On March 26, Apple announced a $400 million investment to be deployed by 2030, partnering with four companies—Bosch, Cirrus Logic, TDK, and Qnity Electronics—to produce critical materials and components in the United States for its global products. This initiative is part of Apple’s broader $600 billion American Manufacturing and Innovation Plan (AMP), a four-year commitment to bolster U.S. manufacturing and innovation.
The AMP program, originally announced by CEO Tim Cook and former President Donald Trump at the White House in August 2025, forms the core of Apple’s $600 billion investment pledge. Apple currently supports more than 450,000 jobs across all 50 U.S. states and plans to hire an additional 20,000 employees directly over the next four years, particularly in research and development and chip engineering.
Under the new agreements, TDK—a partner of over 30 years—will for the first time manufacture sensors in the U.S., including components for iPhone camera stabilization. Bosch will produce integrated circuits used in Apple’s crash detection and activity tracking features at TSMC’s Washington state facility. Cirrus Logic is collaborating with GlobalFoundries to develop mixed-signal semiconductors that power Face ID at a New York wafer fab. Qnity Electronics will focus on key semiconductor materials and technologies, while TSMC’s Arizona fab and GlobalFoundries will serve as foundries for chip production.
Apple CEO Tim Cook described the collaboration as “another powerful example of what can be achieved by investing in American manufacturing,” emphasizing the company’s strong confidence in U.S. innovation. Apple stated that the initiative will not only create new jobs but also strengthen America’s capabilities in semiconductors and advanced electronics manufacturing.
Since the launch of AMP, Apple has exceeded its initial targets and expects to source more than 100 million advanced chips from TSMC’s Arizona facility by 2026. In a related move, Apple announced in February that it will begin U.S. production of the Mac mini later this year at its Houston campus, where AI server manufacturing has already started ahead of schedule. The new production line will double the size of the facility.
Other suppliers, including Amkor, GlobalWafers, and Corning, have also established U.S. production capacities to provide Apple with semiconductor packaging, silicon wafers, and device cover glass, among other components.
Comments