Co-Packaged Optics could have its $NVIDIA(NVDA)$ GTC moment next week as AI data centers run into a bandwidth wall that traditional pluggables are struggling to solve.
CPO helps address that by bringing optics closer to the chip, improving speed & efficiency as AI clusters scale. The supply chain behind it looks like this:
• $Corning(GLW)$ the glass & fiber backbone the entire optical stack runs through
• $Credo Technology Group Holding Ltd(CRDO)$ , $Broadcom(AVGO)$ , $Marvell Technology(MRVL)$ the DSP chips that process & clean high-speed signals
• $Lumentum(LITE)$ , $COHERENT(COHR)$ , $Applied Optoelectronics(AAOI)$ the optical modules & lasers that generate & transmit light at the physical layer
• $AXT Inc(AXTI)$ the specialty materials behind the compound semiconductors used in laser sources
• $Taiwan Semiconductor Manufacturing(TSM)$ , $Intel(INTC)$, $GLOBALFOUNDRIES Inc.(GFS)$, $Tower Semiconductor(TSEM)$the packaging layer where optics & silicon are co-integrated & where manufacturing gets hardest
• $Ciena(CIEN)$ , $Cisco(CSCO)$ the networking systems layer that routes optical signals across data centers & wide-area networks
• $Fabrinet(FN)$ the precision assembly layer that turns packaged components into deployable modules
• $MACOM Technology Solutions Holdings, Inc.(MTSI)$, $Broadcom(AVGO)$, $Intel(INTC)$ the translation layer between compute & photons
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