Law.\"</p>\n<p>This marks the first time China has proposed new principles guiding industrial development in the global semiconductor field, presenting a comprehensive new theoretical framework for the continuous improvement of chip performance.</p>\n<p>However, before discussing what the \"Tau Law\" entails, a fundamental question must be answered: why is a \"new\" law needed at all?</p>\n<p>This brings us back to a dilemma known to all but understood by few: has Moore's Law truly reached its end?</p>\n<p>What conceptual shift does the \"Tau Law\" represent?\nThe issue isn't that Moore's Law itself is \"dead,\" but that its underlying logic of \"geometric scaling\" is hitting physical limits.</p>\n<p>For over half a century, the semiconductor industry's rule was simple: make transistors smaller, pack more components into the same area, and performance automatically improves, power consumption decreases, and costs are reduced. This logic held for nodes down to several tens of nanometers. However, progressing from tens of nanometers to single-digit nanometers has seen physical challenges and engineering costs increase exponentially.</p>\n<p>Specifically, as process nodes approach 2nm and 1nm, individual atoms become significant hurdles. Quantum tunneling effects cause disruptive \"leakage,\" where electrons pass through barriers they shouldn't. Controlling current becomes increasingly difficult, making power consumption and heat dissipation major challenges. Factory construction costs soar, with a single 3nm fab now costing at least $20 billion, reducing the number of global players capable of such investment from dozens to just a handful.</p>\n<p>While the marginal returns of scaling are diminishing sharply, the demand for computing power from AI, large models, and autonomous driving is growing exponentially. This widening gap is the fundamental problem Huawei's \"Tau Law\" seeks to address.</p>\n<p>He Tingbo's answer is: stop focusing solely on \"size\" and start focusing on \"time.\"</p>\n<p>This is the core shift of the \"Tau Law\": replacing \"geometric scaling\" with \"temporal scaling.\"</p>\n<p>The Four-Level Optimization of the \"Tau Law\"\n\"Temporal scaling\" may sound abstract, but its breakdown is straightforward. In the semiconductor world, a chip's performance and transistor density are ultimately determined by a factor called the \"time constant τ\" (the Greek letter tau, pronounced \"Tao\" in Chinese). It represents the time required for a signal to travel from one point to another within a chip. The faster the signal travels, the shorter its path, and the lower its latency, the more data can be processed per unit time, naturally leading to higher transistor density and performance.</p>\n<p>Historically, the industry's approach to improving performance was to \"make transistors smaller,\" allowing for denser wiring and shorter signal travel distances. Huawei's approach is different: achieve the same effect by systematically compressing signal propagation delay without significantly shrinking transistor size.</p>\n<p>This concept is akin to optimizing traffic flow during rush hour. Instead of widening roads (increasing size), the focus is on optimizing traffic lights, implementing tidal flow lanes, and building overpasses or tunnels to streamline traffic, thereby naturally increasing vehicle speed.</p>\n<p>The core technology enabling this approach for Huawei is \"logic folding.\"</p>\n<p>Traditional chip circuit layouts are two-dimensional, with signals traversing laterally across the plane, spending significant time on interconnects. The essence of logic folding is expanding the circuit layout from a \"single floor\" to \"multiple floors.\" By \"folding\" critical paths that require long horizontal connections and stacking them vertically, the physical distance for signal propagation is dramatically shortened.</p>\n<p>Logic folding is just one key lever within Huawei's multi-level collaborative system. Based on Huawei's previously disclosed technology roadmap, the \"Tau Law\" constructs a four-level optimization system spanning devices, circuits, chips, and systems.</p>\n<p>At the foundational device level, Huawei optimizes transistor resistance and parasitic capacitance, minimizing the time constant τ from the physical layer to build a solid base.</p>\n<p>At the circuit level, logic folding technology breaks through the physical boundaries of traditional planar layouts, transforming circuits from single-layer to dual-layer or even multi-layer structures.</p>\n<p>At the chip level, Huawei introduces full-stack co-design encompassing \"software, architecture, and chip.\" This approach allocates instruction and data flows based on actual workloads, ensuring the chip only computes what is necessary, reducing wasteful overhead, and minimizing end-to-end execution time.</p>\n<p>At the top system level, Huawei has defined the \"Lingqu Bus,\" re-architecting computing system interconnect protocols to achieve \"super-node unified memory addressing and native memory semantics.\" This allows data exchange between different computing units to proceed with minimal \"congestion.\"</p>\n<p>These four levels are not optimized in a linear, sequential manner but are interlocked like gears. To use an analogy, the traditional chip optimization path is like desperately piling sports cars onto an increasingly narrow road. The \"Tau Law,\" however, expands the roadmap to a broader dimension: devices, circuits, chips, and systems co-evolve, enabling signals to travel faster and computation to become smarter.</p>\n<p>The High-End Chip Goals of the \"Tau Law\"\nThe ultimate validation of the \"Tau Law\" lies in its products.</p>\n<p>In her speech, He Tingbo provided a key figure: over the past six years, Huawei has successfully designed and mass-produced 381 different chips based on this path, covering various fields including communications, computing, terminals, and automotive. This track record forms a significant foundation for the credibility of Huawei's \"Tau Law\" theory.</p>\n<p>What truly excites the market is the next-generation Kirin mobile chipset scheduled for release this autumn. According to He Tingbo, this chip will fully adopt logic folding technology, based on a new free logic design concept, expanding from a single layer to a dual layer, achieving a substantial leap in transistor density and system performance.</p>\n<p>He Tingbo stated: \"We have achieved a series of advancements that would be difficult to attain solely through advanced process technology.\" This suggests Huawei may have successfully navigated a path independent of those taken by Taiwan Semiconductor Manufacturing, Samsung, and Intel.</p>\n<p>She also revealed a longer-term goal: by 2031, high-end chips based on the \"Tau Law\" will achieve transistor density equivalent to that of a 1.4nm process node. This means Huawei aims to achieve integration density and computing capability on par with 1.4nm process technology through system-level temporal optimization.</p>\n<p>Is this a viable path? He Tingbo's words were: \"Our solution is viable and sustainable. The performance of our new chips can continuously compete with the other path.\"</p>\n<p>New Technology Waves in the Global Semiconductor Industry\nIf the \"Tau Law\" can be understood as a paradigm shift from \"space\" to \"time,\" then another major trend in the global semiconductor industry is the shift from \"planar\" to \"three-dimensional.\"</p>\n<p>Interestingly, these two trends are converging at the same point in time.</p>\n<p>A wave of technologies represented by advanced packaging, Chiplet heterogeneous integration, and hybrid bonding is reshaping chip performance boundaries at an unprecedented pace and scale. Their core rationale aligns with that of the \"Tau Law\": rather than relying on the infinite scaling of transistors themselves, they drive continuous leaps in system-level performance through smarter integration and interconnection methods.</p>\n<p>First, consider advanced packaging. If discussions about \"how many nanometers\" defined the industry for decades, the focus from 2024 to 2026 is rapidly shifting toward advanced packaging. According to Yole Group, the global advanced packaging market is projected to reach approximately $53.1 billion in 2025, with expectations to grow to $79.4 billion by 2030, representing a compound annual growth rate (CAGR) of about 8.4%. More striking is the growth rate of 2.5D/3D packaging, with a CAGR of 37% projected between 2023 and 2029.</p>\n<p>Why such rapid growth? The reason is straightforward: explosive demand for AI chips. Advanced packaging, exemplified by Taiwan Semiconductor Manufacturing's CoWoS, places GPU cores and high-bandwidth memory (HBM) in close proximity, compressing signal transmission distances from the millimeter to the micrometer scale. This serves as the \"invisible foundation\" for the computing power explosion in the era of large AI models. Data indicates that global capacity for 2.5D and 3D advanced packaging remains insufficient to meet demand, with lead times for some orders exceeding one year and a supply gap estimated at around 23%. Leading global manufacturers are embarking on massive expansion efforts: Taiwan Semiconductor Manufacturing plans to establish seven advanced packaging fabs, aiming to increase annual capacity from 1.3 million wafers to 2 million wafers by 2027, a roughly 53.85% increase.</p>\n<p>Next, consider Chiplets. The logic behind this technology is to break down a large monolithic chip into multiple smaller chiplets, each manufactured using the optimal process node, and then \"bond\" them together via advanced packaging—similar to \"cutting a large chessboard into smaller puzzle pieces and reassembling them.\" Chiplet architecture is already widely deployed in AI chips. For domestic chip manufacturers, this technology holds particular strategic significance: it allows critical core modules to use advanced process nodes while employing mature nodes for non-critical I/O and memory modules. This effectively mitigates limitations in accessing advanced processes, achieving \"system-level performance with finite resources.\"</p>\n<p>If Chiplets are about \"building blocks,\" then hybrid bonding is the \"glue\" that determines whether these blocks can be stacked stably and densely. The breakthrough of hybrid bonding lies in its elimination of solder bumps, enabling direct copper-to-copper contact at the atomic level for direct bonding between chips. Compared to traditional thermal compression bonding, hybrid bonding can increase interconnect density by one to two orders of magnitude, with extremely low parasitic capacitance, significantly reducing signal delay and power consumption.</p>\n<p>This technology is viewed by the industry as \"an essential technology roadmap for the next decade in the post-Moore era.\" In terms of practical implementation, memory giants are fully engaged. SK hynix and Samsung are paving the way for next-generation HBM, with hybrid bonding expected to be introduced starting with HBM4. Validation of 16-layer HBM stacked structures is underway. The hybrid bonding equipment market is projected to grow at a CAGR of 69%, far exceeding the overall semiconductor industry growth rate.</p>\n<p>There is an even more cutting-edge direction: silicon photonics interconnection and co-packaged optics (CPO).</p>\n<p>The fundamental bottleneck in signal transmission is shifting from within chips to interconnections between chips and even between server racks. Traditional copper interconnects suffer from high loss at high frequencies and limited distance, increasingly struggling to meet the bandwidth demands of large-scale AI clusters. The core idea of silicon photonics is to use light instead of electrical signals for transmission, offering higher speed, lower latency, and significantly reduced power consumption.</p>\n<p>At a technology forum in May 2026, Taiwan Semiconductor Manufacturing prominently disclosed its \"three-layer cake\" AI platform architecture: the bottom layer is the compute layer, the middle is the packaging integration layer (CoWoS/SoIC), and the top layer is the \"most important for the future\" photonic interconnect layer (COUPE). COUPE technology employs 3D heterogeneous integration to vertically stack electronic and photonic chips, bringing components extremely close together and drastically reducing electrical coupling loss. According to Taiwan Semiconductor Manufacturing, mass production of the world's first 200Gbps micro-ring modulator using COUPE technology has commenced this year, with a bit error rate below one in 100 million. Compared to traditional copper wires, COUPE can improve system energy efficiency by 4 times and reduce latency by 10 times; when deeply integrated with the packaging platform, energy efficiency can improve by up to 10 times, with latency reduced by 20 times.</p>\n<p>Guojin Securities explicitly stated in its latest research report: 2026 marks the first year of CPO industrialization. Core players in the supply chain like Taiwan Semiconductor Manufacturing, NVIDIA, and Broadcom are actively entering the field, signaling the formal commencement of large-scale deployment of \"optics replacing copper\" in AI data centers.</p>\n<p>Conclusion\nIn the long term, Huawei's \"Tau Law\" is highly aligned with the direction of the entire industry's technological evolution. Whether termed \"temporal scaling\" or \"advanced packaging,\" the underlying essence reflects a fundamental consensus: improving chip performance can no longer rely solely on \"making transistors smaller.\"</p>\n<p>The real competition is shifting to a new set of dimensions: interconnect density, signal latency, system synergy, vertical stacking, and optical interconnection. The combinatorial effects of these dimensions are far more complex and expansive than simply shrinking a node. In Huawei's own words, from 2026 to 2035, as numerous exploratory technologies gradually become productized, transistor density will continue to increase, operating frequencies will continue to grow, and a steady stream of high-performance chips will emerge.</p>\n<p>At the conclusion of her speech, He Tingbo made a meaningful statement: \"The future certainly belongs to open cooperation. On the path of semiconductor evolution, no single enterprise can provide all the answers alone. Under the path of the 'Tau Law,' we look forward to close collaboration with global scientists, engineers, and industry partners to jointly promote the sustainable development of the semiconductor and electronics industries.\"</p>\n<p>The semiconductor supply chain is too long and complex for any single country or company to dominate all segments. Every link—from semiconductor equipment including lithography machines, to packaging substrate materials, EDA tools, CPO standard systems—requires global collaboration. By proposing the \"Tau Law,\" Huawei is offering the world a compatible, open, and alternative Chinese solution at a critical juncture when the semiconductor industry is searching for new growth curves.</p>\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"LU2242649171.HKD":"FIDELITY FUNDS GLOBAL THEMATIC OPPORTUNITIES \"A\" (HKD) ACC","SG9999014880.SGD":"大华全球优质成长基金Acc SGD","LU2462157665.USD":"ALLIANZ GLOBAL INCOME \"A\" (USD) INC","DIPS":"做空NVDA期权收益策略ETF-YieldMax","LU0347712357.USD":"BNP PARIBAS GLOBAL ENVIRONMENT \"C\" (USD) ACC","LU0107464264.USD":"abrdn SICAV I - GLOBAL INNOVATION EQUITY \"A\" (USD) ACC","LU0061474705.USD":"THREADNEEDLE (LUX) GLOBAL DYNAMIC REAL RETURN \"AU\" (USD) ACC","IE00BYXW3230.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"AA\" (USD) ACC","LU2417539215.USD":"ALLIANZ GLOBAL INCOME \"AMF\" (USD) INC","HK0000304805.HKD":"PICTET 战略收益基金 P类港元","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY ENHANCED INCOME \"I\" (USD) INC","IE00B775H168.HKD":"JANUS HENDERSON BALANCED \"A5M\" (HKD) INC","IE00BN29S564.USD":"JANUS HENDERSON BALANCED \"A3\" (USD) INC","HK0000304797.USD":"PICTET 战略收益基金 P类 美元","LU0289960550.SGD":"AB FCP I - GLOBAL EQUITY BLEND PORTFOLIO 'A' (SGD) ACC","LU1670628061.USD":"M&G (LUX) NORTH AMERICAN DIVIDEND \"A\" (USD) INC","IE00BFSS8Q28.SGD":"Janus Henderson Balanced A Inc SGD-H","LU0124676726.USD":"AB SICAV I - SUSTAINABLE US THEMATIC PORTFOLIO \"A\" (USD) ACC","LU1670710588.SGD":"M&G (LUX) GLOBAL DIVIDEND \"A\" (SGD) ACC","LU2355687059.USD":"NORDEA 1 GLOBAL IMPACT  \"BP\" (USD) ACC","LU1066053197.SGD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM3\" (SGDHDG) INC","LU0979878070.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"A\" (USD) ACC","LU1670710661.SGD":"M&G (LUX) GLOBAL DIVIDEND \"A\" (SGD) INC","IE0004086264.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"A\" (USD) ACC","LU2028103732.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AMG\" (USD) INC","LU2065170008.USD":"M&G (LUX) GLOBAL MAXIMA \"A\" (USD) INC","LU0528227936.USD":"富达环球人口趋势基金A-ACC","LU0289961442.SGD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"AX\" (SGD) ACC","LU1670711123.USD":"M&G (LUX) GLOBAL DIVIDEND \"A\" (USD) INC","LU0985320562.USD":"NORDEA 1 GLOBAL STARS EQUITY \"BP\" (USD) ACC","SGXZ23171101.USD":"NIKKO AM SHENTON GLOBAL OPPORTUNITIES (USD) ACC","LU2357305700.SGD":"Allianz Global Artificial Intelligence ET H2-SGD","LU0310799852.SGD":"FTIF - Templeton Global Equity Income A MDIS SGD","LU0738911758.USD":"Blackrock Global Equity Income A6 USD","LU0109391861.USD":"富兰克林美国机遇基金A Acc","GB00BDT5M118.USD":"天利环球扩展Alpha基金A Acc","LU0545039389.USD":"BGF GLOBAL EQUITY INCOME \"A2\" ACC","IE0001KFT4U8.USD":"FTGF CLEARBRIDGE GLOBAL GROWTH LEADERS \"A\" (USD) INC","IE0009G5SDU7.USD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (USD) INC","LU0466842654.USD":"HSBC ISLAMIC GLOBAL EQUITY INDEX \"A\" (USD) ACC","LU2089284900.SGD":"Allianz Global Sustainability Cl AM Dis H2-SGD","HK0000819398.USD":"BLACKROCK PREMIER SYSTEMATIC GLOBAL EQUITY HIGH INCOME FUND A10 (USD)INC","IE000ITXATA3.USD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (USD) ACC","IE000YTNTUN2.SGD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (SGDHDG)INC","LU1280957306.USD":"THREADNEEDLE (LUX) US CONTRARIAN CORE EQUITIES \"AUP\" (USD) INC","LU1988902786.USD":"FULLERTON LUX FUNDS GLOBAL ABSOLUTE ALPHA \"I\" (USD) ACC","LU1642822529.SGD":"THREADNEEDLE (LUX) GLOBAL TECHNOLOGY \"A\" (SGD) ACC","LU2602419157.SGD":"HSBC ISLAMIC GLOBAL EQUITY INDEX \"AC\" (SGD) ACC","LU0444973449.USD":"CT (LUX) I GLOBAL TECHNOLOGY \"DU\" (USD) ACC","LU1496350171.SGD":"FRANKLIN DIVERSIFIED BALANCED \"A\" (SGDHDG) ACC","LU0878004406.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) INC","IE00BMPRXQ63.HKD":"NEUBERGER BERMAN NEXT GENERATION CONNECTIVITY FUND \"A\" (HKDHDG) ACC","SGXZ81514606.USD":"大华环球创新基金A Acc USD","LU2463028550.USD":"AB SICAV I AMERICAN MULTI-ASSET PORTFOLIO \"A\" (USD) ACC","LU0882747503.HKD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (HKD) INC","04335":"英特尔-T","LU2065171311.SGD":"M&G (LUX) GLOBAL MAXIMA \"A\" (SGD) ACC","LU1839511570.USD":"WELLS FARGO GLOBAL FACTOR ENHANCED EQUITY \"I\" (USD) ACC","LU0320765646.SGD":"FTIF - Franklin Income A MDIS SGD-H1","LU2237957902.USD":"NIKKO AM GLOBAL EQUITY \"F\" (USD) ACC","LU2065171402.SGD":"M&G (LUX) GLOBAL MAXIMA \"A\" (SGD) INC","LU1400636491.USD":"Allianz Europe Income and Growth Cl AMg DIS H2-USD","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","LU2237957811.SGD":"NIKKO AM GLOBAL EQUITY \"F\" (SGD) ACC","LU2471134952.CNY":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (CNYHDG) INC","LU2471134879.HKD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (HKD) INC","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","LU0708994859.HKD":"TEMPLETON GLOBAL \"A\" (HKD) ACC","SNVD.UK":"LS -1X NVIDIA","LU2471134523.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) ACC","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","LU1992135399.USD":"Allianz Global Intelligent Cities AT Acc USD","IE00BJTD4N35.SGD":"Neuberger Berman US Long Short Equity A1  Acc SGD-H","HK0000532082.HKD":"ALLIANZ SELECTION INCOME AND GROWTH \"AM\" (HKD) INC","IE00B19Z8X17.USD":"FTGF CLEARBRIDGE US LARGE CAP GROWTH  \"AG\" (USD) ACC","3NVD.UK":"LS 3X NVIDIA","IE0003U64NQ7.SGD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (SGDHDG) ACC","LU2720916845.USD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (USD) ACC","LU2471134796.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) INC","LU2247934214.USD":"FIDELITY FUNDS SUSTAINABLE FUTURE CONNECTIVITY \"A\" (USD) ACC","LU0109392836.USD":"富兰克林科技股A","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","IE000KEQY171.SGD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (SGDHDG) INC","LU2750360641.GBP":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (GBPHDG) INC","LU0820562030.AUD":"ALLIANZ INCOME AND GROWTH \"AMH2\" (AUDHDG) H2 INC","LU2361044949.HKD":"WELLINGTON US QUALITY GROWTH \"A\" (HKD) ACC","LU2360107168.USD":"BGF NEXT GENERATION TECHNOLOGY \"A4\" (USD) INC","LU0965509010.AUD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (AUDHDG) INC","LU0354030511.USD":"ALLSPRING  U.S. LARGE CAP GROWTH \"I\" (USD) ACC","SG9999015945.SGD":"LionGlobal Disruptive Innovation Fund A SGD","LU2237443465.HKD":"abrdn SICAV I -  GLOBAL DYNAMIC DIVIDEND \"A\" (HKD) INC","LU0823434740.USD":"BNP PARIBAS US GROWTH \"C\" (USD) INC","HK0000914686.HKD":"GFI Global Select Equity Fund Class A (HKD)","LU2750360997.AUD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (AUDHDG) INC","LU0354030438.USD":"富国美国大盘成长基金Cl A Acc","LU0143551892.USD":"T ROWE PRICE GLOBAL FOCUSED GROWTH EQUITY \"A\" (USD) ACC","HK0000914660.USD":"GFI Global Select Equity Fund Class A (USD)","LU2023251221.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (USD) INC","LU2095319765.USD":"Natixis Thematics Subscription Economy R/A USD","IE00BYV24P56.USD":"GUINNESS EMERGING MARKETS EQUITY INCOME \"C\" (USD) ACC","LU2462591277.SGD":"TRP GLOBAL FOCUSED GROWTH EQUITY \"AN\" (SGDHDG) ACC","LU2954938101.SGD":"T ROWE PRICE GLOBAL FOCUSED GROWTH EQUITY \"A8P\" (SGD) INC","IE00BMCWC346.EUR":"GUINNESS EMERGING MARKETS EQUITY INCOME \"C\" (EUR) ACC","LU2210150020.SGD":"Natixis Thematics Subscription Economy R/A SGD","LU0444971666.USD":"天利全球科技基金","LU2210149790.SGD":"Natixis Thematics Subscription Economy R/A SGD-H","LU2999663052.SGD":"T ROWE PRICE GLOBAL FOCUSED GROWTH EQUITY \"A4P\" (SGD) INC","IE00BVYPNV92.GBP":"GUINNESS GLOBAL EQUITY INCOME \"C\" (GBP) ACC","SGXZ99366536.SGD":"United Global Innovation A Acc SGD-H","IE00B4YYXB79.USD":"PIMCO BALANCED INCOME AND GROWTH \"E\" (USD) ACC","LU0859254822.USD":"T ROWE PRICE GLOBAL VALUE EQUITY \"A\" (USD) ACC","LU1323610961.USD":"UBS (LUX) EQUITY SICAV - LONG TERM THEMES (USD) \"P\" (USD) ACC","AVGO":"博通","LU0069063385.USD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (USD) ACC","LU2357627491.SGD":"TRP GLOBAL VALUE EQUITY \"AH\" (SGDHDG) ACC","LU2168564495.EUR":"AZ ALLOCATION - TREND \"AI\" (EUR) ACC","LU2106854487.HKD":"ALLIANZ THEMATICA \"AMG\" (HKD) INC","TSM":"台积电","IE00BVYPNQ40.USD":"GUINNESS ASIAN EQUITY INCOME \"C\" (USD) ACC","LU2047632596.USD":"T.ROWE MULTI-ASSET GLOBAL INCOME \"A\" (USD) ACC","LU0965509101.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (SGDHDG) ACC","LU2168564222.USD":"AZ ALLOCATION - TREND \"AAZ\" (USDHDG) ACC","LU0823414551.USD":"BNP PARIBAS ENERGY TRANSITION \"C\" (USD) INC","LU1629891620.HKD":"ALLIANZ INCOME AND GROWTH \"AMG2\" (H2-HKD) INC","LU2168564065.EUR":"AZ ALLOCATION - TREND \"AAZ\" (EUR) ACC","IE00BVYPNP33.GBP":"GUINNESS ASIAN EQUITY INCOME \"C\" (GBP) ACC","LU2326559502.SGD":"Natixis Loomis Sayles US Growth Equity P/A SGD-H","LU2100268510.USD":"T.ROWE MULTI-ASSET GLOBAL INCOME \"AX\" (USD) INC","LU3102509885.SGD":"T.ROWE MULTI-ASSET GLOBAL INCOME \"A8P\" (SGDHDG) INC","LU2168563687.JPY":"AZ ALLOCATION - TREND \"AAZ\" (JPYHDG) ACC","LU1778281490.HKD":"HSBC GIF GLOBAL LOWER CARBON EQUITY \"AD\" (HKD) INC","LU0251132253.USD":"FIDELITY FUNDS  GLOBAL THEMATIC OPPORTUNITIES \"A\" (USD) ACC","LU2168564149.EUR":"AZ ALLOCATION - TREND \"BAZ\" (EUR) ACC","LU1633808545.USD":"ALLIANZ GLOBAL EQUITY GROWTH \"AT\" (USD) ACC","LU0203202063.USD":"AB SICAV I - ALL MARKET INCOME PORTFOLIO \"A2X\" (USD) ACC","IE00BVYPNW00.USD":"GUINNESS GLOBAL EQUITY INCOME \"C\" (USD) ACC","IE00BZ1G4Q59.USD":"LEGG MASON CLEARBRIDGE US EQUITY SUSTAINABILITY LEADER \"A\"(USD) INC (A)","IE000W1ABFV2.USD":"PIMCO BALANCED INCOME AND GROWTH \"R\" (USD) INC","LU1066051225.USD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AC\" (USD) ACC","SG9999015986.USD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (USD) ACC","LU2023250330.USD":"ALLIANZ INCOME AND GROWTH \"AMG\" (USD) INC","LU0203201768.USD":"AB SICAV I - ALL MARKET INCOME PORTFOLIO \"AX\" (USD) INC","LU0476273544.USD":"CT (LUX) I GLOBAL TECHNOLOGY \"BU\" (USD) ACC","LU1720051017.SGD":"Allianz Global Artificial Intelligence AT Acc H2-SGD","LU1923622614.USD":"Natixis Thematics Meta R/A USD","LU0553294199.USD":"BGF GLOBAL EQUITY INCOME \"A5G\" (USD) INC","LU1244550221.USD":"FRANKLIN GLOBAL MULTI-ASSET  INCOME \"A\" (USDHEDGED) INC (M)","LU1699723380.USD":"ALLSPRING GLOBAL LONG/SHORT EQUITY \"AP\" (USD) ACC","LU1917777945.USD":"安联专题基金Cl AT Acc","STSM":"Defiance Daily Target 2X Short TSM ETF","LU2242650005.HKD":"FIDELITY FUNDS GLOBAL MULTI ASSET DYNAMIC \"A\" (HKD) ACC","SOX":"费城半导体指数","LU0057025933.USD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"AX\" (USD) ACC","LU2452424414.USD":"BGF ESG MULTI-ASSET \"A10\" (USDHDG) INC","LU2125909759.SGD":"Natixis Thematics Safety H-R/A SGD","IE00BQXX3D17.EUR":"GUINNESS GLOBAL INNOVATORS \"C\" (EUR) ACC","LU2211815571.USD":"ALLIANZ POSITIVE CHANGE \"AT\" (USD) ACC","LU0964807845.USD":"ALLIANZ INCOME & GROWTH \"A\" (USD) INC","LU2125909916.SGD":"Natixis Thematics Safety R/A SGD","IE00BQXX3C00.GBP":"GUINNESS GLOBAL INNOVATORS \"C\" (GBP) ACC","LU1923622291.USD":"Natixis Thematics Safety R/A USD","NVD3.UK":"LS 3X NVIDIA","LU2433249047.HKD":"THEMATICS META \"R/A\" (HKD) ACC","LU0276348264.USD":"THREADNEEDLE (LUX) GLOBAL DYNAMIC REAL RETURN\"AUP\" (USD) INC","NVDS.UK":"LS -1X NVIDIA","IE00BQXX3F31.USD":"GUINNESS GLOBAL INNOVATORS \"C\" (USD) ACC","LU0133085943.USD":"T ROWE PRICE US BLUE CHIP EQUITY \"A\" ACC","LU2108987350.USD":"UBS (LUX) EQUITY SICAV GLOBAL OPPORTUNITY SUSTAINABLE (USD) \"P\" (USD) ACC","LU0174119429.USD":"T ROWE PRICE US LARGE CAP GROWTH EQUITY \"A\" ACC","NVD2.UK":"2X NVIDIA ETP","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU2213496289.HKD":"ALLIANZ INCOME AND GROWTH \"AT\" (HKD) ACC","LU2462591350.SGD":"T ROWE PRICE US LARGE CAP GROWTH EQUITY \"AN\" (SGDHDG) ACC","LU2244417387.USD":"FIDELITY SUSTAINABLE US EQUITY \"A\" (USD) ACC","SG9999001440.SGD":"United Global Dividend Equity Fund A SGD Dist","LU2063271972.USD":"富兰克林创新领域基金","LU1037948897.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (HKD) INC","LU2290526834.HKD":"BGF NEXT GENERATION TECHNOLOGY \"A2\" (HKDHDG) ACC","LU1242518931.SGD":"Fullerton Lux Funds - Asia Absolute Alpha A Acc SGD","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","LU2298321311.HKD":"BGF CIRCULAR ECONOMY \"A\" (HKDHDG) ACC","LU2764262908.HKD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (HKD) ACC","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","LU0323591593.USD":"SCHRODER ISF QEP GLOBAL QUALITY \"A\" (USD) ACC","LU1037948541.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (HKD) ACC","AVGG":"2倍做多AVGO ETF-Leverage Shares","LU1116320737.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A6\" (USD) INC","IE00BDRTCR15.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"ADC\" (USD) INC A","LU2360032135.SGD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (SGDHDG) INC","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","LU2125909593.SGD":"Natixis Thematics Meta R/A SGD","IE00BDGV0183.EUR":"GUINNESS GLOBAL EQUITY INCOME \"C\" (EUR) INC","LU0384037296.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AT\" (USD) ACC","IE00B19Z8W00.USD":"FTGF CLEARBRIDGE US LARGE CAP GROWTH \"A\" INC","LU2637965513.SGD":"BGF GLOBAL ALLOCATION \"A10\" (SGDHDG) INC","AVGU":"2倍做多AVGO ETF-GraniteShares","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","LU0868494708.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) INC","LU2403377893.USD":"ALLIANZ SELECT INCOME AND GROWTH \"AM\" (USD) INC","AVGW":"Roundhill AVGO WeeklyPay ETF","IE00BKDWB100.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5H\" (SGDHDG) ACC","LU1116320901.HKD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A6\" (HKD) INC","AVGX":"2倍做多AVGO ETF-Defiance","LU1064131342.USD":"Fullerton Lux Funds - Global Absolute Alpha A Acc USD","LU2250418816.HKD":"BGF WORLD TECHNOLOGY \"A\" (HKD) ACC","LU2111349929.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (HKD) INC","LU1992135472.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES \"AT\" (HKD) ACC","IE00BGHQDM52.EUR":"GUINNESS ASIAN EQUITY INCOME \"C\" (EUR) ACC","ANV":"GraniteShares Autocallable NVDA ETF","LU1153585028.USD":"BGF GLOBAL LONG-HORIZON EQUITY  \"A4\" (USD) INC","IE00BZ9MQY76.HKD":"FTGF CLEARBRIDGE US AGGRESSIVE GROWTH \"A\" (HKD) ACC","LU1232071149.USD":"AZ FUND 1 GLOBAL GROWTH SELECTOR \"AAZ\" (USDHDG) ACC","LU1496350502.SGD":"FRANKLIN DIVERSIFIED DYNAMIC \"A\" (SGDHDG) ACC","AVL":"2倍做多AVGO ETF-Direxion","LU1674673691.USD":"HSBC GIF GLOBAL LOWER CARBON EQUITY \"AD\" (USD) INC","LU2148611432.USD":"AZ ALLOCATION BALANCED BRAVE \"AAZ\" (USDHDG) ACC","LU1301847155.USD":"BGF GLOBAL MULTI-ASSET INCOME FUND \"A4G\" (USD) INC","LU1674673428.USD":"HSBC GIF GLOBAL LOWER CARBON EQUITY \"AC\" (USD) ACC","LU0061475181.USD":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC","IE00BGHQF631.EUR":"GUINNESS GLOBAL EQUITY INCOME \"C\" (EUR) ACC","LU2413666699.HKD":"BNP PARIBAS GLOBAL ENVIRONMENT \"CRH\" (HKDHDG) INC","LU0942090050.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD)  INC","IE00B3PB1722.GBP":"GUINNESS GLOBAL EQUITY INCOME \"C\" (GBP) INC","LU2456880835.USD":"ALLIANZ GLOBAL INCOME \"AT\" (USD) ACC","LU0094547139.USD":"abrdn SICAV I - GLOBAL SUSTAINABLE EQUITY FUND \"A\" (USD) ACC","LU0708995401.HKD":"FRANKLIN U.S. OPPORTUNITIES \"A\" (HKD) ACC","IE00B42XCP33.USD":"GUINNESS GLOBAL EQUITY INCOME \"C\" (USD) INC","LU1551013342.USD":"Allianz Income and Growth Cl AMg2 DIS USD","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","LU2381873111.SGD":"BGF SYSTEMATIC GLOBAL EQUITY HIGH INCOME \"A6\" (SGDHDG) INC","IE00B19Z9Z06.USD":"Legg Mason ClearBridge - US Aggressive Growth A Acc USD","LU0345769128.USD":"NINETY ONE GSF GLOBAL EQUITY \"A\" (USD) ACC","LU2097344431.USD":"SCHRODER ISF SUSTAINABLE MULTI-ASSET INCOME \"A\" (USDHDG) INC","SG9999011175.SGD":"Nikko AM Global Dividend Equity Dis SGD-H","LU0128525929.USD":"TEMPLETON GLOBAL \"A\" (USD) ACC","LU2097344357.USD":"SCHRODER ISF SUSTAINABLE MULTI-ASSET INCOME \"A\" (USDHDG) ACC","LU1069344957.HKD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (HKD) INC","LU1951198990.SGD":"Natixis Thematics AI & Robotics Fund H-R/A SGD-H","LU2764263039.SGD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (SGDHDG) ACC","LU0345769631.USD":"NINETY ONE GSF GLOBAL EQUITY \"A\" (USD) INC","LU2764263203.CNY":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (CNYHDG) ACC","LU1951200564.SGD":"Natixis Thematics AI & Robotics Fund R/A SGD","IE00BWXC8680.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5\" (SGD) ACC","LU2191332357.HKD":"SCHRODER ISF SUSTAINABLE MULTI-ASSET INCOME \"A\" (HKDHDG) INC","LU0345770993.USD":"NINETY ONE GSF GLOBAL STRATEGIC EQUITY \"A\" (USD) INC","LU1923623000.USD":"Natixis Thematics AI & Robotics Fund R/A USD","LINT":"Direxion Daily INTC Bull 2X ETF","LU2125909247.SGD":"Natixis Thematics Meta H-R/A SGD","LU0672654240.SGD":"FTIF - Franklin US Opportunities A Acc SGD-H1","AVS":"1倍做空AVGO ETF-Direxion","LU1821325948.USD":"NINETY ONE GSF GLOBAL MACRO ALLOCATION \"A\" (USD) ACC","LU1429558221.USD":"Natixis Loomis Sayles US Growth Equity RA USD","LU1435385759.SGD":"Natixis Loomis Sayles US Growth Equity RA SGD-H","LU2264538146.SGD":"Fullerton Lux Funds - Global Absolute Alpha A Acc SGD","LU1803068623.USD":"TEMPLETON GLOBAL CLIMATE CHANGE \"AH1\" (USDHDG) ACC","LU2756315664.SGD":"ALLIANZ INCOME AND GROWTH \"AMI\" (SGDHDG) INC","SG9999015952.SGD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (SGD) ACC","HK0000320223.HKD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (HKD) ACC","IE00BN8TJ469.HKD":"FTGF CLEARBRIDGE TACTICAL DIVIDEND INCOME \"A\" (HKD) INC","LU0957791311.USD":"THREADNEEDLE (LUX) GLOBAL FOCUS \"ZU\" (USD) ACC","LU1935043023.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME \"AA\" (USD) INC A","IE00B4JS1V06.HKD":"JANUS HENDERSON BALANCED \"A2\" (HKD) ACC","SG9999003800.SGD":"Nikko AM Global Dividend Equity Acc SGD-H","LU2663582299.SGD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOL \"A2\" (SGDHDG) ACC","IE00B894F039.SGD":"Legg Mason ClearBridge - US Aggressive Growth A Acc SGD-H","LU2271345857.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (HKD) ACC","LU2746668461.USD":"MANULIFE DYNAMIC LEADERS \"AA\" (USD) ACC","HK0000320264.USD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (USD) ACC","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","LU1508157978.USD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOLUTE RETURN \"A\" (USD) ACC","LU0345768740.USD":"NINETY ONE GSF GLOBAL STRATEGIC MANAGED \"A\" (USD) INC","LU2089985449.USD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (USD) ACC","SG9999017495.SGD":"UGDP UNITED GLOBAL QUALITY GROWTH \"B\" (SGD) ACC","LU2931357623.SGD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (SGDHDG) ACC","LU2756315318.SGD":"ALLIANZ INCOME AND GROWTH \"AMG\" (SGDHDG) INC A","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","LU2272731865.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AM\" (HKD) INC","LU2746668974.SGD":"MANULIFE DYNAMIC LEADERS \"AA\" (SGDHDG) ACC","SG9999014914.USD":"UNITED GLOBAL QUALITY GROWTH (USDHDG) INC","IE00BK4W5M84.HKD":"HSBC GLOBAL FUNDS ICAV US EQUITY INDEX \"HC\" (HKD) ACC","LU0265550946.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A5\" (USD) INC","LU1066051811.HKD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM2\" (HKD) INC","LU2083900584.USD":"HSBC GIF US INCOME FOCUSED \"AM2\" (USD) INC","LU1645745479.HKD":"ALLIANZ EUROPE INCOME AND GROWTH \"AM\" (HKDHDG) INC","TSMG":"2倍做多TSM ETF- Leverage Shares","IE00BK4W5L77.USD":"HSBC GLOBAL FUNDS ICAV US EQUITY INDEX \"HC\" (USD) ACC","LU0472753341.HKD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (HKD) ACC","LU1127390331.HKD":"AB SICAV I - ALL MARKET INCOME PORTFOLIO \"A\" (HKD) ACC","IE00B3SWFQ91.USD":"PIMCO BALANCED INCOME AND GROWTH \"E\" (USD) INC","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","LU1623119135.USD":"Natixis Mirova Global Sustainable Equity R-NPF/A USD","LU2361044865.SGD":"WELLINGTON US QUALITY GROWTH \"A\" (SGDHDG) ACC","LU0143863784.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES\"DU\" (USD) ACC","LU0949170426.SGD":"Blackrock Global Multi-Asset Income A6 SGD-H","LU1244550494.USD":"FRANKLIN GLOBAL MULTI-ASSET INCOME \"A\" (USDHEDGED) ACC","TSMU":"2倍做多TSM ETF-GraniteShares","BK4512":"苹果概念","BK4543":"AI","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","TSMX":"2倍做多TSM ETF-Direxion","INTC":"英特尔","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","LU0784384876.USD":"Blackrock Global Multi-Asset Income A6 USD","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","LU0868494617.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) ACC","LU2361045086.USD":"WELLINGTON US QUALITY GROWTH \"A\" (USD) ACC","TSMY":"TSM期权收益策略ETF-YieldMax","SGXZ31699556.SGD":"UGDP UNITED GLOBAL QUALITY GROWTH \"C\" (SGDHDG) ACC","TSMZ":"1倍做空TSM ETF-Direxion","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","IE0004445015.USD":"JANUS HENDERSON BALANCED \"A2\" (USD) ACC","LU2211814178.USD":"ALLIANZ CLEAN PLANET \"AT\" (USD) ACC","LU1267930490.SGD":"TEMPLETON GLOBAL EQUITY INCOME \"AS\" (SGD) INC A","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","INTW":"2倍做多INTC ETF-GraniteShares","LU0143863198.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES\"AU\" (USD) ACC","LU1366333091.USD":"FIDELITY GLOBAL FOCUS \"A\" (USD) ACC","LU2237443549.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA SGD-H","LU0965508806.USD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (USD) INC","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","BK4515":"5G概念","LU0359202008.SGD":"Blackrock China Fund A2 SGD-H","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) ACC","BK4549":"软银资本持仓","LU2322448791.USD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AMG\" (USD) INC","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (SGDHDG) ACC","BK4548":"巴美列捷福持仓","LU0238689110.USD":"贝莱德环球动力股票基金","LU1267930730.SGD":"富兰克林美国机遇基金AS Acc SGD (CPF)","LU1815333072.USD":"THREADNEEDLE (LUX) GLOBAL FOCUS \"AUP\" (USD) INC","LU2491050154.USD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (USD) ACC","LU1366192091.USD":"ALLIANZ US EQUITY PLUS \"AM\" (USD) INC","LU0342679015.USD":"ALLIANZ GLOBAL EQUITY UNCONSTRAINED \"AT\" (USD) ACC","LU0072462426.USD":"贝莱德全球配置 A2","LU2322448957.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AMG\" (HKD) INC","LU0661504455.SGD":"Blackrock Global Equity Income A5 SGD-H","LU0011850046.USD":"贝莱德全球长线股票 A2 USD","LU2461242641.AUD":"WELLINGTON US QUALITY GROWTH \"A\" (AUDHDG) ACC","LU1548497426.USD":"安联环球人工智能AT Acc","LU0097036916.USD":"贝莱德美国增长A2 USD","LU0048584097.USD":"FIDELITY FUNDS  GLOBAL THEMATIC OPPORTUNITIES \"A\" (USD) INC","LU1162221912.USD":"FRANKLIN INCOME \"A\" (USD) ACC","IE00B1XK9C88.USD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A\" (USD) ACC","BK4554":"元宇宙及AR概念","LU2860962120.EUR":"CPR INVEST - ARTIFICIAL INTELLIGENCE \"A2\" (EUR) ACC A","LU0308772762.SGD":"Blackrock Global Allocation A2 SGD-H","LU2087625088.SGD":"ALLSPRING  US ALL CAP GROWTH \"A\" (SGDHDG) ACC","07388":"XI二南英伟","LU1202635105.USD":"ALLIANZ EUROPE INCOME AND GROWTH \"AM\" (USDHDG) INC","LU0203347892.USD":"SCHRODER ISF QEP GLOBAL ACTIVE VALLUE \"A\" (USD)  INC AV","BK4585":"ETF&股票定投概念","LU2592432038.USD":"WELLINGTON MULTI-ASSET HIGH INCOME \"A\" (USD) ACC","LU2237438978.USD":"Amundi Funds US Pioneer A2 (C) USD","BK4587":"ChatGPT概念","IE00BDCRKT87.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"ADC\" (USD) INC","LU0274383776.USD":"MANULIFE GF US SMALL CAP EQUITY \"AA\" (USD) INC","IE0034235188.USD":"PINEBRIDGE GLOBAL FOCUS EQUITY \"A\" (USD) ACC","LU1282649810.SGD":"Allianz Asian Multi Income Plus Cl AMg DIS H2-SGD","LU0878005551.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) ACC","LU2473716301.USD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AMF\" (USD) INC","LU1145028129.USD":"ALLIANZ INCOME AND GROWTH \"AQ\" (USD) INC","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU0359201612.USD":"贝莱德中国基金A2","IE00BJJMRY28.SGD":"Janus Henderson Balanced A Inc SGD","LU2505996681.GBP":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (GBPHDG) INC","LU0158827948.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"A\" (USD) INC","LU2420271590.USD":"ALLIANZ SELECT INCOME AND GROWTH \"AT\" (USD) ACC","BK4588":"碎股","BK4550":"红杉资本持仓","LU0157215616.USD":"FIDELITY GLOBAL FOCUS \"A\" INC","LU2505996509.AUD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (AUDHDG) INC","LU2249611893.SGD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (SGD) ACC","LU1914381329.SGD":"Allianz Best Styles Global Equity Cl ET Acc H2-SGD","LU0096362180.USD":"CT (LUX) I GLOBAL FOCUS \"DU\" (USD)","LU2552382215.SGD":"WELLINGTON US BRAND POWER \"A\" (SGDHDG) ACC","NVIW.SI":"NVDA 3xLongSG261006","LU2552382058.USD":"WELLINGTON US BRAND POWER \"A\" (USD) ACC","BK4551":"寇图资本持仓","LU2552382132.HKD":"WELLINGTON US BRAND POWER \"A\" (HKD) ACC","LU0795875086.SGD":"JPMorgan Investment Funds - Global Income A (div) SGD","LU0511384066.AUD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (AUDHDG) ACC","LU1935042215.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME  \"AA\" (USD) INC A","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU0096364046.USD":"CT (LUX) I AMERICAN \"DU\" (USD) ACC","LU0861579265.USD":"联博低波幅策略股票基金A","LU0943347566.SGD":"安联收益及增长平衡基金AM H2-SGD","IE0034235295.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"A\" (USD) ACC","LU0321505868.SGD":"Schroder ISF Global Dividend Maximiser A Dis SGD","LU0187121727.USD":"FIDELITY SUSTAINABLE US EQUITY \"A\" (USD) INC","LU0210536198.USD":"JPM US GROWTH \"A\" ACC","IE00BYQQ9H92.USD":"BNY MELLON GLOBAL LEADERS \"A\" (USD) ACC","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU2896262040.SGD":"JPM US GROWTH FUND \"A\" (SGD) ACC","BK4529":"IDC概念","07788":"南方两倍做多英伟达","LU1732800096.USD":"摩根大通环球收益基金A (irc)","LU0345770308.USD":"NINETY ONE GSF GLOBAL STRATEGIC EQUITY \"A\" (USD) ACC","NVDA":"英伟达","LU2394011477.USD":"JPMORGAN CLIMATE CHANGE SOLUTIONS \"A\" (USD) ACC","IE00BZ199S13.USD":"BNY MELLON MOBILITY INNOVATION \"B\" (USD) ACC","LU0175139822.USD":"AB FCP I Global Equity Blend A USD","LU0256863811.USD":"ALLIANZ US EQUITY \"A\" INC","LU0689472784.USD":"安联收益及增长基金Cl AM AT Acc","LU1084165304.USD":"FIDELITY WORLD \"A\" (USD) ACC","LU2487616109.SGD":"JPM AMERICA EQUITY \"A\" (SGD) ACC","LU1720051108.HKD":"ALLIANZ GLOBAL ARTIFICIAL INTELLIGENCE \"AT\" (HKD) ACC","LU0787776722.HKD":"AB SELECT US EQUITY PORTFOLIO \"A\" (HKD) ACC","SG9999018865.SGD":"United Global Quality Growth Fd Cl Dist SGD-H","LU1861215975.USD":"贝莱德新一代科技基金 A2","LU0210528500.USD":"JPM AMERICA EQUITY \"A\" ACC","LU2089283258.USD":"安联环球可持续基金Cl AM Dis","SG9999014898.SGD":"United Global Quality Growth Fund Dis SGD","LU1861220033.SGD":"Blackrock Next Generation Technology A2 SGD-H","LU0912757837.SGD":"JPMorgan Investment Funds - Global Income A (mth) SGD-H","LU1211504680.USD":"ALLIANZ HIGH DIVIDEND ASIA PACIFIC EQUITY \"AM\" (USD) INC","LU1670627923.USD":"M&G (LUX) NORTH AMERICAN DIVIDEND \"A\" (USD) ACC","LU1282649067.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AMG\" (USD) INC A","LU1066051498.USD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM2\" (USD) INC","LU2065169927.USD":"M&G (LUX) GLOBAL MAXIMA \"A\" (USD) ACC","LU1400636657.SGD":"Allianz Europe Income and Growth Cl AMg DIS H2-SGD","LU0689626769.HKD":"AB SICAV I - SUSTAINABLE US THEMATIC PORTFOLIO \"A\" (HKD) ACC","LU0820561909.HKD":"ALLIANZ INCOME AND GROWTH \"AM\" (HKD) INC","LU1670711040.USD":"M&G (LUX) GLOBAL DIVIDEND \"A\" (USD) ACC","SG9999018857.SGD":"United Global Quality Growth Fd Cl Acc SGD-H","LU0106261372.USD":"SCHRODER ISF US LARGE CAP \"A\" ACC","SGXZ51526630.SGD":"大华环球创新基金A Acc SGD","BK4527":"明星科技股","LU0572940350.SGD":"Janus Henderson Horizon Asian Dividend Income A3 SGD","LU1935042991.SGD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME  \"AA\" (SGDHDG) INC","LU1935042488.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME  \"AA\" (USD) INC","LU0321505439.SGD":"Schroder ISF Global Dividend Maximiser A Acc SGD","BK4526":"热门中概股","IE00BKPKM429.USD":"NEUBERGER BERMAN GLOBAL SUSTAINABLE EQUITY \"A\" (USD) ACC","LU0264606111.USD":"Janus Henderson Horizon Asian Dividend Income A2 USD","BK4575":"芯片概念","IE00B19Z9P08.USD":"LEGG MASON CLEARBRIDGE US AGGRESSIVE GROWTH \"A\" (USD) INC","2NVD.UK":"2X NVIDIA ETP","LU0266013472.USD":"AXA WF - Framlington Longevity Economy A Cap USD","LU0077335932.USD":"FIDELITY AMERICAN GROWTH \"A\" INC","IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","LU1732799900.SGD":"JPMorgan Investment Funds - Global Income A (irc) SGD-H","LU0353189680.USD":"富国美国全盘成长基金Cl A Acc","LU0211328371.USD":"TEMPLETON GLOBAL EQUITY INCOME \"A\" (MDIS) (USD)   INC","LU0158827781.USD":" ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (USD) ACC","BK4579":"人工智能","LU1868837565.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"1\" (USD) ACC","LU0572939691.SGD":"Janus Henderson Horizon Asian Dividend Income A2 SGD","LU1804176565.USD":"EASTSPRING INV GLOBAL GROWTH EQUITY \"A\" (USD) ACC","LU2506951792.HKD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (HKDHDG)       ACC","LU2413666426.HKD":"BNP PARIBAS GLOBAL ENVIRONMENT \"C\" (HKD) ACC","LU1721428933.USD":"法巴全球经典环境基金RH MD Dis","SG9999014542.SGD":"United Income Focus Trust Acc SGD","LU0882574139.USD":"富达环球消费行业基金A ACC","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC","BK4532":"文艺复兴科技持仓","BK4581":"高盛持仓","SG9999015978.USD":"利安颠覆性创新基金A","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU0784385170.HKD":"BGF GLOBAL MULTI ASSET INCOME \"A6\" (HKDHGD) INC","LU0784385840.USD":"Blackrock Global Multi-Asset Income A2 USD","BK4614":"Manus概念股","BK4141":"半导体产品","BK4534":"瑞士信贷持仓","BK4533":"AQR资本管理(全球第二大对冲基金)","HK0000306685.HKD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (HKD) INC","LU1861127337.USD":"ALLIANZ GLOBAL MULTI ASSET SUSTAINABILITY BALANCED \"AMG\" (USD) INC","BK4612":"AI芯片","LU1935043536.SGD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME \"AA\" (SGDHDG) INC A","LU1400636574.HKD":"ALLIANZ EUROPE INCOME AND GROWTH \"AMG\" (HKDHDG) INC","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU1989772840.SGD":"CPR Invest - Climate Action A2 Acc SGD-H","LU0784383803.USD":"BGF GLOBAL MULTI-ASSET INCOME FUND \"A\" (USD) INC A","BK4535":"淡马锡持仓","LU2237443895.HKD":"abrdn SICAV I -  GLOBAL DYNAMIC DIVIDEND \"A\" (HKD) ACC","LU1989772923.USD":"CPR Invest - Climate Action A2 Acc USD-H","LU0345768153.USD":"NINETY ONE GSF GLOBAL STRATEGIC MANAGED \"A\" (USD) ACC","LU0557290698.USD":"施罗德环球可持续增长基金","LU1815336760.USD":"THREADNEEDLE (LUX) GLOBAL TECHNOLOGY \"AUP\" (USD) INC","LU1934455277.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"AD\" (USD) INC","LU0265550359.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A2\" (USD) ACC","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","HK0000306701.USD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (USD) INC","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU1989764748.USD":"东方汇理环球颠覆性机遇A2 Acc","SG9999014575.USD":"UOB UNITED INCOME FOCUS TRUST FUND (USDHDG) INC","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU1934455194.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (USD) ACC","LU1791710582.SGD":"Fidelity Global Demographics A-ACC-SGD (SGD/USD hedged)","LU1119994496.HKD":"FIDELITY WORLD \"A\" (HKD) ACC","LU2092937221.SGD":"Blackrock Circular Economy A2 SGD-H","LU0488056044.USD":"Allianz Asian Multi Income Plus Cl AM DIS USD","LU0256863902.USD":"ALLIANZ US EQUITY \"AT\" (USD) ACC","IE0034235303.USD":"PINEBRIDGE US RESEARCH ENHANCED CORE EQUITY \"A\" (USD) ACC","LU1791710400.SGD":"Fidelity Global Demographics A-ACC-SGD","LU0823414478.USD":"法巴经典能源转换基金","LU0390134368.USD":"FRANKLIN GLOBAL GROWTH \"A\" (USD) ACC","LU0056508442.USD":"贝莱德世界科技基金A2","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","BK4608":"AI应用概念股","SG9999001424.SGD":"United E-Commerce Fund SGD","LU0215105999.USD":"SCHRODER ISF GLOBAL EQUITY \"A\" ACC","IE00B5TLWC47.USD":"BNY MELLON LONG-TERM GLOBAL EQUITY \"B\" (USD) ACC","LU2265009873.SGD":"Eastspring Investments - Global Growth Equity AS SGD-H","LU1571399168.USD":"ALLSPRING GLOBAL LONG/SHORT EQUITY \"IP\" (USD) ACC","LU0267386448.USD":"FIDELITY FIRST ALL COUNTRY WORLD \"A\" (USD) INC","LU1261432733.SGD":"Fidelity World A-ACC-SGD","IE00B1BXHZ80.USD":"Legg Mason ClearBridge - US Appreciation A Acc USD","LU0225283273.USD":"SCHRODER ISF GLOBAL EQUITY ALPHA \"A\" (USD) ACC","BK4605":"半导体精选","LU0786609619.USD":"高盛全球千禧一代股票组合Acc","LU2092937148.SGD":"Blackrock ESG Multi-Asset A8 SGD-H","IE0005OL40V9.USD":"JANUS HENDERSON BALANCED \"A6M\" (USD) INC","IE00BJTD4V19.USD":"NEUBERGER BERMAN US LONG SHORT EQUITY \"A1\" (USD) ACC","SG9999014559.SGD":"United Income Focus Trust Dis SGD","LU2092627202.USD":"Blackrock ESG Multi-Asset A8 USD-H","IE00BFSS7M15.SGD":"Janus Henderson Balanced A Acc SGD-H","LU0203345920.USD":"SCHRODER ISF QEP GLB ACT. VL \"A\" (USD) ACC","LU2077746001.SGD":"Blackrock ESG Multi-Asset A2 SGD-H","SG9999004220.SGD":"Nikko AM Shenton Asia Dividend Equity Fund  SGD","BK4602":"量子计算概念","LU0310800379.SGD":"FTIF - Templeton Global A Acc SGD","LU0724617625.USD":"BGF GLOBAL ALLOCATION \"A4\" (USD) INC","LU2236285917.USD":"ALLIANZ GLOBAL INCOME \"AMG\" (USD) INC","SG9999014567.USD":"UOB UNITED INCOME FOCUS TRUST FUND (USD) ACC","LU0029864427.USD":"TEMPLETON GLOBAL \"A\" (USD) INC","IE00BJLML261.HKD":"HSBC GLOBAL EQUITY INDEX \"HCH\" (HKD) ACC","LU0788109477.HKD":"BGF GLOBAL ALLOCATION \"A2\" (HKDHGD) ACC","LU0210533765.USD":"JPM GLOBAL GROWTH \"A\" (USD) ACC","IE00B3S45H60.SGD":"Neuberger Berman US Multicap Opportunities A Acc SGD-H","LU0316494557.USD":"FRANKLIN GLOBAL FUNDAMENTAL STRATEGIES \"A\" ACC","SG9999015358.SGD":"United Income Focus Trust Dis SGD-H","LU2357125470.USD":"BNP PARIBAS ENERGY TRANSITION \"CLASSIC RH\" (USDHDG) ACC","LU0234570918.USD":"高盛全球核心股票组合Acc Close","LU0079474960.USD":"联博美国增长基金A","LU0820561818.USD":"安联收益及增长平衡基金Cl AM DIS","LU1718418525.SGD":"JPMorgan Investment Funds - Global Select Equity A (acc) SGD","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","LU2286300806.USD":"Allianz Cyber Security AT Acc USD","LU0154236417.USD":"BGF US FLEXIBLE EQUITY \"A2\" ACC","LU0726765562.USD":"JPM GLOBAL INCOME \"A\" (USD HEDGED) INC","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","LU0353189763.USD":"ALLSPRING  US ALL CAP GROWTH FUND \"I\" (USD) ACC","LU2294711713.HKD":"BNP PARIBAS ENERGY TRANSITION \"C\" (HKD) ACC","NVD":"2倍做空NVDA ETF-GraniteShares","LU0320765059.SGD":"FTIF - Franklin US Opportunities A Acc SGD","IE00B7KXQ091.USD":"Janus Henderson Balanced A Inc USD","LU0289739343.SGD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (SGD) ACC","LU2347655073.USD":"JPM GLOBAL INCOME \"A\" (USDHDG) INC A","LU0080751232.USD":"富达环球多元动力基金A","BK4598":"佩洛西持仓","NVDB":"ProShares Ultra NVDA ETF","LU0359201885.HKD":"BGF CHINA \"A2\" (HKD) ACC","LU2023250843.SGD":"Allianz Thematica Cl AT Acc H2-SGD","NVDD":"1倍做空NVDA ETF-Direxion","LU0234572021.USD":"高盛美国核心股票组合Acc","LU0070217475.USD":"JPM GLOBAL SELECT EQUITY \"A\" ACC","BK4567":"ESG概念","LU0957808578.USD":"THREADNEEDLE (LUX) GLOBAL TECHNOLOGY \"ZU\" (USD) ACC","IE000M9KFDE8.USD":"NEUBERGER BERMAN US LARGE CAP VALUE \"A\" (USD) ACC","NVDG":"2倍做多NVDA ETF- Leverage Shares","BK4503":"景林资产持仓","LU1670756490.USD":"ALLIANZ EUROPE INCOME AND GROWTH \"AT\" (USDHDG) ACC","IE00B19Z9505.USD":"美盛-美国大盘成长股A Acc","LU1244550577.SGD":"FTIF - Franklin Global Multi-Asset Income A (Mdis) SGD-H1","03145":"华夏亚洲高息股","NVDL":"2倍做多NVDA ETF-GraniteShares","BK4566":"资本集团","LU1868838027.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"8\" (USD) ACC","IE00BKVL7J92.USD":"Legg Mason ClearBridge - US Equity Sustainability Leaders A Acc USD","SG9999004303.SGD":"Nikko AM Shenton Global Opportunities SGD","NVDO":"2倍上限加速NVDA ETF-Leverage Shares","BK4505":"高瓴资本持仓","LU0006306889.USD":"SCHRODER ISF US LARGE CAP \"A\" (USD) INC AV","LU1868837300.USD":"CT (LUX) I AMERICAN FUND \"9\" (USD) ACC","NVDQ":"2倍做空NVDA ETF-T-Rex","LU0683600562.USD":"AB SELECT US EQUITY \"A\" (USD) ACC","LU1814569148.SGD":"WELLINGTON GLOBAL QUALITY GROWTH \"D\" (SGDHDG) ACC","LU0061474960.USD":"天利环球焦点基金AU Acc","IE00BLSP4239.USD":"Legg Mason ClearBridge - Tactical Dividend Income A Mdis USD Plus","LU1267930573.SGD":"TEMPLETON GLOBAL \"AA\" (SGD) ACC A","NVDS":"1.5倍做空NVDA ETF-Tradr","LU0494093205.USD":"贝莱德ESG灵活多元资产A2 USD-H","LU0965509283.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (SGDHDG) INC","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","LU1691799644.USD":"Amundi Funds Polen Capital Global Growth A2 (C) USD","LU1868837722.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"2\" (USD) ACC","LU1868836914.USD":"CT (LUX) I AMERICAN \"3\" (USD) ACC","NVDU":"2倍做多NVDA ETF-Direxion","LU0640476718.USD":"THREADNEEDLE (LUX) US CONTRARIAN CORE EQ \"AU\" (USD) ACC","LU1868837136.USD":"CT (LUX) I AMERICAN \"8\" (USD) ACC","LU0170899867.USD":"EASTSPRING INVESTMENTS WORLD VALUE EQUITY  \"A\" (USD) ACC","LU2041044095.USD":"Blackrock Circular Economy A2 USD","IE00BFXG0V08.USD":"BNY MELLON GLOBAL LEADERS \"B\" (USD) ACC","NVDW":"NVDA周配息ETF-Roundhill","IE00BHPRN162.USD":"BNY MELLON BLOCKCHAIN INNOVATION \"B\" (USD) ACC","LU1868836591.USD":"CT (LUX) I AMERICAN \"1U\"(USD) ACC","LU2279689827.SGD":"JPMorgan Investment Funds - Global Income Sustainable A (mth) SGD-H","NVDX":"2倍做多NVDA ETF-T-Rex","SG9999014906.USD":"大华全球优质成长基金Acc USD","LU1868836757.USD":"CT (LUX) I AMERICAN FUND \"2\" (USD) ACC","LU2347655156.SGD":"JPMorgan Investment Funds - Global Income A (icdiv) SGD-H","NVDY":"NVDA期权收益策略ETF-YieldMax","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","NVII":"Rex NVDA Growth & Income ETF","IE00BBT3K403.USD":"LEGG MASON CLEARBRIDGE TACTICAL DIVIDEND INCOME \"A(USD) ACC","IE00B775SV38.USD":"NEUBERGER BERMAN US MULTICAP OPPORTUNITIES \"A\" (USD) ACC","LU0889566641.SGD":"FTSF - Templeton Shariah Global Equity A Acc SGD","LU2430703095.HKD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4\" (HKD) INC","LU0053666078.USD":"摩根大通基金-美国股票A（离岸）美元","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU2430703178.SGD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (SGDHDG) INC","BK4592":"伊斯兰概念","LU0211327993.USD":"TEMPLETON GLOBAL EQUITY INCOME \"A\" (USD) ACC","LU1551013425.SGD":"Allianz Income and Growth Cl AMg2 DIS H2-SGD","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0795875169.SGD":"JPMorgan Investment Funds - Global Income A (div) SGD-H","LU1983260115.SGD":"Janus Henderson Horizon Global Sustainable Equity A2 SGD-H","LU0082616367.USD":"摩根大通美国科技A（dist）","LU2430703251.USD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4\" (USD) INC","LU2360108059.USD":"BGF CIRCULAR ECONOMY \"A4\" (USD) INC","LU1035775433.USD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (USD) INC","BK4591":"室温超导概念","IE00BLSP4452.SGD":"Legg Mason ClearBridge - Tactical Dividend Income A Mdis SGD-H Plus","LU2272731782.SGD":"Allianz Global Intelligent Cities AM Dis H2-SGD","LU1023057109.AUD":"BGF CHINA \"A2\" (AUDHDG) ACC","LU0949170772.SGD":"Blackrock Global Equity Income A6 SGD-H","SG9999002232.USD":"Allianz Global High Payout USD","LU1003077747.HKD":"BGF GLOBAL EQUITY INCOME \"A6\" (HKDHDG) INC","LU2272731600.USD":"Allianz Global Intelligent Cities AM Dis USD","LU2087621335.USD":"ALLSPRING GLOBAL FACTOR ENHANCED EQUITY \"A\" (USD) ACC","NVYY":"GraniteShares YieldBOOST NVDA ETF","IE0004091025.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"B\" (USD) ACC","SG9999002224.SGD":"Allianz Global High Payout SGD","LU0417517546.SGD":"Allianz US Equity Cl AT Acc SGD","IE00BJJMRX11.SGD":"Janus Henderson Balanced A Acc SGD","SG9999015341.SGD":"United Income Focus Trust Acc SGD-H","LU1934455863.HKD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (HKD) ACC"},"source_url":"","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1103704030","content_text":"At the International Symposium on Circuits and Systems (ISCAS 2026) held in Shanghai, a premier academic event for global semiconductor scholars, He Tingbo, a Huawei director and President of its Semiconductor Business Unit, delivered a keynote speech titled \"Exploring and Practicing New Semiconductor Paths.\" During this speech, she officially introduced the \"Tau (τ) Law.\"\nThis marks the first time China has proposed new principles guiding industrial development in the global semiconductor field, presenting a comprehensive new theoretical framework for the continuous improvement of chip performance.\nHowever, before discussing what the \"Tau Law\" entails, a fundamental question must be answered: why is a \"new\" law needed at all?\nThis brings us back to a dilemma known to all but understood by few: has Moore's Law truly reached its end?\nWhat conceptual shift does the \"Tau Law\" represent?\nThe issue isn't that Moore's Law itself is \"dead,\" but that its underlying logic of \"geometric scaling\" is hitting physical limits.\nFor over half a century, the semiconductor industry's rule was simple: make transistors smaller, pack more components into the same area, and performance automatically improves, power consumption decreases, and costs are reduced. This logic held for nodes down to several tens of nanometers. However, progressing from tens of nanometers to single-digit nanometers has seen physical challenges and engineering costs increase exponentially.\nSpecifically, as process nodes approach 2nm and 1nm, individual atoms become significant hurdles. Quantum tunneling effects cause disruptive \"leakage,\" where electrons pass through barriers they shouldn't. Controlling current becomes increasingly difficult, making power consumption and heat dissipation major challenges. Factory construction costs soar, with a single 3nm fab now costing at least $20 billion, reducing the number of global players capable of such investment from dozens to just a handful.\nWhile the marginal returns of scaling are diminishing sharply, the demand for computing power from AI, large models, and autonomous driving is growing exponentially. This widening gap is the fundamental problem Huawei's \"Tau Law\" seeks to address.\nHe Tingbo's answer is: stop focusing solely on \"size\" and start focusing on \"time.\"\nThis is the core shift of the \"Tau Law\": replacing \"geometric scaling\" with \"temporal scaling.\"\nThe Four-Level Optimization of the \"Tau Law\"\n\"Temporal scaling\" may sound abstract, but its breakdown is straightforward. In the semiconductor world, a chip's performance and transistor density are ultimately determined by a factor called the \"time constant τ\" (the Greek letter tau, pronounced \"Tao\" in Chinese). It represents the time required for a signal to travel from one point to another within a chip. The faster the signal travels, the shorter its path, and the lower its latency, the more data can be processed per unit time, naturally leading to higher transistor density and performance.\nHistorically, the industry's approach to improving performance was to \"make transistors smaller,\" allowing for denser wiring and shorter signal travel distances. Huawei's approach is different: achieve the same effect by systematically compressing signal propagation delay without significantly shrinking transistor size.\nThis concept is akin to optimizing traffic flow during rush hour. Instead of widening roads (increasing size), the focus is on optimizing traffic lights, implementing tidal flow lanes, and building overpasses or tunnels to streamline traffic, thereby naturally increasing vehicle speed.\nThe core technology enabling this approach for Huawei is \"logic folding.\"\nTraditional chip circuit layouts are two-dimensional, with signals traversing laterally across the plane, spending significant time on interconnects. The essence of logic folding is expanding the circuit layout from a \"single floor\" to \"multiple floors.\" By \"folding\" critical paths that require long horizontal connections and stacking them vertically, the physical distance for signal propagation is dramatically shortened.\nLogic folding is just one key lever within Huawei's multi-level collaborative system. Based on Huawei's previously disclosed technology roadmap, the \"Tau Law\" constructs a four-level optimization system spanning devices, circuits, chips, and systems.\nAt the foundational device level, Huawei optimizes transistor resistance and parasitic capacitance, minimizing the time constant τ from the physical layer to build a solid base.\nAt the circuit level, logic folding technology breaks through the physical boundaries of traditional planar layouts, transforming circuits from single-layer to dual-layer or even multi-layer structures.\nAt the chip level, Huawei introduces full-stack co-design encompassing \"software, architecture, and chip.\" This approach allocates instruction and data flows based on actual workloads, ensuring the chip only computes what is necessary, reducing wasteful overhead, and minimizing end-to-end execution time.\nAt the top system level, Huawei has defined the \"Lingqu Bus,\" re-architecting computing system interconnect protocols to achieve \"super-node unified memory addressing and native memory semantics.\" This allows data exchange between different computing units to proceed with minimal \"congestion.\"\nThese four levels are not optimized in a linear, sequential manner but are interlocked like gears. To use an analogy, the traditional chip optimization path is like desperately piling sports cars onto an increasingly narrow road. The \"Tau Law,\" however, expands the roadmap to a broader dimension: devices, circuits, chips, and systems co-evolve, enabling signals to travel faster and computation to become smarter.\nThe High-End Chip Goals of the \"Tau Law\"\nThe ultimate validation of the \"Tau Law\" lies in its products.\nIn her speech, He Tingbo provided a key figure: over the past six years, Huawei has successfully designed and mass-produced 381 different chips based on this path, covering various fields including communications, computing, terminals, and automotive. This track record forms a significant foundation for the credibility of Huawei's \"Tau Law\" theory.\nWhat truly excites the market is the next-generation Kirin mobile chipset scheduled for release this autumn. According to He Tingbo, this chip will fully adopt logic folding technology, based on a new free logic design concept, expanding from a single layer to a dual layer, achieving a substantial leap in transistor density and system performance.\nHe Tingbo stated: \"We have achieved a series of advancements that would be difficult to attain solely through advanced process technology.\" This suggests Huawei may have successfully navigated a path independent of those taken by Taiwan Semiconductor Manufacturing, Samsung, and Intel.\nShe also revealed a longer-term goal: by 2031, high-end chips based on the \"Tau Law\" will achieve transistor density equivalent to that of a 1.4nm process node. This means Huawei aims to achieve integration density and computing capability on par with 1.4nm process technology through system-level temporal optimization.\nIs this a viable path? He Tingbo's words were: \"Our solution is viable and sustainable. The performance of our new chips can continuously compete with the other path.\"\nNew Technology Waves in the Global Semiconductor Industry\nIf the \"Tau Law\" can be understood as a paradigm shift from \"space\" to \"time,\" then another major trend in the global semiconductor industry is the shift from \"planar\" to \"three-dimensional.\"\nInterestingly, these two trends are converging at the same point in time.\nA wave of technologies represented by advanced packaging, Chiplet heterogeneous integration, and hybrid bonding is reshaping chip performance boundaries at an unprecedented pace and scale. Their core rationale aligns with that of the \"Tau Law\": rather than relying on the infinite scaling of transistors themselves, they drive continuous leaps in system-level performance through smarter integration and interconnection methods.\nFirst, consider advanced packaging. If discussions about \"how many nanometers\" defined the industry for decades, the focus from 2024 to 2026 is rapidly shifting toward advanced packaging. According to Yole Group, the global advanced packaging market is projected to reach approximately $53.1 billion in 2025, with expectations to grow to $79.4 billion by 2030, representing a compound annual growth rate (CAGR) of about 8.4%. More striking is the growth rate of 2.5D/3D packaging, with a CAGR of 37% projected between 2023 and 2029.\nWhy such rapid growth? The reason is straightforward: explosive demand for AI chips. Advanced packaging, exemplified by Taiwan Semiconductor Manufacturing's CoWoS, places GPU cores and high-bandwidth memory (HBM) in close proximity, compressing signal transmission distances from the millimeter to the micrometer scale. This serves as the \"invisible foundation\" for the computing power explosion in the era of large AI models. Data indicates that global capacity for 2.5D and 3D advanced packaging remains insufficient to meet demand, with lead times for some orders exceeding one year and a supply gap estimated at around 23%. Leading global manufacturers are embarking on massive expansion efforts: Taiwan Semiconductor Manufacturing plans to establish seven advanced packaging fabs, aiming to increase annual capacity from 1.3 million wafers to 2 million wafers by 2027, a roughly 53.85% increase.\nNext, consider Chiplets. The logic behind this technology is to break down a large monolithic chip into multiple smaller chiplets, each manufactured using the optimal process node, and then \"bond\" them together via advanced packaging—similar to \"cutting a large chessboard into smaller puzzle pieces and reassembling them.\" Chiplet architecture is already widely deployed in AI chips. For domestic chip manufacturers, this technology holds particular strategic significance: it allows critical core modules to use advanced process nodes while employing mature nodes for non-critical I/O and memory modules. This effectively mitigates limitations in accessing advanced processes, achieving \"system-level performance with finite resources.\"\nIf Chiplets are about \"building blocks,\" then hybrid bonding is the \"glue\" that determines whether these blocks can be stacked stably and densely. The breakthrough of hybrid bonding lies in its elimination of solder bumps, enabling direct copper-to-copper contact at the atomic level for direct bonding between chips. Compared to traditional thermal compression bonding, hybrid bonding can increase interconnect density by one to two orders of magnitude, with extremely low parasitic capacitance, significantly reducing signal delay and power consumption.\nThis technology is viewed by the industry as \"an essential technology roadmap for the next decade in the post-Moore era.\" In terms of practical implementation, memory giants are fully engaged. SK hynix and Samsung are paving the way for next-generation HBM, with hybrid bonding expected to be introduced starting with HBM4. Validation of 16-layer HBM stacked structures is underway. The hybrid bonding equipment market is projected to grow at a CAGR of 69%, far exceeding the overall semiconductor industry growth rate.\nThere is an even more cutting-edge direction: silicon photonics interconnection and co-packaged optics (CPO).\nThe fundamental bottleneck in signal transmission is shifting from within chips to interconnections between chips and even between server racks. Traditional copper interconnects suffer from high loss at high frequencies and limited distance, increasingly struggling to meet the bandwidth demands of large-scale AI clusters. The core idea of silicon photonics is to use light instead of electrical signals for transmission, offering higher speed, lower latency, and significantly reduced power consumption.\nAt a technology forum in May 2026, Taiwan Semiconductor Manufacturing prominently disclosed its \"three-layer cake\" AI platform architecture: the bottom layer is the compute layer, the middle is the packaging integration layer (CoWoS/SoIC), and the top layer is the \"most important for the future\" photonic interconnect layer (COUPE). COUPE technology employs 3D heterogeneous integration to vertically stack electronic and photonic chips, bringing components extremely close together and drastically reducing electrical coupling loss. According to Taiwan Semiconductor Manufacturing, mass production of the world's first 200Gbps micro-ring modulator using COUPE technology has commenced this year, with a bit error rate below one in 100 million. Compared to traditional copper wires, COUPE can improve system energy efficiency by 4 times and reduce latency by 10 times; when deeply integrated with the packaging platform, energy efficiency can improve by up to 10 times, with latency reduced by 20 times.\nGuojin Securities explicitly stated in its latest research report: 2026 marks the first year of CPO industrialization. Core players in the supply chain like Taiwan Semiconductor Manufacturing, NVIDIA, and Broadcom are actively entering the field, signaling the formal commencement of large-scale deployment of \"optics replacing copper\" in AI data centers.\nConclusion\nIn the long term, Huawei's \"Tau Law\" is highly aligned with the direction of the entire industry's technological evolution. Whether termed \"temporal scaling\" or \"advanced packaging,\" the underlying essence reflects a fundamental consensus: improving chip performance can no longer rely solely on \"making transistors smaller.\"\nThe real competition is shifting to a new set of dimensions: interconnect density, signal latency, system synergy, vertical stacking, and optical interconnection. The combinatorial effects of these dimensions are far more complex and expansive than simply shrinking a node. In Huawei's own words, from 2026 to 2035, as numerous exploratory technologies gradually become productized, transistor density will continue to increase, operating frequencies will continue to grow, and a steady stream of high-performance chips will emerge.\nAt the conclusion of her speech, He Tingbo made a meaningful statement: \"The future certainly belongs to open cooperation. On the path of semiconductor evolution, no single enterprise can provide all the answers alone. Under the path of the 'Tau Law,' we look forward to close collaboration with global scientists, engineers, and industry partners to jointly promote the sustainable development of the semiconductor and electronics industries.\"\nThe semiconductor supply chain is too long and complex for any single country or company to dominate all segments. Every link—from semiconductor equipment including lithography machines, to packaging substrate materials, EDA tools, CPO standard systems—requires global collaboration. By proposing the \"Tau Law,\" Huawei is offering the world a compatible, open, and alternative Chinese solution at a critical juncture when the semiconductor industry is searching for new growth curves.","news_type":1,"symbols_score_info":{"07788":1,"NVDA":1,"INTC":1,"NVD3.UK":1,"SNVD.UK":1,"AVGW":1,"AVGG":1,"AVS":1,"NVDQ":1,"03145":1,"AVGU":1,"NVYY":1,"NVDU":1,"AVGX":1,"NVDS":1,"NVII":1,"NVDW":1,"SOX":1,"NVDO":1,"TSMY":1,"NVIW.SI":1,"DIPS":1,"NVDB":1,"AVL":1,"LINT":1,"04335":1,"NVD2.UK":1,"NVDG":1,"TSMU":1,"NVDX":1,"NVD":1,"NVDS.UK":1,"ANV":1,"STSM":1,"TSM":1,"TSMX":1,"NVDY":1,"07388":1,"NVDD":1,"3NVD.UK":1,"AVGO":1,"2NVD.UK":1,"INTW":1,"TSMG":1,"NVDL":1,"TSMZ":1}},"isVote":1,"tweetType":1,"viewCount":75,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":453765832237912,"gmtCreate":1751805052346,"gmtModify":1751805056258,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"idStr":"4097888403268910","authorIdStr":"4097888403268910"},"themes":[],"title":"","htmlText":"Let’s hope our nation continue to progress and be inclusive to all","listText":"Let’s hope our nation continue to progress and be inclusive to all","text":"Let’s hope our nation continue to progress and be inclusive to all","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/453765832237912","isVote":1,"tweetType":1,"viewCount":1362,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9946708423,"gmtCreate":1681046129163,"gmtModify":1681046132749,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"idStr":"4097888403268910","authorIdStr":"4097888403268910"},"themes":[],"title":"","htmlText":"More such games pls!!!! More fun&nbsp;","listText":"More such games pls!!!! More fun&nbsp;","text":"More such games pls!!!! More fun","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9946708423","isVote":1,"tweetType":1,"viewCount":2167,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9946686685,"gmtCreate":1680941717847,"gmtModify":1680941724856,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"idStr":"4097888403268910","authorIdStr":"4097888403268910"},"themes":[],"title":"","htmlText":"Way to goooooooo. Awesome&nbsp;","listText":"Way to goooooooo. Awesome&nbsp;","text":"Way to goooooooo. Awesome","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9946686685","isVote":1,"tweetType":1,"viewCount":2301,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9948182442,"gmtCreate":1680651548087,"gmtModify":1680651552837,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"idStr":"4097888403268910","authorIdStr":"4097888403268910"},"themes":[],"title":"","htmlText":"I believe that given the world is shortage of food. #beyondmeat is one area that we can lookat for alternatives. Just a thought","listText":"I believe that given the world is shortage of food. #beyondmeat is one area that we can lookat for alternatives. Just a thought","text":"I believe that given the world is shortage of food. #beyondmeat is one area that we can lookat for alternatives. Just a thought","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9948182442","isVote":1,"tweetType":1,"viewCount":2122,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9948186684,"gmtCreate":1680651199548,"gmtModify":1680651203253,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"idStr":"4097888403268910","authorIdStr":"4097888403268910"},"themes":[],"title":"","htmlText":"More such games. Time filler and easy to play&nbsp;","listText":"More such games. Time filler and easy to play&nbsp;","text":"More such games. Time filler and easy to play","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":4,"commentSize":3,"repostSize":3,"link":"https://ttm.financial/post/9948186684","isVote":1,"tweetType":1,"viewCount":3580,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9940638005,"gmtCreate":1677854278408,"gmtModify":1677855055640,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"idStr":"4097888403268910","authorIdStr":"4097888403268910"},"themes":[],"title":"","htmlText":"Nice","listText":"Nice","text":"Nice","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":2,"commentSize":1,"repostSize":0,"link":"https://ttm.financial/post/9940638005","repostId":"1158974451","repostType":2,"repost":{"id":"1158974451","kind":"news","weMediaInfo":{"introduction":"Providing stock market headlines, business news, financials and earnings ","home_visible":1,"media_name":"Tiger Newspress","id":"1079075236","head_image":"https://static.tigerbbs.com/8274c5b9d4c2852bfb1c4d6ce16c68ba"},"pubTimestamp":1677854020,"share":"https://ttm.financial/m/news/1158974451?lang=en_US&edition=fundamental","pubTime":"2023-03-03 22:33","market":"us","language":"en","title":"C3.ai Stock Rallies 15% in Morning Trading As Results Top Guidance","url":"https://stock-news.laohu8.com/highlight/detail?id=1158974451","media":"Tiger Newspress","summary":"C3.ai shares surged over 15% in morning trading as the artificial intelligence software company turn","content":"<html><head></head><body><p><a href=\"https://laohu8.com/S/AI\">C3.ai</a> shares surged over 15% in morning trading as the artificial intelligence software company turned in a better-than-expected fiscal third-quarter report and suggested the more business strength is in the works.</p><p><img src=\"https://static.tigerbbs.com/b24a00b697fb27556a9800c00fa0edc0\" tg-width=\"824\" tg-height=\"687\" width=\"100%\" height=\"auto\"/></p><p><a href=\"https://laohu8.com/S/AI\">C3.ai</a> said that for the quarter ending January 31, it lost 6 cents a share, excluding one-time items, on revenue of $66.7M, compared to a loss of 7 cents a share, on $69.8M in sales in the same period a year ago.</p><p>Sales from subscriptions totaled $57M.</p><p>The company&#39;s results beat the estimates of Wall Street analysts, who had forecast C3.ai (AI) to lose 22 cents a share, on $64.25M in revenue.</p><p>Chief Executive Thomas Siebel said the company&#39;s results shows &#34;the overall business sentiment appears to be improving&#34; and C3.ai (AI) is seeing &#34;a dramatic change from what we experienced&#34; in the middle of 2022.</p><p>For its fiscal fourth-quarter, C3.ai (AI) estimates revenue will be in a range of $70M to $72M.</p><p>The AI market has been the source of widespread attention and investments by some of the world&#39;s biggest tech companies of late. On Thursday, Apple (AAPL) reportedly blocked an update to an email app that uses AI technology due to concerns about improper content reaching young children.</p></body></html>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>C3.ai Stock Rallies 15% in Morning Trading As Results Top Guidance</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nC3.ai Stock Rallies 15% in Morning Trading As Results Top Guidance\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1079075236\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/8274c5b9d4c2852bfb1c4d6ce16c68ba);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Tiger Newspress </p>\n<p class=\"h-time\">2023-03-03 22:33</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html><head></head><body><p><a href=\"https://laohu8.com/S/AI\">C3.ai</a> shares surged over 15% in morning trading as the artificial intelligence software company turned in a better-than-expected fiscal third-quarter report and suggested the more business strength is in the works.</p><p><img src=\"https://static.tigerbbs.com/b24a00b697fb27556a9800c00fa0edc0\" tg-width=\"824\" tg-height=\"687\" width=\"100%\" height=\"auto\"/></p><p><a href=\"https://laohu8.com/S/AI\">C3.ai</a> said that for the quarter ending January 31, it lost 6 cents a share, excluding one-time items, on revenue of $66.7M, compared to a loss of 7 cents a share, on $69.8M in sales in the same period a year ago.</p><p>Sales from subscriptions totaled $57M.</p><p>The company&#39;s results beat the estimates of Wall Street analysts, who had forecast C3.ai (AI) to lose 22 cents a share, on $64.25M in revenue.</p><p>Chief Executive Thomas Siebel said the company&#39;s results shows &#34;the overall business sentiment appears to be improving&#34; and C3.ai (AI) is seeing &#34;a dramatic change from what we experienced&#34; in the middle of 2022.</p><p>For its fiscal fourth-quarter, C3.ai (AI) estimates revenue will be in a range of $70M to $72M.</p><p>The AI market has been the source of widespread attention and investments by some of the world&#39;s biggest tech companies of late. On Thursday, Apple (AAPL) reportedly blocked an update to an email app that uses AI technology due to concerns about improper content reaching young children.</p></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"AI":"C3.ai, Inc."},"source_url":"","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1158974451","content_text":"C3.ai shares surged over 15% in morning trading as the artificial intelligence software company turned in a better-than-expected fiscal third-quarter report and suggested the more business strength is in the works.C3.ai said that for the quarter ending January 31, it lost 6 cents a share, excluding one-time items, on revenue of $66.7M, compared to a loss of 7 cents a share, on $69.8M in sales in the same period a year ago.Sales from subscriptions totaled $57M.The company's results beat the estimates of Wall Street analysts, who had forecast C3.ai (AI) to lose 22 cents a share, on $64.25M in revenue.Chief Executive Thomas Siebel said the company's results shows \"the overall business sentiment appears to be improving\" and C3.ai (AI) is seeing \"a dramatic change from what we experienced\" in the middle of 2022.For its fiscal fourth-quarter, C3.ai (AI) estimates revenue will be in a range of $70M to $72M.The AI market has been the source of widespread attention and investments by some of the world's biggest tech companies of late. On Thursday, Apple (AAPL) reportedly blocked an update to an email app that uses AI technology due to concerns about improper content reaching young children.","news_type":1,"symbols_score_info":{"AI":0.9}},"isVote":1,"tweetType":1,"viewCount":3318,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9954248472,"gmtCreate":1676428290397,"gmtModify":1676428329558,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"idStr":"4097888403268910","authorIdStr":"4097888403268910"},"themes":[],"title":"","htmlText":"Hmmmm","listText":"Hmmmm","text":"Hmmmm","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":8,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9954248472","repostId":"1100424494","repostType":2,"repost":{"id":"1100424494","kind":"news","pubTimestamp":1676427208,"share":"https://ttm.financial/m/news/1100424494?lang=en_US&edition=fundamental","pubTime":"2023-02-15 10:13","market":"sg","language":"en","title":"Here Are the Winners and Losers From Singapore’s Budget","url":"https://stock-news.laohu8.com/highlight/detail?id=1100424494","media":"Bloomberg","summary":"Increase in handouts is positive for consumer stocks: AletheiaHigher taxes may weigh on property and","content":"<div>\n<p>Increase in handouts is positive for consumer stocks: AletheiaHigher taxes may weigh on property and multinational firmsSingapore’s budget moves to address the city-state’s high cost of living may ...</p>\n\n<a href=\"https://www.bloomberg.com/news/articles/2023-02-14/here-are-the-winners-and-losers-from-singapore-s-budget\">Source Link</a>\n\n</div>\n","source":"lsy1584095487587","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Here Are the Winners and Losers From Singapore’s Budget</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nHere Are the Winners and Losers From Singapore’s Budget\n</h2>\n\n<h4 class=\"meta\">\n\n\n2023-02-15 10:13 GMT+8&nbsp;&nbsp;&nbsp;<a href=https://www.bloomberg.com/news/articles/2023-02-14/here-are-the-winners-and-losers-from-singapore-s-budget><strong>Bloomberg</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>Increase in handouts is positive for consumer stocks: AletheiaHigher taxes may weigh on property and multinational firmsSingapore’s budget moves to address the city-state’s high cost of living may ...</p>\n\n<a href=\"https://www.bloomberg.com/news/articles/2023-02-14/here-are-the-winners-and-losers-from-singapore-s-budget\">Source Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"BSL.SI":"莱佛士医疗","F99.SI":"星狮集团","K71U.SI":"吉宝房地产信托","CHZ.SI":"和乐集团有限公司","OV8.SI":"昇菘","42R.SI":"珍宝餐饮集团","STI.SI":"富时新加坡海峡指数","Q0F.SI":"IHH医疗保健集团"},"source_url":"https://www.bloomberg.com/news/articles/2023-02-14/here-are-the-winners-and-losers-from-singapore-s-budget","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1100424494","content_text":"Increase in handouts is positive for consumer stocks: AletheiaHigher taxes may weigh on property and multinational firmsSingapore’s budget moves to address the city-state’s high cost of living may benefit stocks tied to consumers, while the property sector and multinational corporations may suffer as a result of higher taxation.In his speech on Tuesday, Deputy Prime Minister Lawrence Wong said the government will increase handouts to citizens to help offset the increase in goods and services tax and rising living costs. On the other hand, he raised taxes on higher-value property, multinational corporations, and luxury cars. Nonetheless, the benchmark Straits Times Index closed little changed on the day.“Addressing the cost of living is a major positive for local consumption as inflation is running high,” said Nirgunan Tiruchelvam, an analyst at Aletheia Capital Ltd. “The increase in handouts and the focus on creating job opportunities will aid stocks tied to consumers.”The S$104-billion ($78.4-billion) spending plan is intended to push residents closer to a post-Covid reality while easing near-term cost-of-living pressures.Here are details of what analysts see as the main winners and losers from the budget:WINNERSConsumer StocksSingapore’s plan to increase its handouts to citizens by S$3 billion to S$9.6 billion in the fiscal year starting April, to help offset higher price pressures, will be positive for stocks tied to local consumption.Food and beverage manufacturer Fraser and Neave Ltd., grocer Sheng Siong Group Ltd. and restaurants and food caterers such as Jumbo Group Ltd. and Kimly Ltd. could all benefit. Keppel REIT and other consumption-focused real estate investment trusts may also gain.The moves could also help vulnerable borrowers cope with rising inflation, offsetting potential threats to local banks’ risk profile,” Bloomberg Intelligence analysts Rena Kwok and Sheenu Gupta wrote in a note.Aged CareSingapore’s move to add more resources for lower-income seniors can aid hospital operators such as Raffles Medical Group Ltd. and IHH Healthcare Bhd.Wong plans to top up the ElderCare Fund by S$500 million and the MediFund by S$1.5 billion.ManpowerWong’s plans aimed at turbocharging job opportunities for Singaporeans implies more business for staffing-solutions providers such as HRnetgroup Ltd.The city-state will top up national productivity fund by S$4 billion, develop labor-market intermediaries who can go through industry training and employment facilitation, and extend the Senior Employment Credit and the Part-time Re-employment Grant.HRnetgroup’s shares extended gains after budget announcements to close 2.4% higher.LOSERSPropertySingapore will raise taxes for higher-value properties in an attempt to boost revenue and help fund an array of spending programs.The residential properties in excess of S$1.5 million and up to S$3 million will be taxed one percentage point higher at 5%. Properties in excess of S$3 million will be taxed two percentage points higher at 6%.Stocks to watch include property firms such as City Developments Ltd. and UOL Group Ltd.MultinationalsSingapore intends to set its effective tax rate for multinational enterprises at 15% starting 2025, in line with a global agreement to increase the floor rate. Some world-renowned multinationals with presence in Singapore include Apple Inc., Sony Group Corp. and Amazon.com Inc.Such a move may also weigh on multiple members of the Straits Times Index, if they qualify as multinational corporations under local laws.","news_type":1,"symbols_score_info":{"42R.SI":0.9,"K71U.SI":0.9,"CHZ.SI":0.9,"BSL.SI":0.9,"STI.SI":0.9,"F99.SI":0.9,"Q0F.SI":0.9,"OV8.SI":0.9}},"isVote":1,"tweetType":1,"viewCount":2136,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9955423244,"gmtCreate":1675690417089,"gmtModify":1675691344396,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"idStr":"4097888403268910","authorIdStr":"4097888403268910"},"themes":[],"title":"","htmlText":"<a href=\"https://ttm.financial/S/BK4587\">$ChatGPT(BK4587)$&nbsp;</a> Following on this, seems like a potential&nbsp;","listText":"<a href=\"https://ttm.financial/S/BK4587\">$ChatGPT(BK4587)$&nbsp;</a> Following on this, seems like a potential&nbsp;","text":"$ChatGPT(BK4587)$ Following on this, seems like a potential","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9955423244","isVote":1,"tweetType":1,"viewCount":2246,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9080109994,"gmtCreate":1649854013983,"gmtModify":1676534590153,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"idStr":"4097888403268910","authorIdStr":"4097888403268910"},"themes":[],"title":"","htmlText":"#investHonestly I think invest in tech companies is the&nbsp;way to go","listText":"#investHonestly I think invest in tech companies is the&nbsp;way to go","text":"#investHonestly I think invest in tech companies is the way to go","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9080109994","isVote":1,"tweetType":1,"viewCount":3394,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0}],"hots":[{"id":9948186684,"gmtCreate":1680651199548,"gmtModify":1680651203253,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"authorIdStr":"4097888403268910","idStr":"4097888403268910"},"themes":[],"title":"","htmlText":"More such games. Time filler and easy to play&nbsp;","listText":"More such games. Time filler and easy to play&nbsp;","text":"More such games. Time filler and easy to play","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":4,"commentSize":3,"repostSize":3,"link":"https://ttm.financial/post/9948186684","isVote":1,"tweetType":1,"viewCount":3580,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":568210194704112,"gmtCreate":1779752466036,"gmtModify":1779752469672,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"authorIdStr":"4097888403268910","idStr":"4097888403268910"},"themes":[],"title":"","htmlText":"This shows china's prowess","listText":"This shows china's prowess","text":"This shows china's prowess","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/568210194704112","repostId":"1103704030","repostType":2,"repost":{"id":"1103704030","kind":"news","weMediaInfo":{"introduction":"Global Stock Market Deep Analysis","home_visible":1,"media_name":"Deep News","id":"1039043262","head_image":"https://community-static.tradeup.com/news/8296859682db4b478146245e72de1922"},"pubTimestamp":1779687219,"share":"https://ttm.financial/m/news/1103704030?lang=en_US&edition=fundamental","pubTime":"2026-05-25 13:33","market":"sg","language":"en","title":"Huawei's 'Tau Law' Aims for 1.4nm Equivalent by 2031: A New Paradigm for Chip Performance","url":"https://stock-news.laohu8.com/highlight/detail?id=1103704030","media":"Deep News","summary":"At the International Symposium on Circuits and Systems (ISCAS 2026) held in Shanghai, a premier academic event for global semiconductor scholars, He Tingbo, a Huawei director and President of its...","content":"<p>At the International Symposium on Circuits and Systems (ISCAS 2026) held in Shanghai, a premier academic event for global semiconductor scholars, He Tingbo, a Huawei director and President of its Semiconductor Business Unit, delivered a keynote speech titled \"Exploring and Practicing New Semiconductor Paths.\" During this speech, she officially introduced the \"Tau (τ) Law.\"</p>\n<p>This marks the first time China has proposed new principles guiding industrial development in the global semiconductor field, presenting a comprehensive new theoretical framework for the continuous improvement of chip performance.</p>\n<p>However, before discussing what the \"Tau Law\" entails, a fundamental question must be answered: why is a \"new\" law needed at all?</p>\n<p>This brings us back to a dilemma known to all but understood by few: has Moore's Law truly reached its end?</p>\n<p>What conceptual shift does the \"Tau Law\" represent?\nThe issue isn't that Moore's Law itself is \"dead,\" but that its underlying logic of \"geometric scaling\" is hitting physical limits.</p>\n<p>For over half a century, the semiconductor industry's rule was simple: make transistors smaller, pack more components into the same area, and performance automatically improves, power consumption decreases, and costs are reduced. This logic held for nodes down to several tens of nanometers. However, progressing from tens of nanometers to single-digit nanometers has seen physical challenges and engineering costs increase exponentially.</p>\n<p>Specifically, as process nodes approach 2nm and 1nm, individual atoms become significant hurdles. Quantum tunneling effects cause disruptive \"leakage,\" where electrons pass through barriers they shouldn't. Controlling current becomes increasingly difficult, making power consumption and heat dissipation major challenges. Factory construction costs soar, with a single 3nm fab now costing at least $20 billion, reducing the number of global players capable of such investment from dozens to just a handful.</p>\n<p>While the marginal returns of scaling are diminishing sharply, the demand for computing power from AI, large models, and autonomous driving is growing exponentially. This widening gap is the fundamental problem Huawei's \"Tau Law\" seeks to address.</p>\n<p>He Tingbo's answer is: stop focusing solely on \"size\" and start focusing on \"time.\"</p>\n<p>This is the core shift of the \"Tau Law\": replacing \"geometric scaling\" with \"temporal scaling.\"</p>\n<p>The Four-Level Optimization of the \"Tau Law\"\n\"Temporal scaling\" may sound abstract, but its breakdown is straightforward. In the semiconductor world, a chip's performance and transistor density are ultimately determined by a factor called the \"time constant τ\" (the Greek letter tau, pronounced \"Tao\" in Chinese). It represents the time required for a signal to travel from one point to another within a chip. The faster the signal travels, the shorter its path, and the lower its latency, the more data can be processed per unit time, naturally leading to higher transistor density and performance.</p>\n<p>Historically, the industry's approach to improving performance was to \"make transistors smaller,\" allowing for denser wiring and shorter signal travel distances. Huawei's approach is different: achieve the same effect by systematically compressing signal propagation delay without significantly shrinking transistor size.</p>\n<p>This concept is akin to optimizing traffic flow during rush hour. Instead of widening roads (increasing size), the focus is on optimizing traffic lights, implementing tidal flow lanes, and building overpasses or tunnels to streamline traffic, thereby naturally increasing vehicle speed.</p>\n<p>The core technology enabling this approach for Huawei is \"logic folding.\"</p>\n<p>Traditional chip circuit layouts are two-dimensional, with signals traversing laterally across the plane, spending significant time on interconnects. The essence of logic folding is expanding the circuit layout from a \"single floor\" to \"multiple floors.\" By \"folding\" critical paths that require long horizontal connections and stacking them vertically, the physical distance for signal propagation is dramatically shortened.</p>\n<p>Logic folding is just one key lever within Huawei's multi-level collaborative system. Based on Huawei's previously disclosed technology roadmap, the \"Tau Law\" constructs a four-level optimization system spanning devices, circuits, chips, and systems.</p>\n<p>At the foundational device level, Huawei optimizes transistor resistance and parasitic capacitance, minimizing the time constant τ from the physical layer to build a solid base.</p>\n<p>At the circuit level, logic folding technology breaks through the physical boundaries of traditional planar layouts, transforming circuits from single-layer to dual-layer or even multi-layer structures.</p>\n<p>At the chip level, Huawei introduces full-stack co-design encompassing \"software, architecture, and chip.\" This approach allocates instruction and data flows based on actual workloads, ensuring the chip only computes what is necessary, reducing wasteful overhead, and minimizing end-to-end execution time.</p>\n<p>At the top system level, Huawei has defined the \"Lingqu Bus,\" re-architecting computing system interconnect protocols to achieve \"super-node unified memory addressing and native memory semantics.\" This allows data exchange between different computing units to proceed with minimal \"congestion.\"</p>\n<p>These four levels are not optimized in a linear, sequential manner but are interlocked like gears. To use an analogy, the traditional chip optimization path is like desperately piling sports cars onto an increasingly narrow road. The \"Tau Law,\" however, expands the roadmap to a broader dimension: devices, circuits, chips, and systems co-evolve, enabling signals to travel faster and computation to become smarter.</p>\n<p>The High-End Chip Goals of the \"Tau Law\"\nThe ultimate validation of the \"Tau Law\" lies in its products.</p>\n<p>In her speech, He Tingbo provided a key figure: over the past six years, Huawei has successfully designed and mass-produced 381 different chips based on this path, covering various fields including communications, computing, terminals, and automotive. This track record forms a significant foundation for the credibility of Huawei's \"Tau Law\" theory.</p>\n<p>What truly excites the market is the next-generation Kirin mobile chipset scheduled for release this autumn. According to He Tingbo, this chip will fully adopt logic folding technology, based on a new free logic design concept, expanding from a single layer to a dual layer, achieving a substantial leap in transistor density and system performance.</p>\n<p>He Tingbo stated: \"We have achieved a series of advancements that would be difficult to attain solely through advanced process technology.\" This suggests Huawei may have successfully navigated a path independent of those taken by Taiwan Semiconductor Manufacturing, Samsung, and Intel.</p>\n<p>She also revealed a longer-term goal: by 2031, high-end chips based on the \"Tau Law\" will achieve transistor density equivalent to that of a 1.4nm process node. This means Huawei aims to achieve integration density and computing capability on par with 1.4nm process technology through system-level temporal optimization.</p>\n<p>Is this a viable path? He Tingbo's words were: \"Our solution is viable and sustainable. The performance of our new chips can continuously compete with the other path.\"</p>\n<p>New Technology Waves in the Global Semiconductor Industry\nIf the \"Tau Law\" can be understood as a paradigm shift from \"space\" to \"time,\" then another major trend in the global semiconductor industry is the shift from \"planar\" to \"three-dimensional.\"</p>\n<p>Interestingly, these two trends are converging at the same point in time.</p>\n<p>A wave of technologies represented by advanced packaging, Chiplet heterogeneous integration, and hybrid bonding is reshaping chip performance boundaries at an unprecedented pace and scale. Their core rationale aligns with that of the \"Tau Law\": rather than relying on the infinite scaling of transistors themselves, they drive continuous leaps in system-level performance through smarter integration and interconnection methods.</p>\n<p>First, consider advanced packaging. If discussions about \"how many nanometers\" defined the industry for decades, the focus from 2024 to 2026 is rapidly shifting toward advanced packaging. According to Yole Group, the global advanced packaging market is projected to reach approximately $53.1 billion in 2025, with expectations to grow to $79.4 billion by 2030, representing a compound annual growth rate (CAGR) of about 8.4%. More striking is the growth rate of 2.5D/3D packaging, with a CAGR of 37% projected between 2023 and 2029.</p>\n<p>Why such rapid growth? The reason is straightforward: explosive demand for AI chips. Advanced packaging, exemplified by Taiwan Semiconductor Manufacturing's CoWoS, places GPU cores and high-bandwidth memory (HBM) in close proximity, compressing signal transmission distances from the millimeter to the micrometer scale. This serves as the \"invisible foundation\" for the computing power explosion in the era of large AI models. Data indicates that global capacity for 2.5D and 3D advanced packaging remains insufficient to meet demand, with lead times for some orders exceeding one year and a supply gap estimated at around 23%. Leading global manufacturers are embarking on massive expansion efforts: Taiwan Semiconductor Manufacturing plans to establish seven advanced packaging fabs, aiming to increase annual capacity from 1.3 million wafers to 2 million wafers by 2027, a roughly 53.85% increase.</p>\n<p>Next, consider Chiplets. The logic behind this technology is to break down a large monolithic chip into multiple smaller chiplets, each manufactured using the optimal process node, and then \"bond\" them together via advanced packaging—similar to \"cutting a large chessboard into smaller puzzle pieces and reassembling them.\" Chiplet architecture is already widely deployed in AI chips. For domestic chip manufacturers, this technology holds particular strategic significance: it allows critical core modules to use advanced process nodes while employing mature nodes for non-critical I/O and memory modules. This effectively mitigates limitations in accessing advanced processes, achieving \"system-level performance with finite resources.\"</p>\n<p>If Chiplets are about \"building blocks,\" then hybrid bonding is the \"glue\" that determines whether these blocks can be stacked stably and densely. The breakthrough of hybrid bonding lies in its elimination of solder bumps, enabling direct copper-to-copper contact at the atomic level for direct bonding between chips. Compared to traditional thermal compression bonding, hybrid bonding can increase interconnect density by one to two orders of magnitude, with extremely low parasitic capacitance, significantly reducing signal delay and power consumption.</p>\n<p>This technology is viewed by the industry as \"an essential technology roadmap for the next decade in the post-Moore era.\" In terms of practical implementation, memory giants are fully engaged. SK hynix and Samsung are paving the way for next-generation HBM, with hybrid bonding expected to be introduced starting with HBM4. Validation of 16-layer HBM stacked structures is underway. The hybrid bonding equipment market is projected to grow at a CAGR of 69%, far exceeding the overall semiconductor industry growth rate.</p>\n<p>There is an even more cutting-edge direction: silicon photonics interconnection and co-packaged optics (CPO).</p>\n<p>The fundamental bottleneck in signal transmission is shifting from within chips to interconnections between chips and even between server racks. Traditional copper interconnects suffer from high loss at high frequencies and limited distance, increasingly struggling to meet the bandwidth demands of large-scale AI clusters. The core idea of silicon photonics is to use light instead of electrical signals for transmission, offering higher speed, lower latency, and significantly reduced power consumption.</p>\n<p>At a technology forum in May 2026, Taiwan Semiconductor Manufacturing prominently disclosed its \"three-layer cake\" AI platform architecture: the bottom layer is the compute layer, the middle is the packaging integration layer (CoWoS/SoIC), and the top layer is the \"most important for the future\" photonic interconnect layer (COUPE). COUPE technology employs 3D heterogeneous integration to vertically stack electronic and photonic chips, bringing components extremely close together and drastically reducing electrical coupling loss. According to Taiwan Semiconductor Manufacturing, mass production of the world's first 200Gbps micro-ring modulator using COUPE technology has commenced this year, with a bit error rate below one in 100 million. Compared to traditional copper wires, COUPE can improve system energy efficiency by 4 times and reduce latency by 10 times; when deeply integrated with the packaging platform, energy efficiency can improve by up to 10 times, with latency reduced by 20 times.</p>\n<p>Guojin Securities explicitly stated in its latest research report: 2026 marks the first year of CPO industrialization. Core players in the supply chain like Taiwan Semiconductor Manufacturing, NVIDIA, and Broadcom are actively entering the field, signaling the formal commencement of large-scale deployment of \"optics replacing copper\" in AI data centers.</p>\n<p>Conclusion\nIn the long term, Huawei's \"Tau Law\" is highly aligned with the direction of the entire industry's technological evolution. Whether termed \"temporal scaling\" or \"advanced packaging,\" the underlying essence reflects a fundamental consensus: improving chip performance can no longer rely solely on \"making transistors smaller.\"</p>\n<p>The real competition is shifting to a new set of dimensions: interconnect density, signal latency, system synergy, vertical stacking, and optical interconnection. The combinatorial effects of these dimensions are far more complex and expansive than simply shrinking a node. In Huawei's own words, from 2026 to 2035, as numerous exploratory technologies gradually become productized, transistor density will continue to increase, operating frequencies will continue to grow, and a steady stream of high-performance chips will emerge.</p>\n<p>At the conclusion of her speech, He Tingbo made a meaningful statement: \"The future certainly belongs to open cooperation. On the path of semiconductor evolution, no single enterprise can provide all the answers alone. Under the path of the 'Tau Law,' we look forward to close collaboration with global scientists, engineers, and industry partners to jointly promote the sustainable development of the semiconductor and electronics industries.\"</p>\n<p>The semiconductor supply chain is too long and complex for any single country or company to dominate all segments. Every link—from semiconductor equipment including lithography machines, to packaging substrate materials, EDA tools, CPO standard systems—requires global collaboration. By proposing the \"Tau Law,\" Huawei is offering the world a compatible, open, and alternative Chinese solution at a critical juncture when the semiconductor industry is searching for new growth curves.</p>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Huawei's 'Tau Law' Aims for 1.4nm Equivalent by 2031: A New Paradigm for Chip Performance</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nHuawei's 'Tau Law' Aims for 1.4nm Equivalent by 2031: A New Paradigm for Chip Performance\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1039043262\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/8296859682db4b478146245e72de1922);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Deep News </p>\n<p class=\"h-time\">2026-05-25 13:33</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<p>At the International Symposium on Circuits and Systems (ISCAS 2026) held in Shanghai, a premier academic event for global semiconductor scholars, He Tingbo, a Huawei director and President of its Semiconductor Business Unit, delivered a keynote speech titled \"Exploring and Practicing New Semiconductor Paths.\" During this speech, she officially introduced the \"Tau (τ) Law.\"</p>\n<p>This marks the first time China has proposed new principles guiding industrial development in the global semiconductor field, presenting a comprehensive new theoretical framework for the continuous improvement of chip performance.</p>\n<p>However, before discussing what the \"Tau Law\" entails, a fundamental question must be answered: why is a \"new\" law needed at all?</p>\n<p>This brings us back to a dilemma known to all but understood by few: has Moore's Law truly reached its end?</p>\n<p>What conceptual shift does the \"Tau Law\" represent?\nThe issue isn't that Moore's Law itself is \"dead,\" but that its underlying logic of \"geometric scaling\" is hitting physical limits.</p>\n<p>For over half a century, the semiconductor industry's rule was simple: make transistors smaller, pack more components into the same area, and performance automatically improves, power consumption decreases, and costs are reduced. This logic held for nodes down to several tens of nanometers. However, progressing from tens of nanometers to single-digit nanometers has seen physical challenges and engineering costs increase exponentially.</p>\n<p>Specifically, as process nodes approach 2nm and 1nm, individual atoms become significant hurdles. Quantum tunneling effects cause disruptive \"leakage,\" where electrons pass through barriers they shouldn't. Controlling current becomes increasingly difficult, making power consumption and heat dissipation major challenges. Factory construction costs soar, with a single 3nm fab now costing at least $20 billion, reducing the number of global players capable of such investment from dozens to just a handful.</p>\n<p>While the marginal returns of scaling are diminishing sharply, the demand for computing power from AI, large models, and autonomous driving is growing exponentially. This widening gap is the fundamental problem Huawei's \"Tau Law\" seeks to address.</p>\n<p>He Tingbo's answer is: stop focusing solely on \"size\" and start focusing on \"time.\"</p>\n<p>This is the core shift of the \"Tau Law\": replacing \"geometric scaling\" with \"temporal scaling.\"</p>\n<p>The Four-Level Optimization of the \"Tau Law\"\n\"Temporal scaling\" may sound abstract, but its breakdown is straightforward. In the semiconductor world, a chip's performance and transistor density are ultimately determined by a factor called the \"time constant τ\" (the Greek letter tau, pronounced \"Tao\" in Chinese). It represents the time required for a signal to travel from one point to another within a chip. The faster the signal travels, the shorter its path, and the lower its latency, the more data can be processed per unit time, naturally leading to higher transistor density and performance.</p>\n<p>Historically, the industry's approach to improving performance was to \"make transistors smaller,\" allowing for denser wiring and shorter signal travel distances. Huawei's approach is different: achieve the same effect by systematically compressing signal propagation delay without significantly shrinking transistor size.</p>\n<p>This concept is akin to optimizing traffic flow during rush hour. Instead of widening roads (increasing size), the focus is on optimizing traffic lights, implementing tidal flow lanes, and building overpasses or tunnels to streamline traffic, thereby naturally increasing vehicle speed.</p>\n<p>The core technology enabling this approach for Huawei is \"logic folding.\"</p>\n<p>Traditional chip circuit layouts are two-dimensional, with signals traversing laterally across the plane, spending significant time on interconnects. The essence of logic folding is expanding the circuit layout from a \"single floor\" to \"multiple floors.\" By \"folding\" critical paths that require long horizontal connections and stacking them vertically, the physical distance for signal propagation is dramatically shortened.</p>\n<p>Logic folding is just one key lever within Huawei's multi-level collaborative system. Based on Huawei's previously disclosed technology roadmap, the \"Tau Law\" constructs a four-level optimization system spanning devices, circuits, chips, and systems.</p>\n<p>At the foundational device level, Huawei optimizes transistor resistance and parasitic capacitance, minimizing the time constant τ from the physical layer to build a solid base.</p>\n<p>At the circuit level, logic folding technology breaks through the physical boundaries of traditional planar layouts, transforming circuits from single-layer to dual-layer or even multi-layer structures.</p>\n<p>At the chip level, Huawei introduces full-stack co-design encompassing \"software, architecture, and chip.\" This approach allocates instruction and data flows based on actual workloads, ensuring the chip only computes what is necessary, reducing wasteful overhead, and minimizing end-to-end execution time.</p>\n<p>At the top system level, Huawei has defined the \"Lingqu Bus,\" re-architecting computing system interconnect protocols to achieve \"super-node unified memory addressing and native memory semantics.\" This allows data exchange between different computing units to proceed with minimal \"congestion.\"</p>\n<p>These four levels are not optimized in a linear, sequential manner but are interlocked like gears. To use an analogy, the traditional chip optimization path is like desperately piling sports cars onto an increasingly narrow road. The \"Tau Law,\" however, expands the roadmap to a broader dimension: devices, circuits, chips, and systems co-evolve, enabling signals to travel faster and computation to become smarter.</p>\n<p>The High-End Chip Goals of the \"Tau Law\"\nThe ultimate validation of the \"Tau Law\" lies in its products.</p>\n<p>In her speech, He Tingbo provided a key figure: over the past six years, Huawei has successfully designed and mass-produced 381 different chips based on this path, covering various fields including communications, computing, terminals, and automotive. This track record forms a significant foundation for the credibility of Huawei's \"Tau Law\" theory.</p>\n<p>What truly excites the market is the next-generation Kirin mobile chipset scheduled for release this autumn. According to He Tingbo, this chip will fully adopt logic folding technology, based on a new free logic design concept, expanding from a single layer to a dual layer, achieving a substantial leap in transistor density and system performance.</p>\n<p>He Tingbo stated: \"We have achieved a series of advancements that would be difficult to attain solely through advanced process technology.\" This suggests Huawei may have successfully navigated a path independent of those taken by Taiwan Semiconductor Manufacturing, Samsung, and Intel.</p>\n<p>She also revealed a longer-term goal: by 2031, high-end chips based on the \"Tau Law\" will achieve transistor density equivalent to that of a 1.4nm process node. This means Huawei aims to achieve integration density and computing capability on par with 1.4nm process technology through system-level temporal optimization.</p>\n<p>Is this a viable path? He Tingbo's words were: \"Our solution is viable and sustainable. The performance of our new chips can continuously compete with the other path.\"</p>\n<p>New Technology Waves in the Global Semiconductor Industry\nIf the \"Tau Law\" can be understood as a paradigm shift from \"space\" to \"time,\" then another major trend in the global semiconductor industry is the shift from \"planar\" to \"three-dimensional.\"</p>\n<p>Interestingly, these two trends are converging at the same point in time.</p>\n<p>A wave of technologies represented by advanced packaging, Chiplet heterogeneous integration, and hybrid bonding is reshaping chip performance boundaries at an unprecedented pace and scale. Their core rationale aligns with that of the \"Tau Law\": rather than relying on the infinite scaling of transistors themselves, they drive continuous leaps in system-level performance through smarter integration and interconnection methods.</p>\n<p>First, consider advanced packaging. If discussions about \"how many nanometers\" defined the industry for decades, the focus from 2024 to 2026 is rapidly shifting toward advanced packaging. According to Yole Group, the global advanced packaging market is projected to reach approximately $53.1 billion in 2025, with expectations to grow to $79.4 billion by 2030, representing a compound annual growth rate (CAGR) of about 8.4%. More striking is the growth rate of 2.5D/3D packaging, with a CAGR of 37% projected between 2023 and 2029.</p>\n<p>Why such rapid growth? The reason is straightforward: explosive demand for AI chips. Advanced packaging, exemplified by Taiwan Semiconductor Manufacturing's CoWoS, places GPU cores and high-bandwidth memory (HBM) in close proximity, compressing signal transmission distances from the millimeter to the micrometer scale. This serves as the \"invisible foundation\" for the computing power explosion in the era of large AI models. Data indicates that global capacity for 2.5D and 3D advanced packaging remains insufficient to meet demand, with lead times for some orders exceeding one year and a supply gap estimated at around 23%. Leading global manufacturers are embarking on massive expansion efforts: Taiwan Semiconductor Manufacturing plans to establish seven advanced packaging fabs, aiming to increase annual capacity from 1.3 million wafers to 2 million wafers by 2027, a roughly 53.85% increase.</p>\n<p>Next, consider Chiplets. The logic behind this technology is to break down a large monolithic chip into multiple smaller chiplets, each manufactured using the optimal process node, and then \"bond\" them together via advanced packaging—similar to \"cutting a large chessboard into smaller puzzle pieces and reassembling them.\" Chiplet architecture is already widely deployed in AI chips. For domestic chip manufacturers, this technology holds particular strategic significance: it allows critical core modules to use advanced process nodes while employing mature nodes for non-critical I/O and memory modules. This effectively mitigates limitations in accessing advanced processes, achieving \"system-level performance with finite resources.\"</p>\n<p>If Chiplets are about \"building blocks,\" then hybrid bonding is the \"glue\" that determines whether these blocks can be stacked stably and densely. The breakthrough of hybrid bonding lies in its elimination of solder bumps, enabling direct copper-to-copper contact at the atomic level for direct bonding between chips. Compared to traditional thermal compression bonding, hybrid bonding can increase interconnect density by one to two orders of magnitude, with extremely low parasitic capacitance, significantly reducing signal delay and power consumption.</p>\n<p>This technology is viewed by the industry as \"an essential technology roadmap for the next decade in the post-Moore era.\" In terms of practical implementation, memory giants are fully engaged. SK hynix and Samsung are paving the way for next-generation HBM, with hybrid bonding expected to be introduced starting with HBM4. Validation of 16-layer HBM stacked structures is underway. The hybrid bonding equipment market is projected to grow at a CAGR of 69%, far exceeding the overall semiconductor industry growth rate.</p>\n<p>There is an even more cutting-edge direction: silicon photonics interconnection and co-packaged optics (CPO).</p>\n<p>The fundamental bottleneck in signal transmission is shifting from within chips to interconnections between chips and even between server racks. Traditional copper interconnects suffer from high loss at high frequencies and limited distance, increasingly struggling to meet the bandwidth demands of large-scale AI clusters. The core idea of silicon photonics is to use light instead of electrical signals for transmission, offering higher speed, lower latency, and significantly reduced power consumption.</p>\n<p>At a technology forum in May 2026, Taiwan Semiconductor Manufacturing prominently disclosed its \"three-layer cake\" AI platform architecture: the bottom layer is the compute layer, the middle is the packaging integration layer (CoWoS/SoIC), and the top layer is the \"most important for the future\" photonic interconnect layer (COUPE). COUPE technology employs 3D heterogeneous integration to vertically stack electronic and photonic chips, bringing components extremely close together and drastically reducing electrical coupling loss. According to Taiwan Semiconductor Manufacturing, mass production of the world's first 200Gbps micro-ring modulator using COUPE technology has commenced this year, with a bit error rate below one in 100 million. Compared to traditional copper wires, COUPE can improve system energy efficiency by 4 times and reduce latency by 10 times; when deeply integrated with the packaging platform, energy efficiency can improve by up to 10 times, with latency reduced by 20 times.</p>\n<p>Guojin Securities explicitly stated in its latest research report: 2026 marks the first year of CPO industrialization. Core players in the supply chain like Taiwan Semiconductor Manufacturing, NVIDIA, and Broadcom are actively entering the field, signaling the formal commencement of large-scale deployment of \"optics replacing copper\" in AI data centers.</p>\n<p>Conclusion\nIn the long term, Huawei's \"Tau Law\" is highly aligned with the direction of the entire industry's technological evolution. Whether termed \"temporal scaling\" or \"advanced packaging,\" the underlying essence reflects a fundamental consensus: improving chip performance can no longer rely solely on \"making transistors smaller.\"</p>\n<p>The real competition is shifting to a new set of dimensions: interconnect density, signal latency, system synergy, vertical stacking, and optical interconnection. The combinatorial effects of these dimensions are far more complex and expansive than simply shrinking a node. In Huawei's own words, from 2026 to 2035, as numerous exploratory technologies gradually become productized, transistor density will continue to increase, operating frequencies will continue to grow, and a steady stream of high-performance chips will emerge.</p>\n<p>At the conclusion of her speech, He Tingbo made a meaningful statement: \"The future certainly belongs to open cooperation. On the path of semiconductor evolution, no single enterprise can provide all the answers alone. Under the path of the 'Tau Law,' we look forward to close collaboration with global scientists, engineers, and industry partners to jointly promote the sustainable development of the semiconductor and electronics industries.\"</p>\n<p>The semiconductor supply chain is too long and complex for any single country or company to dominate all segments. Every link—from semiconductor equipment including lithography machines, to packaging substrate materials, EDA tools, CPO standard systems—requires global collaboration. By proposing the \"Tau Law,\" Huawei is offering the world a compatible, open, and alternative Chinese solution at a critical juncture when the semiconductor industry is searching for new growth curves.</p>\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"LU2242649171.HKD":"FIDELITY FUNDS GLOBAL THEMATIC OPPORTUNITIES \"A\" (HKD) ACC","SG9999014880.SGD":"大华全球优质成长基金Acc SGD","LU2462157665.USD":"ALLIANZ GLOBAL INCOME \"A\" (USD) INC","DIPS":"做空NVDA期权收益策略ETF-YieldMax","LU0347712357.USD":"BNP PARIBAS GLOBAL ENVIRONMENT \"C\" (USD) ACC","LU0107464264.USD":"abrdn SICAV I - GLOBAL INNOVATION EQUITY \"A\" (USD) ACC","LU0061474705.USD":"THREADNEEDLE (LUX) GLOBAL DYNAMIC REAL RETURN \"AU\" (USD) ACC","IE00BYXW3230.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"AA\" (USD) ACC","LU2417539215.USD":"ALLIANZ GLOBAL INCOME \"AMF\" (USD) INC","HK0000304805.HKD":"PICTET 战略收益基金 P类港元","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY ENHANCED INCOME \"I\" (USD) INC","IE00B775H168.HKD":"JANUS HENDERSON BALANCED \"A5M\" (HKD) INC","IE00BN29S564.USD":"JANUS HENDERSON BALANCED \"A3\" (USD) INC","HK0000304797.USD":"PICTET 战略收益基金 P类 美元","LU0289960550.SGD":"AB FCP I - GLOBAL EQUITY BLEND PORTFOLIO 'A' (SGD) ACC","LU1670628061.USD":"M&G (LUX) NORTH AMERICAN DIVIDEND \"A\" (USD) INC","IE00BFSS8Q28.SGD":"Janus Henderson Balanced A Inc SGD-H","LU0124676726.USD":"AB SICAV I - SUSTAINABLE US THEMATIC PORTFOLIO \"A\" (USD) ACC","LU1670710588.SGD":"M&G (LUX) GLOBAL DIVIDEND \"A\" (SGD) ACC","LU2355687059.USD":"NORDEA 1 GLOBAL IMPACT  \"BP\" (USD) ACC","LU1066053197.SGD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM3\" (SGDHDG) INC","LU0979878070.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"A\" (USD) ACC","LU1670710661.SGD":"M&G (LUX) GLOBAL DIVIDEND \"A\" (SGD) INC","IE0004086264.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"A\" (USD) ACC","LU2028103732.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AMG\" (USD) INC","LU2065170008.USD":"M&G (LUX) GLOBAL MAXIMA \"A\" (USD) INC","LU0528227936.USD":"富达环球人口趋势基金A-ACC","LU0289961442.SGD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"AX\" (SGD) ACC","LU1670711123.USD":"M&G (LUX) GLOBAL DIVIDEND \"A\" (USD) INC","LU0985320562.USD":"NORDEA 1 GLOBAL STARS EQUITY \"BP\" (USD) ACC","SGXZ23171101.USD":"NIKKO AM SHENTON GLOBAL OPPORTUNITIES (USD) ACC","LU2357305700.SGD":"Allianz Global Artificial Intelligence ET H2-SGD","LU0310799852.SGD":"FTIF - Templeton Global Equity Income A MDIS SGD","LU0738911758.USD":"Blackrock Global Equity Income A6 USD","LU0109391861.USD":"富兰克林美国机遇基金A Acc","GB00BDT5M118.USD":"天利环球扩展Alpha基金A Acc","LU0545039389.USD":"BGF GLOBAL EQUITY INCOME \"A2\" ACC","IE0001KFT4U8.USD":"FTGF CLEARBRIDGE GLOBAL GROWTH LEADERS \"A\" (USD) INC","IE0009G5SDU7.USD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (USD) INC","LU0466842654.USD":"HSBC ISLAMIC GLOBAL EQUITY INDEX \"A\" (USD) ACC","LU2089284900.SGD":"Allianz Global Sustainability Cl AM Dis H2-SGD","HK0000819398.USD":"BLACKROCK PREMIER SYSTEMATIC GLOBAL EQUITY HIGH INCOME FUND A10 (USD)INC","IE000ITXATA3.USD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (USD) ACC","IE000YTNTUN2.SGD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (SGDHDG)INC","LU1280957306.USD":"THREADNEEDLE (LUX) US CONTRARIAN CORE EQUITIES \"AUP\" (USD) INC","LU1988902786.USD":"FULLERTON LUX FUNDS GLOBAL ABSOLUTE ALPHA \"I\" (USD) ACC","LU1642822529.SGD":"THREADNEEDLE (LUX) GLOBAL TECHNOLOGY \"A\" (SGD) ACC","LU2602419157.SGD":"HSBC ISLAMIC GLOBAL EQUITY INDEX \"AC\" (SGD) ACC","LU0444973449.USD":"CT (LUX) I GLOBAL TECHNOLOGY \"DU\" (USD) ACC","LU1496350171.SGD":"FRANKLIN DIVERSIFIED BALANCED \"A\" (SGDHDG) ACC","LU0878004406.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) INC","IE00BMPRXQ63.HKD":"NEUBERGER BERMAN NEXT GENERATION CONNECTIVITY FUND \"A\" (HKDHDG) ACC","SGXZ81514606.USD":"大华环球创新基金A Acc USD","LU2463028550.USD":"AB SICAV I AMERICAN MULTI-ASSET PORTFOLIO \"A\" (USD) ACC","LU0882747503.HKD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (HKD) INC","04335":"英特尔-T","LU2065171311.SGD":"M&G (LUX) GLOBAL MAXIMA \"A\" (SGD) ACC","LU1839511570.USD":"WELLS FARGO GLOBAL FACTOR ENHANCED EQUITY \"I\" (USD) ACC","LU0320765646.SGD":"FTIF - Franklin Income A MDIS SGD-H1","LU2237957902.USD":"NIKKO AM GLOBAL EQUITY \"F\" (USD) ACC","LU2065171402.SGD":"M&G (LUX) GLOBAL MAXIMA \"A\" (SGD) INC","LU1400636491.USD":"Allianz Europe Income and Growth Cl AMg DIS H2-USD","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","LU2237957811.SGD":"NIKKO AM GLOBAL EQUITY \"F\" (SGD) ACC","LU2471134952.CNY":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (CNYHDG) INC","LU2471134879.HKD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (HKD) INC","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","LU0708994859.HKD":"TEMPLETON GLOBAL \"A\" (HKD) ACC","SNVD.UK":"LS -1X NVIDIA","LU2471134523.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) ACC","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","LU1992135399.USD":"Allianz Global Intelligent Cities AT Acc USD","IE00BJTD4N35.SGD":"Neuberger Berman US Long Short Equity A1  Acc SGD-H","HK0000532082.HKD":"ALLIANZ SELECTION INCOME AND GROWTH \"AM\" (HKD) INC","IE00B19Z8X17.USD":"FTGF CLEARBRIDGE US LARGE CAP GROWTH  \"AG\" (USD) ACC","3NVD.UK":"LS 3X NVIDIA","IE0003U64NQ7.SGD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (SGDHDG) ACC","LU2720916845.USD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (USD) ACC","LU2471134796.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) INC","LU2247934214.USD":"FIDELITY FUNDS SUSTAINABLE FUTURE CONNECTIVITY \"A\" (USD) ACC","LU0109392836.USD":"富兰克林科技股A","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","IE000KEQY171.SGD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (SGDHDG) INC","LU2750360641.GBP":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (GBPHDG) INC","LU0820562030.AUD":"ALLIANZ INCOME AND GROWTH \"AMH2\" (AUDHDG) H2 INC","LU2361044949.HKD":"WELLINGTON US QUALITY GROWTH \"A\" (HKD) ACC","LU2360107168.USD":"BGF NEXT GENERATION TECHNOLOGY \"A4\" (USD) INC","LU0965509010.AUD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (AUDHDG) INC","LU0354030511.USD":"ALLSPRING  U.S. LARGE CAP GROWTH \"I\" (USD) ACC","SG9999015945.SGD":"LionGlobal Disruptive Innovation Fund A SGD","LU2237443465.HKD":"abrdn SICAV I -  GLOBAL DYNAMIC DIVIDEND \"A\" (HKD) INC","LU0823434740.USD":"BNP PARIBAS US GROWTH \"C\" (USD) INC","HK0000914686.HKD":"GFI Global Select Equity Fund Class A (HKD)","LU2750360997.AUD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (AUDHDG) INC","LU0354030438.USD":"富国美国大盘成长基金Cl A Acc","LU0143551892.USD":"T ROWE PRICE GLOBAL FOCUSED GROWTH EQUITY \"A\" (USD) ACC","HK0000914660.USD":"GFI Global Select Equity Fund Class A (USD)","LU2023251221.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (USD) INC","LU2095319765.USD":"Natixis Thematics Subscription Economy R/A USD","IE00BYV24P56.USD":"GUINNESS EMERGING MARKETS EQUITY INCOME \"C\" (USD) ACC","LU2462591277.SGD":"TRP GLOBAL FOCUSED GROWTH EQUITY \"AN\" (SGDHDG) ACC","LU2954938101.SGD":"T ROWE PRICE GLOBAL FOCUSED GROWTH EQUITY \"A8P\" (SGD) INC","IE00BMCWC346.EUR":"GUINNESS EMERGING MARKETS EQUITY INCOME \"C\" (EUR) ACC","LU2210150020.SGD":"Natixis Thematics Subscription Economy R/A SGD","LU0444971666.USD":"天利全球科技基金","LU2210149790.SGD":"Natixis Thematics Subscription Economy R/A SGD-H","LU2999663052.SGD":"T ROWE PRICE GLOBAL FOCUSED GROWTH EQUITY \"A4P\" (SGD) INC","IE00BVYPNV92.GBP":"GUINNESS GLOBAL EQUITY INCOME \"C\" (GBP) ACC","SGXZ99366536.SGD":"United Global Innovation A Acc SGD-H","IE00B4YYXB79.USD":"PIMCO BALANCED INCOME AND GROWTH \"E\" (USD) ACC","LU0859254822.USD":"T ROWE PRICE GLOBAL VALUE EQUITY \"A\" (USD) ACC","LU1323610961.USD":"UBS (LUX) EQUITY SICAV - LONG TERM THEMES (USD) \"P\" (USD) ACC","AVGO":"博通","LU0069063385.USD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (USD) ACC","LU2357627491.SGD":"TRP GLOBAL VALUE EQUITY \"AH\" (SGDHDG) ACC","LU2168564495.EUR":"AZ ALLOCATION - TREND \"AI\" (EUR) ACC","LU2106854487.HKD":"ALLIANZ THEMATICA \"AMG\" (HKD) INC","TSM":"台积电","IE00BVYPNQ40.USD":"GUINNESS ASIAN EQUITY INCOME \"C\" (USD) ACC","LU2047632596.USD":"T.ROWE MULTI-ASSET GLOBAL INCOME \"A\" (USD) ACC","LU0965509101.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (SGDHDG) ACC","LU2168564222.USD":"AZ ALLOCATION - TREND \"AAZ\" (USDHDG) ACC","LU0823414551.USD":"BNP PARIBAS ENERGY TRANSITION \"C\" (USD) INC","LU1629891620.HKD":"ALLIANZ INCOME AND GROWTH \"AMG2\" (H2-HKD) INC","LU2168564065.EUR":"AZ ALLOCATION - TREND \"AAZ\" (EUR) ACC","IE00BVYPNP33.GBP":"GUINNESS ASIAN EQUITY INCOME \"C\" (GBP) ACC","LU2326559502.SGD":"Natixis Loomis Sayles US Growth Equity P/A SGD-H","LU2100268510.USD":"T.ROWE MULTI-ASSET GLOBAL INCOME \"AX\" (USD) INC","LU3102509885.SGD":"T.ROWE MULTI-ASSET GLOBAL INCOME \"A8P\" (SGDHDG) INC","LU2168563687.JPY":"AZ ALLOCATION - TREND \"AAZ\" (JPYHDG) ACC","LU1778281490.HKD":"HSBC GIF GLOBAL LOWER CARBON EQUITY \"AD\" (HKD) INC","LU0251132253.USD":"FIDELITY FUNDS  GLOBAL THEMATIC OPPORTUNITIES \"A\" (USD) ACC","LU2168564149.EUR":"AZ ALLOCATION - TREND \"BAZ\" (EUR) ACC","LU1633808545.USD":"ALLIANZ GLOBAL EQUITY GROWTH \"AT\" (USD) ACC","LU0203202063.USD":"AB SICAV I - ALL MARKET INCOME PORTFOLIO \"A2X\" (USD) ACC","IE00BVYPNW00.USD":"GUINNESS GLOBAL EQUITY INCOME \"C\" (USD) ACC","IE00BZ1G4Q59.USD":"LEGG MASON CLEARBRIDGE US EQUITY SUSTAINABILITY LEADER \"A\"(USD) INC (A)","IE000W1ABFV2.USD":"PIMCO BALANCED INCOME AND GROWTH \"R\" (USD) INC","LU1066051225.USD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AC\" (USD) ACC","SG9999015986.USD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (USD) ACC","LU2023250330.USD":"ALLIANZ INCOME AND GROWTH \"AMG\" (USD) INC","LU0203201768.USD":"AB SICAV I - ALL MARKET INCOME PORTFOLIO \"AX\" (USD) INC","LU0476273544.USD":"CT (LUX) I GLOBAL TECHNOLOGY \"BU\" (USD) ACC","LU1720051017.SGD":"Allianz Global Artificial Intelligence AT Acc H2-SGD","LU1923622614.USD":"Natixis Thematics Meta R/A USD","LU0553294199.USD":"BGF GLOBAL EQUITY INCOME \"A5G\" (USD) INC","LU1244550221.USD":"FRANKLIN GLOBAL MULTI-ASSET  INCOME \"A\" (USDHEDGED) INC (M)","LU1699723380.USD":"ALLSPRING GLOBAL LONG/SHORT EQUITY \"AP\" (USD) ACC","LU1917777945.USD":"安联专题基金Cl AT Acc","STSM":"Defiance Daily Target 2X Short TSM ETF","LU2242650005.HKD":"FIDELITY FUNDS GLOBAL MULTI ASSET DYNAMIC \"A\" (HKD) ACC","SOX":"费城半导体指数","LU0057025933.USD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"AX\" (USD) ACC","LU2452424414.USD":"BGF ESG MULTI-ASSET \"A10\" (USDHDG) INC","LU2125909759.SGD":"Natixis Thematics Safety H-R/A SGD","IE00BQXX3D17.EUR":"GUINNESS GLOBAL INNOVATORS \"C\" (EUR) ACC","LU2211815571.USD":"ALLIANZ POSITIVE CHANGE \"AT\" (USD) ACC","LU0964807845.USD":"ALLIANZ INCOME & GROWTH \"A\" (USD) INC","LU2125909916.SGD":"Natixis Thematics Safety R/A SGD","IE00BQXX3C00.GBP":"GUINNESS GLOBAL INNOVATORS \"C\" (GBP) ACC","LU1923622291.USD":"Natixis Thematics Safety R/A USD","NVD3.UK":"LS 3X NVIDIA","LU2433249047.HKD":"THEMATICS META \"R/A\" (HKD) ACC","LU0276348264.USD":"THREADNEEDLE (LUX) GLOBAL DYNAMIC REAL RETURN\"AUP\" (USD) INC","NVDS.UK":"LS -1X NVIDIA","IE00BQXX3F31.USD":"GUINNESS GLOBAL INNOVATORS \"C\" (USD) ACC","LU0133085943.USD":"T ROWE PRICE US BLUE CHIP EQUITY \"A\" ACC","LU2108987350.USD":"UBS (LUX) EQUITY SICAV GLOBAL OPPORTUNITY SUSTAINABLE (USD) \"P\" (USD) ACC","LU0174119429.USD":"T ROWE PRICE US LARGE CAP GROWTH EQUITY \"A\" ACC","NVD2.UK":"2X NVIDIA ETP","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU2213496289.HKD":"ALLIANZ INCOME AND GROWTH \"AT\" (HKD) ACC","LU2462591350.SGD":"T ROWE PRICE US LARGE CAP GROWTH EQUITY \"AN\" (SGDHDG) ACC","LU2244417387.USD":"FIDELITY SUSTAINABLE US EQUITY \"A\" (USD) ACC","SG9999001440.SGD":"United Global Dividend Equity Fund A SGD Dist","LU2063271972.USD":"富兰克林创新领域基金","LU1037948897.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (HKD) INC","LU2290526834.HKD":"BGF NEXT GENERATION TECHNOLOGY \"A2\" (HKDHDG) ACC","LU1242518931.SGD":"Fullerton Lux Funds - Asia Absolute Alpha A Acc SGD","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","LU2298321311.HKD":"BGF CIRCULAR ECONOMY \"A\" (HKDHDG) ACC","LU2764262908.HKD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (HKD) ACC","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","LU0323591593.USD":"SCHRODER ISF QEP GLOBAL QUALITY \"A\" (USD) ACC","LU1037948541.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (HKD) ACC","AVGG":"2倍做多AVGO ETF-Leverage Shares","LU1116320737.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A6\" (USD) INC","IE00BDRTCR15.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"ADC\" (USD) INC A","LU2360032135.SGD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (SGDHDG) INC","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","LU2125909593.SGD":"Natixis Thematics Meta R/A SGD","IE00BDGV0183.EUR":"GUINNESS GLOBAL EQUITY INCOME \"C\" (EUR) INC","LU0384037296.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AT\" (USD) ACC","IE00B19Z8W00.USD":"FTGF CLEARBRIDGE US LARGE CAP GROWTH \"A\" INC","LU2637965513.SGD":"BGF GLOBAL ALLOCATION \"A10\" (SGDHDG) INC","AVGU":"2倍做多AVGO ETF-GraniteShares","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","LU0868494708.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) INC","LU2403377893.USD":"ALLIANZ SELECT INCOME AND GROWTH \"AM\" (USD) INC","AVGW":"Roundhill AVGO WeeklyPay ETF","IE00BKDWB100.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5H\" (SGDHDG) ACC","LU1116320901.HKD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A6\" (HKD) INC","AVGX":"2倍做多AVGO ETF-Defiance","LU1064131342.USD":"Fullerton Lux Funds - Global Absolute Alpha A Acc USD","LU2250418816.HKD":"BGF WORLD TECHNOLOGY \"A\" (HKD) ACC","LU2111349929.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (HKD) INC","LU1992135472.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES \"AT\" (HKD) ACC","IE00BGHQDM52.EUR":"GUINNESS ASIAN EQUITY INCOME \"C\" (EUR) ACC","ANV":"GraniteShares Autocallable NVDA ETF","LU1153585028.USD":"BGF GLOBAL LONG-HORIZON EQUITY  \"A4\" (USD) INC","IE00BZ9MQY76.HKD":"FTGF CLEARBRIDGE US AGGRESSIVE GROWTH \"A\" (HKD) ACC","LU1232071149.USD":"AZ FUND 1 GLOBAL GROWTH SELECTOR \"AAZ\" (USDHDG) ACC","LU1496350502.SGD":"FRANKLIN DIVERSIFIED DYNAMIC \"A\" (SGDHDG) ACC","AVL":"2倍做多AVGO ETF-Direxion","LU1674673691.USD":"HSBC GIF GLOBAL LOWER CARBON EQUITY \"AD\" (USD) INC","LU2148611432.USD":"AZ ALLOCATION BALANCED BRAVE \"AAZ\" (USDHDG) ACC","LU1301847155.USD":"BGF GLOBAL MULTI-ASSET INCOME FUND \"A4G\" (USD) INC","LU1674673428.USD":"HSBC GIF GLOBAL LOWER CARBON EQUITY \"AC\" (USD) ACC","LU0061475181.USD":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC","IE00BGHQF631.EUR":"GUINNESS GLOBAL EQUITY INCOME \"C\" (EUR) ACC","LU2413666699.HKD":"BNP PARIBAS GLOBAL ENVIRONMENT \"CRH\" (HKDHDG) INC","LU0942090050.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD)  INC","IE00B3PB1722.GBP":"GUINNESS GLOBAL EQUITY INCOME \"C\" (GBP) INC","LU2456880835.USD":"ALLIANZ GLOBAL INCOME \"AT\" (USD) ACC","LU0094547139.USD":"abrdn SICAV I - GLOBAL SUSTAINABLE EQUITY FUND \"A\" (USD) ACC","LU0708995401.HKD":"FRANKLIN U.S. OPPORTUNITIES \"A\" (HKD) ACC","IE00B42XCP33.USD":"GUINNESS GLOBAL EQUITY INCOME \"C\" (USD) INC","LU1551013342.USD":"Allianz Income and Growth Cl AMg2 DIS USD","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","LU2381873111.SGD":"BGF SYSTEMATIC GLOBAL EQUITY HIGH INCOME \"A6\" (SGDHDG) INC","IE00B19Z9Z06.USD":"Legg Mason ClearBridge - US Aggressive Growth A Acc USD","LU0345769128.USD":"NINETY ONE GSF GLOBAL EQUITY \"A\" (USD) ACC","LU2097344431.USD":"SCHRODER ISF SUSTAINABLE MULTI-ASSET INCOME \"A\" (USDHDG) INC","SG9999011175.SGD":"Nikko AM Global Dividend Equity Dis SGD-H","LU0128525929.USD":"TEMPLETON GLOBAL \"A\" (USD) ACC","LU2097344357.USD":"SCHRODER ISF SUSTAINABLE MULTI-ASSET INCOME \"A\" (USDHDG) ACC","LU1069344957.HKD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (HKD) INC","LU1951198990.SGD":"Natixis Thematics AI & Robotics Fund H-R/A SGD-H","LU2764263039.SGD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (SGDHDG) ACC","LU0345769631.USD":"NINETY ONE GSF GLOBAL EQUITY \"A\" (USD) INC","LU2764263203.CNY":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (CNYHDG) ACC","LU1951200564.SGD":"Natixis Thematics AI & Robotics Fund R/A SGD","IE00BWXC8680.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5\" (SGD) ACC","LU2191332357.HKD":"SCHRODER ISF SUSTAINABLE MULTI-ASSET INCOME \"A\" (HKDHDG) INC","LU0345770993.USD":"NINETY ONE GSF GLOBAL STRATEGIC EQUITY \"A\" (USD) INC","LU1923623000.USD":"Natixis Thematics AI & Robotics Fund R/A USD","LINT":"Direxion Daily INTC Bull 2X ETF","LU2125909247.SGD":"Natixis Thematics Meta H-R/A SGD","LU0672654240.SGD":"FTIF - Franklin US Opportunities A Acc SGD-H1","AVS":"1倍做空AVGO ETF-Direxion","LU1821325948.USD":"NINETY ONE GSF GLOBAL MACRO ALLOCATION \"A\" (USD) ACC","LU1429558221.USD":"Natixis Loomis Sayles US Growth Equity RA USD","LU1435385759.SGD":"Natixis Loomis Sayles US Growth Equity RA SGD-H","LU2264538146.SGD":"Fullerton Lux Funds - Global Absolute Alpha A Acc SGD","LU1803068623.USD":"TEMPLETON GLOBAL CLIMATE CHANGE \"AH1\" (USDHDG) ACC","LU2756315664.SGD":"ALLIANZ INCOME AND GROWTH \"AMI\" (SGDHDG) INC","SG9999015952.SGD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (SGD) ACC","HK0000320223.HKD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (HKD) ACC","IE00BN8TJ469.HKD":"FTGF CLEARBRIDGE TACTICAL DIVIDEND INCOME \"A\" (HKD) INC","LU0957791311.USD":"THREADNEEDLE (LUX) GLOBAL FOCUS \"ZU\" (USD) ACC","LU1935043023.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME \"AA\" (USD) INC A","IE00B4JS1V06.HKD":"JANUS HENDERSON BALANCED \"A2\" (HKD) ACC","SG9999003800.SGD":"Nikko AM Global Dividend Equity Acc SGD-H","LU2663582299.SGD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOL \"A2\" (SGDHDG) ACC","IE00B894F039.SGD":"Legg Mason ClearBridge - US Aggressive Growth A Acc SGD-H","LU2271345857.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (HKD) ACC","LU2746668461.USD":"MANULIFE DYNAMIC LEADERS \"AA\" (USD) ACC","HK0000320264.USD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (USD) ACC","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","LU1508157978.USD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOLUTE RETURN \"A\" (USD) ACC","LU0345768740.USD":"NINETY ONE GSF GLOBAL STRATEGIC MANAGED \"A\" (USD) INC","LU2089985449.USD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (USD) ACC","SG9999017495.SGD":"UGDP UNITED GLOBAL QUALITY GROWTH \"B\" (SGD) ACC","LU2931357623.SGD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (SGDHDG) ACC","LU2756315318.SGD":"ALLIANZ INCOME AND GROWTH \"AMG\" (SGDHDG) INC A","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","LU2272731865.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AM\" (HKD) INC","LU2746668974.SGD":"MANULIFE DYNAMIC LEADERS \"AA\" (SGDHDG) ACC","SG9999014914.USD":"UNITED GLOBAL QUALITY GROWTH (USDHDG) INC","IE00BK4W5M84.HKD":"HSBC GLOBAL FUNDS ICAV US EQUITY INDEX \"HC\" (HKD) ACC","LU0265550946.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A5\" (USD) INC","LU1066051811.HKD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM2\" (HKD) INC","LU2083900584.USD":"HSBC GIF US INCOME FOCUSED \"AM2\" (USD) INC","LU1645745479.HKD":"ALLIANZ EUROPE INCOME AND GROWTH \"AM\" (HKDHDG) INC","TSMG":"2倍做多TSM ETF- Leverage Shares","IE00BK4W5L77.USD":"HSBC GLOBAL FUNDS ICAV US EQUITY INDEX \"HC\" (USD) ACC","LU0472753341.HKD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (HKD) ACC","LU1127390331.HKD":"AB SICAV I - ALL MARKET INCOME PORTFOLIO \"A\" (HKD) ACC","IE00B3SWFQ91.USD":"PIMCO BALANCED INCOME AND GROWTH \"E\" (USD) INC","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","LU1623119135.USD":"Natixis Mirova Global Sustainable Equity R-NPF/A USD","LU2361044865.SGD":"WELLINGTON US QUALITY GROWTH \"A\" (SGDHDG) ACC","LU0143863784.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES\"DU\" (USD) ACC","LU0949170426.SGD":"Blackrock Global Multi-Asset Income A6 SGD-H","LU1244550494.USD":"FRANKLIN GLOBAL MULTI-ASSET INCOME \"A\" (USDHEDGED) ACC","TSMU":"2倍做多TSM ETF-GraniteShares","BK4512":"苹果概念","BK4543":"AI","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","TSMX":"2倍做多TSM ETF-Direxion","INTC":"英特尔","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","LU0784384876.USD":"Blackrock Global Multi-Asset Income A6 USD","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","LU0868494617.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) ACC","LU2361045086.USD":"WELLINGTON US QUALITY GROWTH \"A\" (USD) ACC","TSMY":"TSM期权收益策略ETF-YieldMax","SGXZ31699556.SGD":"UGDP UNITED GLOBAL QUALITY GROWTH \"C\" (SGDHDG) ACC","TSMZ":"1倍做空TSM ETF-Direxion","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","IE0004445015.USD":"JANUS HENDERSON BALANCED \"A2\" (USD) ACC","LU2211814178.USD":"ALLIANZ CLEAN PLANET \"AT\" (USD) ACC","LU1267930490.SGD":"TEMPLETON GLOBAL EQUITY INCOME \"AS\" (SGD) INC A","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","INTW":"2倍做多INTC ETF-GraniteShares","LU0143863198.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES\"AU\" (USD) ACC","LU1366333091.USD":"FIDELITY GLOBAL FOCUS \"A\" (USD) ACC","LU2237443549.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA SGD-H","LU0965508806.USD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (USD) INC","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","BK4515":"5G概念","LU0359202008.SGD":"Blackrock China Fund A2 SGD-H","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) ACC","BK4549":"软银资本持仓","LU2322448791.USD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AMG\" (USD) INC","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (SGDHDG) ACC","BK4548":"巴美列捷福持仓","LU0238689110.USD":"贝莱德环球动力股票基金","LU1267930730.SGD":"富兰克林美国机遇基金AS Acc SGD (CPF)","LU1815333072.USD":"THREADNEEDLE (LUX) GLOBAL FOCUS \"AUP\" (USD) INC","LU2491050154.USD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (USD) ACC","LU1366192091.USD":"ALLIANZ US EQUITY PLUS \"AM\" (USD) INC","LU0342679015.USD":"ALLIANZ GLOBAL EQUITY UNCONSTRAINED \"AT\" (USD) ACC","LU0072462426.USD":"贝莱德全球配置 A2","LU2322448957.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AMG\" (HKD) INC","LU0661504455.SGD":"Blackrock Global Equity Income A5 SGD-H","LU0011850046.USD":"贝莱德全球长线股票 A2 USD","LU2461242641.AUD":"WELLINGTON US QUALITY GROWTH \"A\" (AUDHDG) ACC","LU1548497426.USD":"安联环球人工智能AT Acc","LU0097036916.USD":"贝莱德美国增长A2 USD","LU0048584097.USD":"FIDELITY FUNDS  GLOBAL THEMATIC OPPORTUNITIES \"A\" (USD) INC","LU1162221912.USD":"FRANKLIN INCOME \"A\" (USD) ACC","IE00B1XK9C88.USD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A\" (USD) ACC","BK4554":"元宇宙及AR概念","LU2860962120.EUR":"CPR INVEST - ARTIFICIAL INTELLIGENCE \"A2\" (EUR) ACC A","LU0308772762.SGD":"Blackrock Global Allocation A2 SGD-H","LU2087625088.SGD":"ALLSPRING  US ALL CAP GROWTH \"A\" (SGDHDG) ACC","07388":"XI二南英伟","LU1202635105.USD":"ALLIANZ EUROPE INCOME AND GROWTH \"AM\" (USDHDG) INC","LU0203347892.USD":"SCHRODER ISF QEP GLOBAL ACTIVE VALLUE \"A\" (USD)  INC AV","BK4585":"ETF&股票定投概念","LU2592432038.USD":"WELLINGTON MULTI-ASSET HIGH INCOME \"A\" (USD) ACC","LU2237438978.USD":"Amundi Funds US Pioneer A2 (C) USD","BK4587":"ChatGPT概念","IE00BDCRKT87.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"ADC\" (USD) INC","LU0274383776.USD":"MANULIFE GF US SMALL CAP EQUITY \"AA\" (USD) INC","IE0034235188.USD":"PINEBRIDGE GLOBAL FOCUS EQUITY \"A\" (USD) ACC","LU1282649810.SGD":"Allianz Asian Multi Income Plus Cl AMg DIS H2-SGD","LU0878005551.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) ACC","LU2473716301.USD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AMF\" (USD) INC","LU1145028129.USD":"ALLIANZ INCOME AND GROWTH \"AQ\" (USD) INC","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU0359201612.USD":"贝莱德中国基金A2","IE00BJJMRY28.SGD":"Janus Henderson Balanced A Inc SGD","LU2505996681.GBP":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (GBPHDG) INC","LU0158827948.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"A\" (USD) INC","LU2420271590.USD":"ALLIANZ SELECT INCOME AND GROWTH \"AT\" (USD) ACC","BK4588":"碎股","BK4550":"红杉资本持仓","LU0157215616.USD":"FIDELITY GLOBAL FOCUS \"A\" INC","LU2505996509.AUD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (AUDHDG) INC","LU2249611893.SGD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (SGD) ACC","LU1914381329.SGD":"Allianz Best Styles Global Equity Cl ET Acc H2-SGD","LU0096362180.USD":"CT (LUX) I GLOBAL FOCUS \"DU\" (USD)","LU2552382215.SGD":"WELLINGTON US BRAND POWER \"A\" (SGDHDG) ACC","NVIW.SI":"NVDA 3xLongSG261006","LU2552382058.USD":"WELLINGTON US BRAND POWER \"A\" (USD) ACC","BK4551":"寇图资本持仓","LU2552382132.HKD":"WELLINGTON US BRAND POWER \"A\" (HKD) ACC","LU0795875086.SGD":"JPMorgan Investment Funds - Global Income A (div) SGD","LU0511384066.AUD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (AUDHDG) ACC","LU1935042215.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME  \"AA\" (USD) INC A","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU0096364046.USD":"CT (LUX) I AMERICAN \"DU\" (USD) ACC","LU0861579265.USD":"联博低波幅策略股票基金A","LU0943347566.SGD":"安联收益及增长平衡基金AM H2-SGD","IE0034235295.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"A\" (USD) ACC","LU0321505868.SGD":"Schroder ISF Global Dividend Maximiser A Dis SGD","LU0187121727.USD":"FIDELITY SUSTAINABLE US EQUITY \"A\" (USD) INC","LU0210536198.USD":"JPM US GROWTH \"A\" ACC","IE00BYQQ9H92.USD":"BNY MELLON GLOBAL LEADERS \"A\" (USD) ACC","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU2896262040.SGD":"JPM US GROWTH FUND \"A\" (SGD) ACC","BK4529":"IDC概念","07788":"南方两倍做多英伟达","LU1732800096.USD":"摩根大通环球收益基金A (irc)","LU0345770308.USD":"NINETY ONE GSF GLOBAL STRATEGIC EQUITY \"A\" (USD) ACC","NVDA":"英伟达","LU2394011477.USD":"JPMORGAN CLIMATE CHANGE SOLUTIONS \"A\" (USD) ACC","IE00BZ199S13.USD":"BNY MELLON MOBILITY INNOVATION \"B\" (USD) ACC","LU0175139822.USD":"AB FCP I Global Equity Blend A USD","LU0256863811.USD":"ALLIANZ US EQUITY \"A\" INC","LU0689472784.USD":"安联收益及增长基金Cl AM AT Acc","LU1084165304.USD":"FIDELITY WORLD \"A\" (USD) ACC","LU2487616109.SGD":"JPM AMERICA EQUITY \"A\" (SGD) ACC","LU1720051108.HKD":"ALLIANZ GLOBAL ARTIFICIAL INTELLIGENCE \"AT\" (HKD) ACC","LU0787776722.HKD":"AB SELECT US EQUITY PORTFOLIO \"A\" (HKD) ACC","SG9999018865.SGD":"United Global Quality Growth Fd Cl Dist SGD-H","LU1861215975.USD":"贝莱德新一代科技基金 A2","LU0210528500.USD":"JPM AMERICA EQUITY \"A\" ACC","LU2089283258.USD":"安联环球可持续基金Cl AM Dis","SG9999014898.SGD":"United Global Quality Growth Fund Dis SGD","LU1861220033.SGD":"Blackrock Next Generation Technology A2 SGD-H","LU0912757837.SGD":"JPMorgan Investment Funds - Global Income A (mth) SGD-H","LU1211504680.USD":"ALLIANZ HIGH DIVIDEND ASIA PACIFIC EQUITY \"AM\" (USD) INC","LU1670627923.USD":"M&G (LUX) NORTH AMERICAN DIVIDEND \"A\" (USD) ACC","LU1282649067.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AMG\" (USD) INC A","LU1066051498.USD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM2\" (USD) INC","LU2065169927.USD":"M&G (LUX) GLOBAL MAXIMA \"A\" (USD) ACC","LU1400636657.SGD":"Allianz Europe Income and Growth Cl AMg DIS H2-SGD","LU0689626769.HKD":"AB SICAV I - SUSTAINABLE US THEMATIC PORTFOLIO \"A\" (HKD) ACC","LU0820561909.HKD":"ALLIANZ INCOME AND GROWTH \"AM\" (HKD) INC","LU1670711040.USD":"M&G (LUX) GLOBAL DIVIDEND \"A\" (USD) ACC","SG9999018857.SGD":"United Global Quality Growth Fd Cl Acc SGD-H","LU0106261372.USD":"SCHRODER ISF US LARGE CAP \"A\" ACC","SGXZ51526630.SGD":"大华环球创新基金A Acc SGD","BK4527":"明星科技股","LU0572940350.SGD":"Janus Henderson Horizon Asian Dividend Income A3 SGD","LU1935042991.SGD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME  \"AA\" (SGDHDG) INC","LU1935042488.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME  \"AA\" (USD) INC","LU0321505439.SGD":"Schroder ISF Global Dividend Maximiser A Acc SGD","BK4526":"热门中概股","IE00BKPKM429.USD":"NEUBERGER BERMAN GLOBAL SUSTAINABLE EQUITY \"A\" (USD) ACC","LU0264606111.USD":"Janus Henderson Horizon Asian Dividend Income A2 USD","BK4575":"芯片概念","IE00B19Z9P08.USD":"LEGG MASON CLEARBRIDGE US AGGRESSIVE GROWTH \"A\" (USD) INC","2NVD.UK":"2X NVIDIA ETP","LU0266013472.USD":"AXA WF - Framlington Longevity Economy A Cap USD","LU0077335932.USD":"FIDELITY AMERICAN GROWTH \"A\" INC","IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","LU1732799900.SGD":"JPMorgan Investment Funds - Global Income A (irc) SGD-H","LU0353189680.USD":"富国美国全盘成长基金Cl A Acc","LU0211328371.USD":"TEMPLETON GLOBAL EQUITY INCOME \"A\" (MDIS) (USD)   INC","LU0158827781.USD":" ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (USD) ACC","BK4579":"人工智能","LU1868837565.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"1\" (USD) ACC","LU0572939691.SGD":"Janus Henderson Horizon Asian Dividend Income A2 SGD","LU1804176565.USD":"EASTSPRING INV GLOBAL GROWTH EQUITY \"A\" (USD) ACC","LU2506951792.HKD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (HKDHDG)       ACC","LU2413666426.HKD":"BNP PARIBAS GLOBAL ENVIRONMENT \"C\" (HKD) ACC","LU1721428933.USD":"法巴全球经典环境基金RH MD Dis","SG9999014542.SGD":"United Income Focus Trust Acc SGD","LU0882574139.USD":"富达环球消费行业基金A ACC","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC","BK4532":"文艺复兴科技持仓","BK4581":"高盛持仓","SG9999015978.USD":"利安颠覆性创新基金A","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU0784385170.HKD":"BGF GLOBAL MULTI ASSET INCOME \"A6\" (HKDHGD) INC","LU0784385840.USD":"Blackrock Global Multi-Asset Income A2 USD","BK4614":"Manus概念股","BK4141":"半导体产品","BK4534":"瑞士信贷持仓","BK4533":"AQR资本管理(全球第二大对冲基金)","HK0000306685.HKD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (HKD) INC","LU1861127337.USD":"ALLIANZ GLOBAL MULTI ASSET SUSTAINABILITY BALANCED \"AMG\" (USD) INC","BK4612":"AI芯片","LU1935043536.SGD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME \"AA\" (SGDHDG) INC A","LU1400636574.HKD":"ALLIANZ EUROPE INCOME AND GROWTH \"AMG\" (HKDHDG) INC","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU1989772840.SGD":"CPR Invest - Climate Action A2 Acc SGD-H","LU0784383803.USD":"BGF GLOBAL MULTI-ASSET INCOME FUND \"A\" (USD) INC A","BK4535":"淡马锡持仓","LU2237443895.HKD":"abrdn SICAV I -  GLOBAL DYNAMIC DIVIDEND \"A\" (HKD) ACC","LU1989772923.USD":"CPR Invest - Climate Action A2 Acc USD-H","LU0345768153.USD":"NINETY ONE GSF GLOBAL STRATEGIC MANAGED \"A\" (USD) ACC","LU0557290698.USD":"施罗德环球可持续增长基金","LU1815336760.USD":"THREADNEEDLE (LUX) GLOBAL TECHNOLOGY \"AUP\" (USD) INC","LU1934455277.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"AD\" (USD) INC","LU0265550359.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A2\" (USD) ACC","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","HK0000306701.USD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (USD) INC","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU1989764748.USD":"东方汇理环球颠覆性机遇A2 Acc","SG9999014575.USD":"UOB UNITED INCOME FOCUS TRUST FUND (USDHDG) INC","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU1934455194.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (USD) ACC","LU1791710582.SGD":"Fidelity Global Demographics A-ACC-SGD (SGD/USD hedged)","LU1119994496.HKD":"FIDELITY WORLD \"A\" (HKD) ACC","LU2092937221.SGD":"Blackrock Circular Economy A2 SGD-H","LU0488056044.USD":"Allianz Asian Multi Income Plus Cl AM DIS USD","LU0256863902.USD":"ALLIANZ US EQUITY \"AT\" (USD) ACC","IE0034235303.USD":"PINEBRIDGE US RESEARCH ENHANCED CORE EQUITY \"A\" (USD) ACC","LU1791710400.SGD":"Fidelity Global Demographics A-ACC-SGD","LU0823414478.USD":"法巴经典能源转换基金","LU0390134368.USD":"FRANKLIN GLOBAL GROWTH \"A\" (USD) ACC","LU0056508442.USD":"贝莱德世界科技基金A2","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","BK4608":"AI应用概念股","SG9999001424.SGD":"United E-Commerce Fund SGD","LU0215105999.USD":"SCHRODER ISF GLOBAL EQUITY \"A\" ACC","IE00B5TLWC47.USD":"BNY MELLON LONG-TERM GLOBAL EQUITY \"B\" (USD) ACC","LU2265009873.SGD":"Eastspring Investments - Global Growth Equity AS SGD-H","LU1571399168.USD":"ALLSPRING GLOBAL LONG/SHORT EQUITY \"IP\" (USD) ACC","LU0267386448.USD":"FIDELITY FIRST ALL COUNTRY WORLD \"A\" (USD) INC","LU1261432733.SGD":"Fidelity World A-ACC-SGD","IE00B1BXHZ80.USD":"Legg Mason ClearBridge - US Appreciation A Acc USD","LU0225283273.USD":"SCHRODER ISF GLOBAL EQUITY ALPHA \"A\" (USD) ACC","BK4605":"半导体精选","LU0786609619.USD":"高盛全球千禧一代股票组合Acc","LU2092937148.SGD":"Blackrock ESG Multi-Asset A8 SGD-H","IE0005OL40V9.USD":"JANUS HENDERSON BALANCED \"A6M\" (USD) INC","IE00BJTD4V19.USD":"NEUBERGER BERMAN US LONG SHORT EQUITY \"A1\" (USD) ACC","SG9999014559.SGD":"United Income Focus Trust Dis SGD","LU2092627202.USD":"Blackrock ESG Multi-Asset A8 USD-H","IE00BFSS7M15.SGD":"Janus Henderson Balanced A Acc SGD-H","LU0203345920.USD":"SCHRODER ISF QEP GLB ACT. VL \"A\" (USD) ACC","LU2077746001.SGD":"Blackrock ESG Multi-Asset A2 SGD-H","SG9999004220.SGD":"Nikko AM Shenton Asia Dividend Equity Fund  SGD","BK4602":"量子计算概念","LU0310800379.SGD":"FTIF - Templeton Global A Acc SGD","LU0724617625.USD":"BGF GLOBAL ALLOCATION \"A4\" (USD) INC","LU2236285917.USD":"ALLIANZ GLOBAL INCOME \"AMG\" (USD) INC","SG9999014567.USD":"UOB UNITED INCOME FOCUS TRUST FUND (USD) ACC","LU0029864427.USD":"TEMPLETON GLOBAL \"A\" (USD) INC","IE00BJLML261.HKD":"HSBC GLOBAL EQUITY INDEX \"HCH\" (HKD) ACC","LU0788109477.HKD":"BGF GLOBAL ALLOCATION \"A2\" (HKDHGD) ACC","LU0210533765.USD":"JPM GLOBAL GROWTH \"A\" (USD) ACC","IE00B3S45H60.SGD":"Neuberger Berman US Multicap Opportunities A Acc SGD-H","LU0316494557.USD":"FRANKLIN GLOBAL FUNDAMENTAL STRATEGIES \"A\" ACC","SG9999015358.SGD":"United Income Focus Trust Dis SGD-H","LU2357125470.USD":"BNP PARIBAS ENERGY TRANSITION \"CLASSIC RH\" (USDHDG) ACC","LU0234570918.USD":"高盛全球核心股票组合Acc Close","LU0079474960.USD":"联博美国增长基金A","LU0820561818.USD":"安联收益及增长平衡基金Cl AM DIS","LU1718418525.SGD":"JPMorgan Investment Funds - Global Select Equity A (acc) SGD","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","LU2286300806.USD":"Allianz Cyber Security AT Acc USD","LU0154236417.USD":"BGF US FLEXIBLE EQUITY \"A2\" ACC","LU0726765562.USD":"JPM GLOBAL INCOME \"A\" (USD HEDGED) INC","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","LU0353189763.USD":"ALLSPRING  US ALL CAP GROWTH FUND \"I\" (USD) ACC","LU2294711713.HKD":"BNP PARIBAS ENERGY TRANSITION \"C\" (HKD) ACC","NVD":"2倍做空NVDA ETF-GraniteShares","LU0320765059.SGD":"FTIF - Franklin US Opportunities A Acc SGD","IE00B7KXQ091.USD":"Janus Henderson Balanced A Inc USD","LU0289739343.SGD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (SGD) ACC","LU2347655073.USD":"JPM GLOBAL INCOME \"A\" (USDHDG) INC A","LU0080751232.USD":"富达环球多元动力基金A","BK4598":"佩洛西持仓","NVDB":"ProShares Ultra NVDA ETF","LU0359201885.HKD":"BGF CHINA \"A2\" (HKD) ACC","LU2023250843.SGD":"Allianz Thematica Cl AT Acc H2-SGD","NVDD":"1倍做空NVDA ETF-Direxion","LU0234572021.USD":"高盛美国核心股票组合Acc","LU0070217475.USD":"JPM GLOBAL SELECT EQUITY \"A\" ACC","BK4567":"ESG概念","LU0957808578.USD":"THREADNEEDLE (LUX) GLOBAL TECHNOLOGY \"ZU\" (USD) ACC","IE000M9KFDE8.USD":"NEUBERGER BERMAN US LARGE CAP VALUE \"A\" (USD) ACC","NVDG":"2倍做多NVDA ETF- Leverage Shares","BK4503":"景林资产持仓","LU1670756490.USD":"ALLIANZ EUROPE INCOME AND GROWTH \"AT\" (USDHDG) ACC","IE00B19Z9505.USD":"美盛-美国大盘成长股A Acc","LU1244550577.SGD":"FTIF - Franklin Global Multi-Asset Income A (Mdis) SGD-H1","03145":"华夏亚洲高息股","NVDL":"2倍做多NVDA ETF-GraniteShares","BK4566":"资本集团","LU1868838027.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"8\" (USD) ACC","IE00BKVL7J92.USD":"Legg Mason ClearBridge - US Equity Sustainability Leaders A Acc USD","SG9999004303.SGD":"Nikko AM Shenton Global Opportunities SGD","NVDO":"2倍上限加速NVDA ETF-Leverage Shares","BK4505":"高瓴资本持仓","LU0006306889.USD":"SCHRODER ISF US LARGE CAP \"A\" (USD) INC AV","LU1868837300.USD":"CT (LUX) I AMERICAN FUND \"9\" (USD) ACC","NVDQ":"2倍做空NVDA ETF-T-Rex","LU0683600562.USD":"AB SELECT US EQUITY \"A\" (USD) ACC","LU1814569148.SGD":"WELLINGTON GLOBAL QUALITY GROWTH \"D\" (SGDHDG) ACC","LU0061474960.USD":"天利环球焦点基金AU Acc","IE00BLSP4239.USD":"Legg Mason ClearBridge - Tactical Dividend Income A Mdis USD Plus","LU1267930573.SGD":"TEMPLETON GLOBAL \"AA\" (SGD) ACC A","NVDS":"1.5倍做空NVDA ETF-Tradr","LU0494093205.USD":"贝莱德ESG灵活多元资产A2 USD-H","LU0965509283.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (SGDHDG) INC","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","LU1691799644.USD":"Amundi Funds Polen Capital Global Growth A2 (C) USD","LU1868837722.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"2\" (USD) ACC","LU1868836914.USD":"CT (LUX) I AMERICAN \"3\" (USD) ACC","NVDU":"2倍做多NVDA ETF-Direxion","LU0640476718.USD":"THREADNEEDLE (LUX) US CONTRARIAN CORE EQ \"AU\" (USD) ACC","LU1868837136.USD":"CT (LUX) I AMERICAN \"8\" (USD) ACC","LU0170899867.USD":"EASTSPRING INVESTMENTS WORLD VALUE EQUITY  \"A\" (USD) ACC","LU2041044095.USD":"Blackrock Circular Economy A2 USD","IE00BFXG0V08.USD":"BNY MELLON GLOBAL LEADERS \"B\" (USD) ACC","NVDW":"NVDA周配息ETF-Roundhill","IE00BHPRN162.USD":"BNY MELLON BLOCKCHAIN INNOVATION \"B\" (USD) ACC","LU1868836591.USD":"CT (LUX) I AMERICAN \"1U\"(USD) ACC","LU2279689827.SGD":"JPMorgan Investment Funds - Global Income Sustainable A (mth) SGD-H","NVDX":"2倍做多NVDA ETF-T-Rex","SG9999014906.USD":"大华全球优质成长基金Acc USD","LU1868836757.USD":"CT (LUX) I AMERICAN FUND \"2\" (USD) ACC","LU2347655156.SGD":"JPMorgan Investment Funds - Global Income A (icdiv) SGD-H","NVDY":"NVDA期权收益策略ETF-YieldMax","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","NVII":"Rex NVDA Growth & Income ETF","IE00BBT3K403.USD":"LEGG MASON CLEARBRIDGE TACTICAL DIVIDEND INCOME \"A(USD) ACC","IE00B775SV38.USD":"NEUBERGER BERMAN US MULTICAP OPPORTUNITIES \"A\" (USD) ACC","LU0889566641.SGD":"FTSF - Templeton Shariah Global Equity A Acc SGD","LU2430703095.HKD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4\" (HKD) INC","LU0053666078.USD":"摩根大通基金-美国股票A（离岸）美元","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU2430703178.SGD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (SGDHDG) INC","BK4592":"伊斯兰概念","LU0211327993.USD":"TEMPLETON GLOBAL EQUITY INCOME \"A\" (USD) ACC","LU1551013425.SGD":"Allianz Income and Growth Cl AMg2 DIS H2-SGD","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0795875169.SGD":"JPMorgan Investment Funds - Global Income A (div) SGD-H","LU1983260115.SGD":"Janus Henderson Horizon Global Sustainable Equity A2 SGD-H","LU0082616367.USD":"摩根大通美国科技A（dist）","LU2430703251.USD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4\" (USD) INC","LU2360108059.USD":"BGF CIRCULAR ECONOMY \"A4\" (USD) INC","LU1035775433.USD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (USD) INC","BK4591":"室温超导概念","IE00BLSP4452.SGD":"Legg Mason ClearBridge - Tactical Dividend Income A Mdis SGD-H Plus","LU2272731782.SGD":"Allianz Global Intelligent Cities AM Dis H2-SGD","LU1023057109.AUD":"BGF CHINA \"A2\" (AUDHDG) ACC","LU0949170772.SGD":"Blackrock Global Equity Income A6 SGD-H","SG9999002232.USD":"Allianz Global High Payout USD","LU1003077747.HKD":"BGF GLOBAL EQUITY INCOME \"A6\" (HKDHDG) INC","LU2272731600.USD":"Allianz Global Intelligent Cities AM Dis USD","LU2087621335.USD":"ALLSPRING GLOBAL FACTOR ENHANCED EQUITY \"A\" (USD) ACC","NVYY":"GraniteShares YieldBOOST NVDA ETF","IE0004091025.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"B\" (USD) ACC","SG9999002224.SGD":"Allianz Global High Payout SGD","LU0417517546.SGD":"Allianz US Equity Cl AT Acc SGD","IE00BJJMRX11.SGD":"Janus Henderson Balanced A Acc SGD","SG9999015341.SGD":"United Income Focus Trust Acc SGD-H","LU1934455863.HKD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (HKD) ACC"},"source_url":"","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1103704030","content_text":"At the International Symposium on Circuits and Systems (ISCAS 2026) held in Shanghai, a premier academic event for global semiconductor scholars, He Tingbo, a Huawei director and President of its Semiconductor Business Unit, delivered a keynote speech titled \"Exploring and Practicing New Semiconductor Paths.\" During this speech, she officially introduced the \"Tau (τ) Law.\"\nThis marks the first time China has proposed new principles guiding industrial development in the global semiconductor field, presenting a comprehensive new theoretical framework for the continuous improvement of chip performance.\nHowever, before discussing what the \"Tau Law\" entails, a fundamental question must be answered: why is a \"new\" law needed at all?\nThis brings us back to a dilemma known to all but understood by few: has Moore's Law truly reached its end?\nWhat conceptual shift does the \"Tau Law\" represent?\nThe issue isn't that Moore's Law itself is \"dead,\" but that its underlying logic of \"geometric scaling\" is hitting physical limits.\nFor over half a century, the semiconductor industry's rule was simple: make transistors smaller, pack more components into the same area, and performance automatically improves, power consumption decreases, and costs are reduced. This logic held for nodes down to several tens of nanometers. However, progressing from tens of nanometers to single-digit nanometers has seen physical challenges and engineering costs increase exponentially.\nSpecifically, as process nodes approach 2nm and 1nm, individual atoms become significant hurdles. Quantum tunneling effects cause disruptive \"leakage,\" where electrons pass through barriers they shouldn't. Controlling current becomes increasingly difficult, making power consumption and heat dissipation major challenges. Factory construction costs soar, with a single 3nm fab now costing at least $20 billion, reducing the number of global players capable of such investment from dozens to just a handful.\nWhile the marginal returns of scaling are diminishing sharply, the demand for computing power from AI, large models, and autonomous driving is growing exponentially. This widening gap is the fundamental problem Huawei's \"Tau Law\" seeks to address.\nHe Tingbo's answer is: stop focusing solely on \"size\" and start focusing on \"time.\"\nThis is the core shift of the \"Tau Law\": replacing \"geometric scaling\" with \"temporal scaling.\"\nThe Four-Level Optimization of the \"Tau Law\"\n\"Temporal scaling\" may sound abstract, but its breakdown is straightforward. In the semiconductor world, a chip's performance and transistor density are ultimately determined by a factor called the \"time constant τ\" (the Greek letter tau, pronounced \"Tao\" in Chinese). It represents the time required for a signal to travel from one point to another within a chip. The faster the signal travels, the shorter its path, and the lower its latency, the more data can be processed per unit time, naturally leading to higher transistor density and performance.\nHistorically, the industry's approach to improving performance was to \"make transistors smaller,\" allowing for denser wiring and shorter signal travel distances. Huawei's approach is different: achieve the same effect by systematically compressing signal propagation delay without significantly shrinking transistor size.\nThis concept is akin to optimizing traffic flow during rush hour. Instead of widening roads (increasing size), the focus is on optimizing traffic lights, implementing tidal flow lanes, and building overpasses or tunnels to streamline traffic, thereby naturally increasing vehicle speed.\nThe core technology enabling this approach for Huawei is \"logic folding.\"\nTraditional chip circuit layouts are two-dimensional, with signals traversing laterally across the plane, spending significant time on interconnects. The essence of logic folding is expanding the circuit layout from a \"single floor\" to \"multiple floors.\" By \"folding\" critical paths that require long horizontal connections and stacking them vertically, the physical distance for signal propagation is dramatically shortened.\nLogic folding is just one key lever within Huawei's multi-level collaborative system. Based on Huawei's previously disclosed technology roadmap, the \"Tau Law\" constructs a four-level optimization system spanning devices, circuits, chips, and systems.\nAt the foundational device level, Huawei optimizes transistor resistance and parasitic capacitance, minimizing the time constant τ from the physical layer to build a solid base.\nAt the circuit level, logic folding technology breaks through the physical boundaries of traditional planar layouts, transforming circuits from single-layer to dual-layer or even multi-layer structures.\nAt the chip level, Huawei introduces full-stack co-design encompassing \"software, architecture, and chip.\" This approach allocates instruction and data flows based on actual workloads, ensuring the chip only computes what is necessary, reducing wasteful overhead, and minimizing end-to-end execution time.\nAt the top system level, Huawei has defined the \"Lingqu Bus,\" re-architecting computing system interconnect protocols to achieve \"super-node unified memory addressing and native memory semantics.\" This allows data exchange between different computing units to proceed with minimal \"congestion.\"\nThese four levels are not optimized in a linear, sequential manner but are interlocked like gears. To use an analogy, the traditional chip optimization path is like desperately piling sports cars onto an increasingly narrow road. The \"Tau Law,\" however, expands the roadmap to a broader dimension: devices, circuits, chips, and systems co-evolve, enabling signals to travel faster and computation to become smarter.\nThe High-End Chip Goals of the \"Tau Law\"\nThe ultimate validation of the \"Tau Law\" lies in its products.\nIn her speech, He Tingbo provided a key figure: over the past six years, Huawei has successfully designed and mass-produced 381 different chips based on this path, covering various fields including communications, computing, terminals, and automotive. This track record forms a significant foundation for the credibility of Huawei's \"Tau Law\" theory.\nWhat truly excites the market is the next-generation Kirin mobile chipset scheduled for release this autumn. According to He Tingbo, this chip will fully adopt logic folding technology, based on a new free logic design concept, expanding from a single layer to a dual layer, achieving a substantial leap in transistor density and system performance.\nHe Tingbo stated: \"We have achieved a series of advancements that would be difficult to attain solely through advanced process technology.\" This suggests Huawei may have successfully navigated a path independent of those taken by Taiwan Semiconductor Manufacturing, Samsung, and Intel.\nShe also revealed a longer-term goal: by 2031, high-end chips based on the \"Tau Law\" will achieve transistor density equivalent to that of a 1.4nm process node. This means Huawei aims to achieve integration density and computing capability on par with 1.4nm process technology through system-level temporal optimization.\nIs this a viable path? He Tingbo's words were: \"Our solution is viable and sustainable. The performance of our new chips can continuously compete with the other path.\"\nNew Technology Waves in the Global Semiconductor Industry\nIf the \"Tau Law\" can be understood as a paradigm shift from \"space\" to \"time,\" then another major trend in the global semiconductor industry is the shift from \"planar\" to \"three-dimensional.\"\nInterestingly, these two trends are converging at the same point in time.\nA wave of technologies represented by advanced packaging, Chiplet heterogeneous integration, and hybrid bonding is reshaping chip performance boundaries at an unprecedented pace and scale. Their core rationale aligns with that of the \"Tau Law\": rather than relying on the infinite scaling of transistors themselves, they drive continuous leaps in system-level performance through smarter integration and interconnection methods.\nFirst, consider advanced packaging. If discussions about \"how many nanometers\" defined the industry for decades, the focus from 2024 to 2026 is rapidly shifting toward advanced packaging. According to Yole Group, the global advanced packaging market is projected to reach approximately $53.1 billion in 2025, with expectations to grow to $79.4 billion by 2030, representing a compound annual growth rate (CAGR) of about 8.4%. More striking is the growth rate of 2.5D/3D packaging, with a CAGR of 37% projected between 2023 and 2029.\nWhy such rapid growth? The reason is straightforward: explosive demand for AI chips. Advanced packaging, exemplified by Taiwan Semiconductor Manufacturing's CoWoS, places GPU cores and high-bandwidth memory (HBM) in close proximity, compressing signal transmission distances from the millimeter to the micrometer scale. This serves as the \"invisible foundation\" for the computing power explosion in the era of large AI models. Data indicates that global capacity for 2.5D and 3D advanced packaging remains insufficient to meet demand, with lead times for some orders exceeding one year and a supply gap estimated at around 23%. Leading global manufacturers are embarking on massive expansion efforts: Taiwan Semiconductor Manufacturing plans to establish seven advanced packaging fabs, aiming to increase annual capacity from 1.3 million wafers to 2 million wafers by 2027, a roughly 53.85% increase.\nNext, consider Chiplets. The logic behind this technology is to break down a large monolithic chip into multiple smaller chiplets, each manufactured using the optimal process node, and then \"bond\" them together via advanced packaging—similar to \"cutting a large chessboard into smaller puzzle pieces and reassembling them.\" Chiplet architecture is already widely deployed in AI chips. For domestic chip manufacturers, this technology holds particular strategic significance: it allows critical core modules to use advanced process nodes while employing mature nodes for non-critical I/O and memory modules. This effectively mitigates limitations in accessing advanced processes, achieving \"system-level performance with finite resources.\"\nIf Chiplets are about \"building blocks,\" then hybrid bonding is the \"glue\" that determines whether these blocks can be stacked stably and densely. The breakthrough of hybrid bonding lies in its elimination of solder bumps, enabling direct copper-to-copper contact at the atomic level for direct bonding between chips. Compared to traditional thermal compression bonding, hybrid bonding can increase interconnect density by one to two orders of magnitude, with extremely low parasitic capacitance, significantly reducing signal delay and power consumption.\nThis technology is viewed by the industry as \"an essential technology roadmap for the next decade in the post-Moore era.\" In terms of practical implementation, memory giants are fully engaged. SK hynix and Samsung are paving the way for next-generation HBM, with hybrid bonding expected to be introduced starting with HBM4. Validation of 16-layer HBM stacked structures is underway. The hybrid bonding equipment market is projected to grow at a CAGR of 69%, far exceeding the overall semiconductor industry growth rate.\nThere is an even more cutting-edge direction: silicon photonics interconnection and co-packaged optics (CPO).\nThe fundamental bottleneck in signal transmission is shifting from within chips to interconnections between chips and even between server racks. Traditional copper interconnects suffer from high loss at high frequencies and limited distance, increasingly struggling to meet the bandwidth demands of large-scale AI clusters. The core idea of silicon photonics is to use light instead of electrical signals for transmission, offering higher speed, lower latency, and significantly reduced power consumption.\nAt a technology forum in May 2026, Taiwan Semiconductor Manufacturing prominently disclosed its \"three-layer cake\" AI platform architecture: the bottom layer is the compute layer, the middle is the packaging integration layer (CoWoS/SoIC), and the top layer is the \"most important for the future\" photonic interconnect layer (COUPE). COUPE technology employs 3D heterogeneous integration to vertically stack electronic and photonic chips, bringing components extremely close together and drastically reducing electrical coupling loss. According to Taiwan Semiconductor Manufacturing, mass production of the world's first 200Gbps micro-ring modulator using COUPE technology has commenced this year, with a bit error rate below one in 100 million. Compared to traditional copper wires, COUPE can improve system energy efficiency by 4 times and reduce latency by 10 times; when deeply integrated with the packaging platform, energy efficiency can improve by up to 10 times, with latency reduced by 20 times.\nGuojin Securities explicitly stated in its latest research report: 2026 marks the first year of CPO industrialization. Core players in the supply chain like Taiwan Semiconductor Manufacturing, NVIDIA, and Broadcom are actively entering the field, signaling the formal commencement of large-scale deployment of \"optics replacing copper\" in AI data centers.\nConclusion\nIn the long term, Huawei's \"Tau Law\" is highly aligned with the direction of the entire industry's technological evolution. Whether termed \"temporal scaling\" or \"advanced packaging,\" the underlying essence reflects a fundamental consensus: improving chip performance can no longer rely solely on \"making transistors smaller.\"\nThe real competition is shifting to a new set of dimensions: interconnect density, signal latency, system synergy, vertical stacking, and optical interconnection. The combinatorial effects of these dimensions are far more complex and expansive than simply shrinking a node. In Huawei's own words, from 2026 to 2035, as numerous exploratory technologies gradually become productized, transistor density will continue to increase, operating frequencies will continue to grow, and a steady stream of high-performance chips will emerge.\nAt the conclusion of her speech, He Tingbo made a meaningful statement: \"The future certainly belongs to open cooperation. On the path of semiconductor evolution, no single enterprise can provide all the answers alone. Under the path of the 'Tau Law,' we look forward to close collaboration with global scientists, engineers, and industry partners to jointly promote the sustainable development of the semiconductor and electronics industries.\"\nThe semiconductor supply chain is too long and complex for any single country or company to dominate all segments. Every link—from semiconductor equipment including lithography machines, to packaging substrate materials, EDA tools, CPO standard systems—requires global collaboration. By proposing the \"Tau Law,\" Huawei is offering the world a compatible, open, and alternative Chinese solution at a critical juncture when the semiconductor industry is searching for new growth curves.","news_type":1,"symbols_score_info":{"07788":1,"NVDA":1,"INTC":1,"NVD3.UK":1,"SNVD.UK":1,"AVGW":1,"AVGG":1,"AVS":1,"NVDQ":1,"03145":1,"AVGU":1,"NVYY":1,"NVDU":1,"AVGX":1,"NVDS":1,"NVII":1,"NVDW":1,"SOX":1,"NVDO":1,"TSMY":1,"NVIW.SI":1,"DIPS":1,"NVDB":1,"AVL":1,"LINT":1,"04335":1,"NVD2.UK":1,"NVDG":1,"TSMU":1,"NVDX":1,"NVD":1,"NVDS.UK":1,"ANV":1,"STSM":1,"TSM":1,"TSMX":1,"NVDY":1,"07388":1,"NVDD":1,"3NVD.UK":1,"AVGO":1,"2NVD.UK":1,"INTW":1,"TSMG":1,"NVDL":1,"TSMZ":1}},"isVote":1,"tweetType":1,"viewCount":75,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9954248472,"gmtCreate":1676428290397,"gmtModify":1676428329558,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"authorIdStr":"4097888403268910","idStr":"4097888403268910"},"themes":[],"title":"","htmlText":"Hmmmm","listText":"Hmmmm","text":"Hmmmm","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":8,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9954248472","repostId":"1100424494","repostType":2,"repost":{"id":"1100424494","kind":"news","pubTimestamp":1676427208,"share":"https://ttm.financial/m/news/1100424494?lang=en_US&edition=fundamental","pubTime":"2023-02-15 10:13","market":"sg","language":"en","title":"Here Are the Winners and Losers From Singapore’s Budget","url":"https://stock-news.laohu8.com/highlight/detail?id=1100424494","media":"Bloomberg","summary":"Increase in handouts is positive for consumer stocks: AletheiaHigher taxes may weigh on property and","content":"<div>\n<p>Increase in handouts is positive for consumer stocks: AletheiaHigher taxes may weigh on property and multinational firmsSingapore’s budget moves to address the city-state’s high cost of living may ...</p>\n\n<a href=\"https://www.bloomberg.com/news/articles/2023-02-14/here-are-the-winners-and-losers-from-singapore-s-budget\">Source Link</a>\n\n</div>\n","source":"lsy1584095487587","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Here Are the Winners and Losers From Singapore’s Budget</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nHere Are the Winners and Losers From Singapore’s Budget\n</h2>\n\n<h4 class=\"meta\">\n\n\n2023-02-15 10:13 GMT+8&nbsp;&nbsp;&nbsp;<a href=https://www.bloomberg.com/news/articles/2023-02-14/here-are-the-winners-and-losers-from-singapore-s-budget><strong>Bloomberg</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>Increase in handouts is positive for consumer stocks: AletheiaHigher taxes may weigh on property and multinational firmsSingapore’s budget moves to address the city-state’s high cost of living may ...</p>\n\n<a href=\"https://www.bloomberg.com/news/articles/2023-02-14/here-are-the-winners-and-losers-from-singapore-s-budget\">Source Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"BSL.SI":"莱佛士医疗","F99.SI":"星狮集团","K71U.SI":"吉宝房地产信托","CHZ.SI":"和乐集团有限公司","OV8.SI":"昇菘","42R.SI":"珍宝餐饮集团","STI.SI":"富时新加坡海峡指数","Q0F.SI":"IHH医疗保健集团"},"source_url":"https://www.bloomberg.com/news/articles/2023-02-14/here-are-the-winners-and-losers-from-singapore-s-budget","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1100424494","content_text":"Increase in handouts is positive for consumer stocks: AletheiaHigher taxes may weigh on property and multinational firmsSingapore’s budget moves to address the city-state’s high cost of living may benefit stocks tied to consumers, while the property sector and multinational corporations may suffer as a result of higher taxation.In his speech on Tuesday, Deputy Prime Minister Lawrence Wong said the government will increase handouts to citizens to help offset the increase in goods and services tax and rising living costs. On the other hand, he raised taxes on higher-value property, multinational corporations, and luxury cars. Nonetheless, the benchmark Straits Times Index closed little changed on the day.“Addressing the cost of living is a major positive for local consumption as inflation is running high,” said Nirgunan Tiruchelvam, an analyst at Aletheia Capital Ltd. “The increase in handouts and the focus on creating job opportunities will aid stocks tied to consumers.”The S$104-billion ($78.4-billion) spending plan is intended to push residents closer to a post-Covid reality while easing near-term cost-of-living pressures.Here are details of what analysts see as the main winners and losers from the budget:WINNERSConsumer StocksSingapore’s plan to increase its handouts to citizens by S$3 billion to S$9.6 billion in the fiscal year starting April, to help offset higher price pressures, will be positive for stocks tied to local consumption.Food and beverage manufacturer Fraser and Neave Ltd., grocer Sheng Siong Group Ltd. and restaurants and food caterers such as Jumbo Group Ltd. and Kimly Ltd. could all benefit. Keppel REIT and other consumption-focused real estate investment trusts may also gain.The moves could also help vulnerable borrowers cope with rising inflation, offsetting potential threats to local banks’ risk profile,” Bloomberg Intelligence analysts Rena Kwok and Sheenu Gupta wrote in a note.Aged CareSingapore’s move to add more resources for lower-income seniors can aid hospital operators such as Raffles Medical Group Ltd. and IHH Healthcare Bhd.Wong plans to top up the ElderCare Fund by S$500 million and the MediFund by S$1.5 billion.ManpowerWong’s plans aimed at turbocharging job opportunities for Singaporeans implies more business for staffing-solutions providers such as HRnetgroup Ltd.The city-state will top up national productivity fund by S$4 billion, develop labor-market intermediaries who can go through industry training and employment facilitation, and extend the Senior Employment Credit and the Part-time Re-employment Grant.HRnetgroup’s shares extended gains after budget announcements to close 2.4% higher.LOSERSPropertySingapore will raise taxes for higher-value properties in an attempt to boost revenue and help fund an array of spending programs.The residential properties in excess of S$1.5 million and up to S$3 million will be taxed one percentage point higher at 5%. Properties in excess of S$3 million will be taxed two percentage points higher at 6%.Stocks to watch include property firms such as City Developments Ltd. and UOL Group Ltd.MultinationalsSingapore intends to set its effective tax rate for multinational enterprises at 15% starting 2025, in line with a global agreement to increase the floor rate. Some world-renowned multinationals with presence in Singapore include Apple Inc., Sony Group Corp. and Amazon.com Inc.Such a move may also weigh on multiple members of the Straits Times Index, if they qualify as multinational corporations under local laws.","news_type":1,"symbols_score_info":{"42R.SI":0.9,"K71U.SI":0.9,"CHZ.SI":0.9,"BSL.SI":0.9,"STI.SI":0.9,"F99.SI":0.9,"Q0F.SI":0.9,"OV8.SI":0.9}},"isVote":1,"tweetType":1,"viewCount":2136,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9080109994,"gmtCreate":1649854013983,"gmtModify":1676534590153,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"authorIdStr":"4097888403268910","idStr":"4097888403268910"},"themes":[],"title":"","htmlText":"#investHonestly I think invest in tech companies is the&nbsp;way to go","listText":"#investHonestly I think invest in tech companies is the&nbsp;way to go","text":"#investHonestly I think invest in tech companies is the way to go","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9080109994","isVote":1,"tweetType":1,"viewCount":3394,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9940638005,"gmtCreate":1677854278408,"gmtModify":1677855055640,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"authorIdStr":"4097888403268910","idStr":"4097888403268910"},"themes":[],"title":"","htmlText":"Nice","listText":"Nice","text":"Nice","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":2,"commentSize":1,"repostSize":0,"link":"https://ttm.financial/post/9940638005","repostId":"1158974451","repostType":2,"repost":{"id":"1158974451","kind":"news","weMediaInfo":{"introduction":"Providing stock market headlines, business news, financials and earnings ","home_visible":1,"media_name":"Tiger Newspress","id":"1079075236","head_image":"https://static.tigerbbs.com/8274c5b9d4c2852bfb1c4d6ce16c68ba"},"pubTimestamp":1677854020,"share":"https://ttm.financial/m/news/1158974451?lang=en_US&edition=fundamental","pubTime":"2023-03-03 22:33","market":"us","language":"en","title":"C3.ai Stock Rallies 15% in Morning Trading As Results Top Guidance","url":"https://stock-news.laohu8.com/highlight/detail?id=1158974451","media":"Tiger Newspress","summary":"C3.ai shares surged over 15% in morning trading as the artificial intelligence software company turn","content":"<html><head></head><body><p><a href=\"https://laohu8.com/S/AI\">C3.ai</a> shares surged over 15% in morning trading as the artificial intelligence software company turned in a better-than-expected fiscal third-quarter report and suggested the more business strength is in the works.</p><p><img src=\"https://static.tigerbbs.com/b24a00b697fb27556a9800c00fa0edc0\" tg-width=\"824\" tg-height=\"687\" width=\"100%\" height=\"auto\"/></p><p><a href=\"https://laohu8.com/S/AI\">C3.ai</a> said that for the quarter ending January 31, it lost 6 cents a share, excluding one-time items, on revenue of $66.7M, compared to a loss of 7 cents a share, on $69.8M in sales in the same period a year ago.</p><p>Sales from subscriptions totaled $57M.</p><p>The company&#39;s results beat the estimates of Wall Street analysts, who had forecast C3.ai (AI) to lose 22 cents a share, on $64.25M in revenue.</p><p>Chief Executive Thomas Siebel said the company&#39;s results shows &#34;the overall business sentiment appears to be improving&#34; and C3.ai (AI) is seeing &#34;a dramatic change from what we experienced&#34; in the middle of 2022.</p><p>For its fiscal fourth-quarter, C3.ai (AI) estimates revenue will be in a range of $70M to $72M.</p><p>The AI market has been the source of widespread attention and investments by some of the world&#39;s biggest tech companies of late. On Thursday, Apple (AAPL) reportedly blocked an update to an email app that uses AI technology due to concerns about improper content reaching young children.</p></body></html>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>C3.ai Stock Rallies 15% in Morning Trading As Results Top Guidance</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nC3.ai Stock Rallies 15% in Morning Trading As Results Top Guidance\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1079075236\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/8274c5b9d4c2852bfb1c4d6ce16c68ba);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Tiger Newspress </p>\n<p class=\"h-time\">2023-03-03 22:33</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html><head></head><body><p><a href=\"https://laohu8.com/S/AI\">C3.ai</a> shares surged over 15% in morning trading as the artificial intelligence software company turned in a better-than-expected fiscal third-quarter report and suggested the more business strength is in the works.</p><p><img src=\"https://static.tigerbbs.com/b24a00b697fb27556a9800c00fa0edc0\" tg-width=\"824\" tg-height=\"687\" width=\"100%\" height=\"auto\"/></p><p><a href=\"https://laohu8.com/S/AI\">C3.ai</a> said that for the quarter ending January 31, it lost 6 cents a share, excluding one-time items, on revenue of $66.7M, compared to a loss of 7 cents a share, on $69.8M in sales in the same period a year ago.</p><p>Sales from subscriptions totaled $57M.</p><p>The company&#39;s results beat the estimates of Wall Street analysts, who had forecast C3.ai (AI) to lose 22 cents a share, on $64.25M in revenue.</p><p>Chief Executive Thomas Siebel said the company&#39;s results shows &#34;the overall business sentiment appears to be improving&#34; and C3.ai (AI) is seeing &#34;a dramatic change from what we experienced&#34; in the middle of 2022.</p><p>For its fiscal fourth-quarter, C3.ai (AI) estimates revenue will be in a range of $70M to $72M.</p><p>The AI market has been the source of widespread attention and investments by some of the world&#39;s biggest tech companies of late. On Thursday, Apple (AAPL) reportedly blocked an update to an email app that uses AI technology due to concerns about improper content reaching young children.</p></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"AI":"C3.ai, Inc."},"source_url":"","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1158974451","content_text":"C3.ai shares surged over 15% in morning trading as the artificial intelligence software company turned in a better-than-expected fiscal third-quarter report and suggested the more business strength is in the works.C3.ai said that for the quarter ending January 31, it lost 6 cents a share, excluding one-time items, on revenue of $66.7M, compared to a loss of 7 cents a share, on $69.8M in sales in the same period a year ago.Sales from subscriptions totaled $57M.The company's results beat the estimates of Wall Street analysts, who had forecast C3.ai (AI) to lose 22 cents a share, on $64.25M in revenue.Chief Executive Thomas Siebel said the company's results shows \"the overall business sentiment appears to be improving\" and C3.ai (AI) is seeing \"a dramatic change from what we experienced\" in the middle of 2022.For its fiscal fourth-quarter, C3.ai (AI) estimates revenue will be in a range of $70M to $72M.The AI market has been the source of widespread attention and investments by some of the world's biggest tech companies of late. On Thursday, Apple (AAPL) reportedly blocked an update to an email app that uses AI technology due to concerns about improper content reaching young children.","news_type":1,"symbols_score_info":{"AI":0.9}},"isVote":1,"tweetType":1,"viewCount":3318,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":453765832237912,"gmtCreate":1751805052346,"gmtModify":1751805056258,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"authorIdStr":"4097888403268910","idStr":"4097888403268910"},"themes":[],"title":"","htmlText":"Let’s hope our nation continue to progress and be inclusive to all","listText":"Let’s hope our nation continue to progress and be inclusive to all","text":"Let’s hope our nation continue to progress and be inclusive to all","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/453765832237912","isVote":1,"tweetType":1,"viewCount":1362,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9946686685,"gmtCreate":1680941717847,"gmtModify":1680941724856,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"authorIdStr":"4097888403268910","idStr":"4097888403268910"},"themes":[],"title":"","htmlText":"Way to goooooooo. Awesome&nbsp;","listText":"Way to goooooooo. Awesome&nbsp;","text":"Way to goooooooo. Awesome","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9946686685","isVote":1,"tweetType":1,"viewCount":2301,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9946708423,"gmtCreate":1681046129163,"gmtModify":1681046132749,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"authorIdStr":"4097888403268910","idStr":"4097888403268910"},"themes":[],"title":"","htmlText":"More such games pls!!!! More fun&nbsp;","listText":"More such games pls!!!! More fun&nbsp;","text":"More such games pls!!!! More fun","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9946708423","isVote":1,"tweetType":1,"viewCount":2167,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9948182442,"gmtCreate":1680651548087,"gmtModify":1680651552837,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"authorIdStr":"4097888403268910","idStr":"4097888403268910"},"themes":[],"title":"","htmlText":"I believe that given the world is shortage of food. #beyondmeat is one area that we can lookat for alternatives. Just a thought","listText":"I believe that given the world is shortage of food. #beyondmeat is one area that we can lookat for alternatives. Just a thought","text":"I believe that given the world is shortage of food. #beyondmeat is one area that we can lookat for alternatives. Just a thought","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9948182442","isVote":1,"tweetType":1,"viewCount":2122,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0},{"id":9955423244,"gmtCreate":1675690417089,"gmtModify":1675691344396,"author":{"id":"4097888403268910","authorId":"4097888403268910","name":"Hikaruno","avatar":"https://community-static.tradeup.com/news/65170c2f9a9929532935679cc1c4a2ee","crmLevel":12,"crmLevelSwitch":0,"followedFlag":false,"authorIdStr":"4097888403268910","idStr":"4097888403268910"},"themes":[],"title":"","htmlText":"<a href=\"https://ttm.financial/S/BK4587\">$ChatGPT(BK4587)$&nbsp;</a> Following on this, seems like a potential&nbsp;","listText":"<a href=\"https://ttm.financial/S/BK4587\">$ChatGPT(BK4587)$&nbsp;</a> Following on this, seems like a potential&nbsp;","text":"$ChatGPT(BK4587)$ Following on this, seems like a potential","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/9955423244","isVote":1,"tweetType":1,"viewCount":2246,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"EN","totalScore":0}],"lives":[]}