Following HBM, SOCAMM2 chips may emerge as the next star in the memory sector. According to reports, NVIDIA is procuring approximately 20 billion GB of SOCAMM2 chips from the global DRAM industry, with three key suppliers identified. Samsung Electronics has secured half of NVIDIA's SOCAMM2 chip orders for 2026, amounting to around 10 billion GB. SK Hynix is expected to supply 6–7 billion GB, while Micron will provide the remainder.
SOCAMM technology is positioned as a next-generation high-bandwidth, low-power memory solution for AI servers. Designed to deliver performance comparable to HBM (High Bandwidth Memory) while significantly reducing costs, it combines LPDRAM with Compressed Attached Memory Modules (CAMM) to offer superior performance and energy efficiency in a revolutionary form factor. Compared to traditional DDR5 RDIMM configurations, SOCAMM saves space and reduces power consumption by one-third.
Notably, SOCAMM and HBM are not direct competitors but complementary solutions—SOCAMM addresses flexibility, while HBM meets extreme performance demands through advanced GPU integration. Looking ahead, SOCAMM2 is highly likely to support the next-generation low-power memory standard, LPDDR6.
However, SOCAMM2’s full potential depends on deep integration with AI server ecosystems. On the hardware side, motherboard designs, CPU and memory controller compatibility, and cooling system layouts must align with SOCAMM2’s specifications. On the software side, optimizations in operating systems, AI frameworks, and drivers are critical for performance.
With the explosive growth of AI applications, demand for high-bandwidth, low-latency memory has surged, exposing the limitations of traditional DDR memory in handling rapid data processing. While HBM excels in performance, its high cost and limited production capacity hinder widespread adoption. SOCAMM2, leveraging LPDDR technology, bridges this gap by offering near-HBM performance at a more accessible cost.
Among the three major SOCAMM2 suppliers, Samsung—having secured the largest share of orders—could strengthen its position in the memory market through both HBM and SOCAMM2. Samsung has already completed internal testing for HBM4, and if key clients like NVIDIA approve its quality certification this month, mass production of HBM4 could commence shortly.
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