Market Chatter: Huawei to Start Manufacturing 1.4-NM Chips by 2031 in Race with TSMC

MT Newswires Live05-25 16:13

Huawei will start manufacturing its 1.4-nanometer chips by 2031, helping shorten its gap with industry leader Taiwan Semiconductor Manufacturing (TPE:2330), Bloomberg reported Monday.

The Chinese technology company, together with partner Semiconductor Manufacturing International (HKG:0981, SHA:688981), will start making the chips by 2031 using its "LogicFolding" technology, the report said, citing Huawei's semiconductor chief He Tingbo.

Huawei will first apply the "LogicFolding" technology on its Kirin chips, set for launch this fall, Bloomberg reported.

TSMC will begin mass-producing the same product in 2028, Bloomberg said.

"This year we have prepared a surprise for the whole industry. Not saturation, not continuation, but a big leap ahead," Bloomberg quoted He Tingbo as saying.

(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. Accuracy is not guaranteed.)

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